MEIG SLM550 Leitfaden
MeiG_SLM550_Hardware Design Manual
MeiG Smart Technology Co., Ltd 1/89
MeiG SLM550
Hardware Design Manual
Released Date: 2022/07/20
Version Number: V1.02
MeiG_SLM550_Hardware Design Manual
MeiG Smart Technology Co., Ltd
Important Notice
Copyright Notice
All rights reserved. MeiG Smart Technology Co., Ltd
This manual and all its contents are owned by MeiG Smart Technology Co., Ltd and
protected by Chinese laws and relevant copyright laws in applicable international
conventions. Without the written authorization of MeiG Smart Technology Co., Ltd, no one
may copy, disseminate, distribute, modify or use part or all of this manual in any form, and
the offenders will be held responsible according to law.
Statement of No Guarantee
MeiG Smart Technology Co., Ltd makes no representations or guarantees, either express
or implied, for any contents in this document, and assumes no responsibility for the
merchantability and fitness for a particular purpose or any indirect, extraordinary or
consequential losses.
Confidentiality Claim
The information contained in this document (including any annexes) is confidential. The
recipient understands that the document obtained by him is confidential and shall not be
used for any purpose other than the stated purpose, and he shall not disclose this
document to any third party.
Disclaimer
The company assumes no responsibility for property damage or personal injury caused by
customers’ improper operation. Customers are requested to develop corresponding
products according to the technical specifications and reference designs in the manual.
Before the disclaimer, the company has the right to change the contents of this manual
according to the needs of technological development, and the version is subject to change
without further notice.
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Revision History
Revision Date Description
V1.00 2021-04-01 First edition
V1.01 2021-05-24
1. Module pin distribution diagram
2. The capacity of TF card is modified to support 256GB at most.
3. Update the pin characteristics table
V1.02 2022-07-20
1. Add multiplexing function Table 43.
2. Update microphone receiving circuit Figure 26.
3. BAT_THERM Pull-down resistor correct to 47K
4. Update Table 6.
5. Update Figure 1, Figure 2, Figure 3.
6. MIPI impedance requirements 85 +/-15Ω.
7. Add FCC Statement.
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SLM550 Hardware Design Guide_V1.02
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Foreword
Thank you for using the SLM550 module from Meg Smart. This product can provide data
communication services. Please read the user manual carefully before use, you will appreciate its
perfect function and simple operation method.
The company does not assume responsibility for property damage or personal injury caused by
improper operation of the user. Users are requested to develop the corresponding products according
to the technical specifications and reference designs in the manual. Also pay attention to the general
safety issues that mobile products should focus on.
Before the announcement, the company has the right to modify the contents of this manual according to
the needs of technological development.
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FCC Statement
Changes or modifications not expressly approved by the party responsible for compliance could void
the user's authority to operate the equipment.
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designtion. This equipment generates uses and
can radiate radio frequency energy and, if not installed and used in accordance with the instructions,
may cause harmful interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this equipment does cause harmful interference
to radio or television reception, which can be determined by turning the equipment off and on, the user
is encouraged to try to correct the interference by one or more of the following measures:
-- Reorient or relocate the receiving antenna.
-- Increase the separation between the equipment and receiver.
-- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-- Consult the dealer or an experienced radio/TV technician for help
This device complies with part 15 of the FCC rules. Opject to the following two conditions (1)this device
may not cause harmful interference, and (2) this device must accept any interference received, including
interference that may cause undesired operation.
FCC standards:
Antenna Gain:BT/2.4G Wifi 2.2dBi, 5G wifi 2.52dBi, GSM/GPRS/EGPRS 850: 3.52dBi, GSM/GPRS/
EGPRS 1900: 3.58dBi, WCDMA Band V: 3.52dBi, WCDMA Band II: 3.58dBi, LTE Band 2: 3.58dBi, LTE
Band 4: 4.00dBi, LTE Band 5: 3.52dBi, LTE Band 7: 5.19dBi, LTE Band 12: 3.65dBi, LTE Band 13:
3.81dBi, LTE Band 17: 3.65dBi, LTE Band 25: 3.58dBi, LTE Band 26-1: 3.52dBi, LTE Band 26-2:
3.52dBi, LTE Band 66: 4.00dBi
RF Exposure Compliance:
This equipment should be installed and operated with a minimum distance of 20cm between the
radiator and any part of your body. This module is installed on the host equipment and requires a
Permissive Class II Change test if the exposure conditions change.
OEM INTEGRATION INSTRUCTIONS:
This device is intended only for OEM integrator under the following conditions:
The module must be installed in the host equipment such that 20 cm is maintained between the antenna
and users, and the transmitter module may not be co-located with any other transmitter. The module
shall be only used with the antenna that has been originally tested and certified with this module. As
long as these 3 conditions above are met, further transmitter test will not be required.
However, the OEM integrator is still responsible for testing their end-product for any additional
compliance requirements required with this module installed. The end-product may need Verification
testing, Declaration of Conformity testing, a Permissive Class II Change or new Certification. Please
involve a FCC certification specialist in order to determine what will be exactly applicable for the end-
product.
In the event that these conditions cannot be met, then the FCC authorization for this module in
combination with the host equipment is no longer considered valid and the FCC ID of the module
cannot be used on the final product. In these circumstances, the OEM integrator will be
responsible for re-evaluating the end product (including the transmitter) and obtaining a separate
FCC authorization. In such cases, please involve a FCC certification specialist in order to
determine if a Permissive Class II Change or new Certification is required.
Upgrade Firmware:
The software provided for firmware upgrade will not be capable to affect any RF parameters as
certified for he FCC for this module, in order to prevent compliance issues.
End product labeling:
This transmitter module is authorized only for use in device where the antenna may be installed
such that 20 cm may be maintained between the antenna and users. The final end product must
be labeled in a visible area with the following: “Contains 2APJ4-SLM550”
Information that must be placed in the end user manual:
The OEM integrator has to be aware not to provide information to the end user regarding how to
install or remove this RF module in the user's manual of the end product which integrates this
module. The end user manual shall include all required regulatory information/warning as show in
this manual.
When the module is installed inside another device, the user manual of the host must contain
below warning statements:
1. This device complies with part 15 of the FCC Rules. Operation is subject to the following two
conditions:
(1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause
undesired
Any company of the host device which installs this modular with unlimited modular approval should
perform the test of radiated & conducted emission and spurious emission, etc. according to FCC
CFR Title 47 Part 15 Subpart C Section 1R Title 47 Part 15 Subpart E Section15.407: 2016 and
FCC CFR Title 47 Part 2/ FCC CFR Title 47 Part22/ FCC CFR Title 47 Part24/ FCC CFR Title 47
Part27/ FCC CFR Title 47 Part90 and FCC Part 15B requirement, only if the tests result comply
with standards requirement, then the host can be sole legally.
Canada Statement
This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the
following two conditions:
(1) This device may not cause interference; and
(2) This device must accept any interference, including interference that may cause undesired
operation of the device.
Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio
exempts de licence. L’exploitation est autorisée aux deux conditions suivantes :
(1) l’appareil ne doit pas produire de brouillage;
(2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le
brouillage est susceptible d’en compromettre le fonctionnement.
Please notice that if the ISED certification number is not visible when the module is installed
inside another device, then the outside of the device into which the module is installed must also
display a label referring to the enclosed module. This exterior label can use wording such as the
following: “Contains IC:23860-SLM550” any similar wording that expresses the same meaning
may be used.
l'appareil hôte doit porter une étiquette donnant le numéro de certification du module d'Industrie
Canada, précédé des mots " Contient un module d'émission ", du mot IC:23860-SLM550 ou
d'une formulation similaire exprimant le même sens, comme suit
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This equipment should be installed and operated with a minimum distance of 40centimeters
between the radiator and your body. This module is installed on the host equipment and
requires a Permissive Class II Change test if the exposure conditions change.
Cet équipementdevrait être installé et actionné avec une distance minimum de 40 centimètres
entre le radiateur et votre corps. Ce module est installé sur l'équipement hôte et nécessite un
test de changement permissif de classe II si les conditions d'exposition changent.
The device for operation in the band 5150-5250 MHz is only for indoor use to reduce the
potential for harmful interference to co-channel mobile satellite systems
for devices with detachable antenna(s), the maximum antenna gain permitted for devices in
the band 5725-5850 MHz shall be such that the equipment still complies with the e.i.r.p. limits
as appropriate;
Les dispositifs fonctionnant dans la bande 5150-5250 MHz sont réservés uniquement pour
une utilisation à l’intérieur afin de réduire les risques de brouillage préjudiciable aux systèmes
de satellites mobiles utilisant les mêmes canaux;
pour les dispositifs munis d'antennes amovibles, le gain maximal d'antenne permis (pour les
dispositifs utilisant la bande de 5 725 à 5 850 MHz) doit être conforme à la limite de la p.i.r.e.
spécifiée, selon le cas;
Frequency bands 5470-5600 MHz and 5650-5725 MHz
Until further notice, devices subject to thissectionshall not be capable of transmitting in the
band 5600-5650 MHz. This restriction is for the protection of Environment Canada’s weather
radars operatingin this band.
Bandes 5470-5600MHz et 5650-5725MHz
Jusqu'à nouvel ordre, les équipements visés par la présente section ne peuvent pas être
transférés sur la bande de 5 600 à 5 650 MHz, afin de protéger l'environnement des radars
météorologiques exploités par le Canada surcette bande.
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Contents
Important Notice ....................................................................................................................................... 1
Revision History ....................................................................................................................................... 2
SLM550 Hardware Design Guide_V1.02................................................................................................. 3
Contents .................................................................................................................................................... 6
1 Introduction.......................................................................................................................................... 8
2 Module overview ................................................................................................................................. 9
2.1 Summary of features ................................................................................................................... 9
2.2 Block diagram ........................................................................................................................... 11
3 Module Package ................................................................................................................................ 13
3.1 Pin distribution diagram ............................................................................................................ 13
3.2 Pin definitions ............................................................................................................................ 14
3.3 Mechanical Dimensions ............................................................................................................ 34
4 Interface application ......................................................................................................................... 36
4.1 Power Supply ............................................................................................................................ 36
4.1.1 Power Pin........................................................................................................................ 37
4.2 Power on and off ....................................................................................................................... 37
4.2.1 Module Boot .................................................................................................................... 37
4.2.2 Module Shutdown ........................................................................................................... 39
4.2.3 Module Reset .................................................................................................................. 39
4.3 VCOIN Power ............................................................................................................................ 40
4.4 Power Output ............................................................................................................................ 41
4.5 Serial Port ................................................................................................................................. 42
4.6 MIPI Interface ............................................................................................................................ 44
4.6.1 LCD Interface .................................................................................................................. 44
4.6.2 MIPI Camera Interface .................................................................................................. 46
4.7 Capacitive Touch Interface ........................................................................................................ 50
4.8 Audio Interface .......................................................................................................................... 51
4.8.1 Receiver Interface Circuit ............................................................................................... 52
4.8.2 Microphone receiving Circuit .......................................................................................... 52
4.8.3 Headphone Interface Circuit ........................................................................................... 52
4.8.4 LINE OUT Circuit ............................................................................................................ 53
4.8.5 I2S Interface ................................................................................................................... 53
4.9 USB Interface ............................................................................................................................ 54
4.9.1 USB OTG ........................................................................................................................ 56
4.10 Charging Interface ................................................................................................................... 56
4.10.1 Charging Detection ....................................................................................................... 57
4.10.2 Charge Control ............................................................................................................. 57
4.10.3 BAT_CON_TEM ........................................................................................................... 57
4.11 UIM Card Interface ................................................................................................................... 58
4.12 SD Card Interface .................................................................................................................... 59
4.13 I2C Bus Interface ..................................................................................................................... 59
4.14 Analog to Digital Converter (ADC) ........................................................................................... 60
4.15 PWM......................................................................................................................................... 60
4.16 Motor ........................................................................................................................................ 61
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4.17 Antenna Interface..................................................................................................................... 61
4.17.1 Main Antenna................................................................................................................. 61
4.17.2 DRX Antenna ................................................................................................................. 62
4.17.3 GPS Antenna ................................................................................................................. 63
4.17.4 Wi-Fi/BT antenna........................................................................................................... 63
5 PCB Layout ........................................................................................................................................ 65
5.1 Module PIN distribution............................................................................................................. 65
5.2 PCB Layout Principles .............................................................................................................. 65
5.2.1 Antenna........................................................................................................................... 65
5.2.2 Power Supply.................................................................................................................. 66
5.2.3 SIM Card......................................................................................................................... 66
5.2.4 MIPI.................................................................................................................................66
5.2.5 USB.................................................................................................................................67
5.2.6 Audio............................................................................................................................... 67
5.2.7 Safety clearance............................................................................................................. 68
6 Electrical, Reliability ......................................................................................................................... 69
6.1 Absolute Maximum.................................................................................................................... 69
6.2 Working Temperature................................................................................................................ 69
6.3 Working Voltage........................................................................................................................ 69
6.4 Digital Interface Features.......................................................................................................... 70
6.5 SIM_VDD Characteristics ......................................................................................................... 70
6.6 PWRKEY Feature ..................................................................................................................... 70
6.7 VCOIN Feature ......................................................................................................................... 71
6.8 Current Consumption (VBAT = 3.8V)........................................................................................ 71
6.9 Electrostatic Protection ............................................................................................................. 72
6.10 Module Operating Frequency Band......................................................................................... 72
6.11 RF Characteristics.................................................................................................................... 73
6.12 Module Conduction Receiving Sensitivity................................................................................ 74
6.13 WIFI Main RF Performance ..................................................................................................... 76
6.14 BT Main RF Prformance .......................................................................................................... 77
6.15 GNSS Main RF Performance .................................................................................................. 77
7 Production.......................................................................................................................................... 78
7.1 Top And Bottom Views Of The Module ..................................................................................... 78
7.2 Recommended Soldering Furnace Temperature Curve........................................................... 79
7.3 Humidity Sensitivity (MSL)........................................................................................................ 79
7.4 Baking Requirements................................................................................................................ 80
8 Support Peripheral Device List........................................................................................................ 81
9 Appendix ............................................................................................................................................ 83
9.1 Related Documents .................................................................................................................. 83
9.2 Terms and Explanations............................................................................................................ 83
9.3 Multiplexing function ................................................................................................................. 85
9.4 Safety Warning.......................................................................................................................... 87
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