MPL PIP4x Bedienungsanleitung

PACKED INDUSTRIAL PC with 8th and 9th Generation INTEL CORE and XEON E

Processor amilies

The PIP4x is a low power, high performance and rugged industrial embedded computer. It can be operated in

standard or even in harsh environment. The PIP4x has been designed for 24/7 operation and uses extended

lifec cle series processors. It can be used for an PC application where a complete solution is needed. The

Open-Frame variant is particularl suitable during the customer evaluation phase or for seamless integration

into customers project. The PIP4x offers up to 3 displa s simultaneousl , USB and legac I/O, NVMe mass

storage, PCI Express x16 (Gen3), ECC protected s stem memor , TPM 2.0 and Intel AMT support.

Furthermore, various extensions can be provided, such as MXM graphic cards, serial buses and even

customized circuits. The PIP4x has the option to be batter powered to prevent power failures in safet -relevant

environments or working as a mobile device.

eatures:

●8th and 9th Gen. Intel Coffee Lake H & HR SKU

●25W and 45W CPU (cTDP, Configurable TDP)

●Intel HD Graphics 630

●Up to 64 GB DDR4 ECC RAM

●CM246 Chipset

●TPM2.0

●iAMT12

●1x Gigabit Ethernet

●Displa port & DVI-D

●8x USB 3.1 Ports and 4x USB2.0 Header

●4x RS-232 or RS-485 Isolated (optional)

●PCIe/104

●m.2 Ke -A (PCIe / USB2.0)

●m.2 Ke -B (USB3.0 / SATA / PCIe / Dual SIM)

●m.2 Ke -M (NVMe x4 / SATA)

●2x mPCIe/mSATA (SIM Card Header)

●2x SATA Ports

●HW Watchdog

●Intel HD Audio, SD-Card, SPI and I2C Header

●PCIe and Displa Header (eDP)

●Load Dump and Reverse Polarit Protection

●Ignition and Power Button Input

2023 b MPL AG 1 MEH-1088-001 Rev. D

PIP4x

User Manual

TABLE O  CONTENTS
INTRODUCTION............................................................................................................5
1  ABOUT THIS MANUAL........................................................................................................5
2  SA ETY PRECAUTIONS AND HANDLING.........................................................................5
3  ELECTROSTATIC DISCHARGE (ESD) PROTECTION.......................................................5
4  EQUIPMENT SA ETY..........................................................................................................5
5  MANUAL REVISIONS...........................................................................................................6
5.1  RELATED PRODUCTS.................................................................................................6
5.2  REVISION HISTORY....................................................................................................6
6  RELATED DOCUMENTATION.............................................................................................6
7  ORDERING IN ORMATION.................................................................................................7
7.1  Mainboards.................................................................................................................... 7
7.2  Housing Options............................................................................................................ 8
SPECI ICATION............................................................................................................9
1  ELECTRICAL........................................................................................................................ 9
1.1  Processor...................................................................................................................... 9
1.2  BIOS.............................................................................................................................. 9
1.3  Memor .......................................................................................................................... 9
1.4  Graphics........................................................................................................................ 9
1.5  Mass Storage................................................................................................................ 9
1.6  Intel AMT (onl  supported b  XEON and i7)..................................................................9
1.7  EC (Embedded Controller)............................................................................................9
1.8  Ethernet....................................................................................................................... 10
1.9  Indicators..................................................................................................................... 10
1.10  TPM 2.0..................................................................................................................... 10
1.11  Ignition and Power Button Signal...............................................................................10
1.12  Serial Ports (Optional Modules).................................................................................10
1.13  Interfaces................................................................................................................... 10
2  PHYSICAL.......................................................................................................................... 11
3  POWER............................................................................................................................... 12
3.1  POWER INPUT........................................................................................................... 12
3.2  Internal 12V Buck-Boost Converter (Peripheral Power, CPU, Chipset).......................12
3.3  POWER DISSIPATION............................................................................................... 12
4  ENVIRONMENTAL CONDITIONS...................................................................................... 12
HARDWARE RE ERENCE.........................................................................................13
1  PIP4x................................................................................................................................... 13
2  PIP4x-xHx (Header Version).............................................................................................15
3  PIP4xS (Short Version)......................................................................................................16
4   PIP4xS-xHx (Short Header Version)................................................................................18
5  Connector Description...................................................................................................... 19
5.1  Power Connector (J3).................................................................................................. 19
5.2  Alternative Power Connector (J1/J2 (horizontal/vertical))............................................19
5.3  12V Peripheral (J34).................................................................................................... 19
5.4  USB 3.1 (J17, J22, J85, J86).......................................................................................19
5.5  LAN (J28).................................................................................................................... 19
5.6  Other Interfaces........................................................................................................... 20
5.7  Serial1-4 LVTTL Connector (J23, J25, J29, J30).........................................................20
5.8   USB2.0 Header Connectors (J37, J31, J92, J39, *J19, *J21, *J24, *J26, *J86, *J87,
*J90, *J91)............................................................................................................................. 20
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5.9  High Definition Audio (J71)..........................................................................................21
5.10  SERLED MKII (J14)...................................................................................................21
5.11  EC GPIO (J63).......................................................................................................... 21
5.12  SATA Power Connector (J84)...................................................................................22
5.13  Mainboard Settings Jumper (S5)...............................................................................22
5.14  Alternative Power Input Connector / Smart Batter  Interface (J11)...........................22
5.15  Power Button / Ignition# Signal Connector (J5).........................................................23
5.16  External RTC Backup Batter  Connector (J6)...........................................................23
5.17  SD Card Header (J41)............................................................................................... 23
5.18  Chipset GPIO (J40)................................................................................................... 23
5.19  Chipset GSPI0 (J42)..................................................................................................24
5.20  Chipset UART2 Debug (J16).....................................................................................24
5.21  Embedded Controller UART Debug and Backlight Control(J15)...............................25
5.22  Chipset I2C0 (J43)..................................................................................................... 25
5.23  SIM Card Header (J7, J8, J9, J33)............................................................................25
5.24  LPC Header (J73)...................................................................................................... 25
5.25  BIOS SPI Programming Header (J76).......................................................................26
5.26  PCIe Hub (J57).......................................................................................................... 26
5.27  eDP Connector (J44)................................................................................................. 26
5.28  POWER LED............................................................................................................. 27
5.29  ACTIVITY LED.......................................................................................................... 27
5.30  LAN LED.................................................................................................................... 27
5.31  BOOT LED................................................................................................................ 27
5.32  FAN Connector (J10).................................................................................................27
THEORY O  OPERATION...........................................................................................28
1  BLOCK DIAGRAM.............................................................................................................. 28
1.1  Power Input Protection Circuit.....................................................................................28
1.2  Power Up Behavior...................................................................................................... 28
2  Power States...................................................................................................................... 29
2.1  S0................................................................................................................................ 29
2.2  S4 Hibernate and S5 Soft Off / Standb ......................................................................29
2.3  DS5 Deep Sleep.......................................................................................................... 29
3  RTC Battery........................................................................................................................ 29
4  CPU  AN............................................................................................................................. 29
SO TWARE.................................................................................................................30
1  BIOS.................................................................................................................................... 30
2  DEVICE AND I/O SUPPORT  OR OSes............................................................................30
3  DEVICE DRIVERS.............................................................................................................. 30
COPYRIGHT................................................................................................................30
DISCLAIMER...............................................................................................................30
TRADEMARKS............................................................................................................30
SUPPORT....................................................................................................................30
1   AQs................................................................................................................................... 30
2  SERIAL NUMBER AND REVISION.................................................................................... 30
3  CONTACT MPL AG............................................................................................................ 30
2023 b  MPL AG 3 MEH-1088-001 Rev. D
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TABLE O IGURES

Figure 1: Power Connector (Phoenix Contact AG, PSC 1,5/3-M-PE)..................................................................18

Figure 2: Power Connector (Connector: Phoenix Contact AG, MC1,5/4GF-3,81)...............................................18

Figure 3: Samtec, IPL1-102-02-S-D..................................................................................................................... 18

Figure 4: Molex, 501331-1207............................................................................................................................. 19

Figure 5: Molex 501331-0407.............................................................................................................................. 19

Figure 6: Molex, 501331-1207............................................................................................................................. 20

Figure 7: Molex, 501331-0707............................................................................................................................. 20

Figure 8: Molex, 501331-1107............................................................................................................................. 20

Figure 9: Samtec, IPL1-105-02-S-D..................................................................................................................... 20

Figure 10: Jumper................................................................................................................................................ 21

Figure 11: Samtec SQW-110-01-L-D-VS-A......................................................................................................... 21

Figure 12: Molex 501331-0307............................................................................................................................ 21

Figure 13: Molex 501331-0307............................................................................................................................ 21

Figure 14: Molex, 501331-1307........................................................................................................................... 22

Figure 15: Molex, 501331-1107........................................................................................................................... 22

Figure 16: Molex, 501331-0607........................................................................................................................... 22

Figure 17: Molex, 501331-0707........................................................................................................................... 22

Figure 18: Molex, 501331-0707........................................................................................................................... 23

Figure 19: Molex, 501331-0507........................................................................................................................... 23

Figure 20: Molex, 501331-0607........................................................................................................................... 23

Figure 21: 1.27mm FTS-108-DV.......................................................................................................................... 23

Figure 22: 1.27mm FTS-104-DV.......................................................................................................................... 24

Figure 23: Samtec, QSE20.................................................................................................................................. 24

Figure 24: Samtec, QSE20.................................................................................................................................. 24

Figure 25: Molex, 501331-0507........................................................................................................................... 25

Figure 26: Block diagram..................................................................................................................................... 26

2023 b MPL AG 4 MEH-1088-001 Rev. D

High-Tech • Made in Switzerland

PIP4x

User Manual

1 INTRODUCTION

1.1 ABOUT THIS MANUAL

This manual and the appropriate PIP4x BIOS User Manual provides all the information necessar to handle and

configure the PIP4x.

This manual is written for advanced technical personnel responsible for integrating the PIP4x into their

s stems.

1.2 SA ETY PRECAUTIONS AND HANDLING

For personal safet and safe operation of the PIP4x, follow all safet procedures described here and in other

sections of the manual.

●Remove power from the s stem before installing (or removing) the PIP4x, to prevent the possibilit of

personal injur (electrical shock) and / or damage to the product.

●Handle the product carefull ; i.e. dropping or mishandling the PIP4x can cause damage to assemblies and

components.

●Do not expose the equipment to moisture.

1.3 ELECTROSTATIC DISCHARGE (ESD) PROTECTION

Various electrical components within the product are sensitive to static and electrostatic discharge (ESD). Do

not touch an electronic components unless ou are in a ESD safe environment.

1.4 EQUIPMENT SA ETY

Care is taken b MPL AG that all its products are tested before leaving the factor to ensure that the are full

operational and conform to specification. However, no matter how reliable a product, there is alwa s the

possibilit that a defect ma occur. The occurrence of a defect on this device ma , under certain conditions,

cause a defect to occur in adjoining and / or connected equipment. It is our responsibilit to protect such

equipment when installing this device. MPL disclaims all liability for damage on third party devices.

2023 b MPL AG 5 MEH-1088-001 Rev. D

High-Tech • Made in Switzerland

PIP4x

User Manual

1.5 MANUAL REVISIONS

1.5.1 RELATED PRODUCTS

Revision Related To

All •PIP4x famil products

1.5.2 REVISION HISTORY

Revision Date Description

A 2019-11-27 First release of this document.

B 2020-02-12 Fixed Pinout Description: 3.5.15 Power Button / Ignition# Signal Connector (J5)

C 2020-04-17 3.4 PIP4xS-xHx (Short Header Version) Diagramm (J170/J220)

D 2020-09-17 AWG16 wire, added PIP44RL power ponsumption

1.6 RELATED DOCUMENTATION

The following documents are related to this manual. For detailed Information about a specific PIP4x setting or

feature please refer to this additional manuals or data sheets.

Reference Description Available from

[1] PIP4x BIOS User Manual MPL AG: to be released

[2] SERIF-ISO User Manual MPL AG: http://www.mpl.ch/t6000.html

[3] PCI Express Base Specification 1.0a PCI-SIG: www.pcisig.com

[4] PCI Express Mini Card Electromechanical

Specification 1.2

PCI-SIG: www.pcisig.com

2023 b MPL AG 6 MEH-1088-001 Rev. D

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PIP4x

User Manual

1.7 ORDERING IN ORMATION

The table below gives an overview of the different PIP4x variants and its features. All versions are ROHS

compliant.

1.7.1 Mainboards

Product Name Product eatures

PIP41R

(264mm Board)

PIP41RS

(218mm Board, no

mPCIe/mSATA)

•Intel Processor G4930E

•35W CPU

•2 Cores

•6MB Cache

•Passmark ~2570

•ECC Support for S stem Memor DDR4

PIP44RL

(264mm Board)

PIP44RLS

(218mm Board, no

mPCIe/mSATA)

•Intel Processor i3-9100HL

•25W CPU

•4 Cores

•6MB Cache

•Passmark ~6354

•ECC Support for S stem Memor DDR4

PIP46

(264mm Board)

PIP46S

(218mm Board, no

mPCIe/mSATA)

•Intel Processor i7-8850HE

•45W CPU

•6 Cores

•9MB Cache

•Passmark ~12800

•Intel AMT Support (Active Management Technolog )

PIP46R

(264mm Board)

PIP46RS

(218mm Board, no

mPCIe/mSATA)

•Intel Processor i7-9850HE

•45W CPU

•6 Cores

•9MB Cache

•Passmark ~13200

•Intel AMT Support (Active Management Technolog )

PIP49R

(264mm Board)

PIP49RS

(218mm Board, no

mPCIe/mSATA)

•Intel Processor E-2276ME

•45W CPU

•6 Cores

•12MB Cache

•Passmark ~13700

•Intel AMT Support (Active Management Technolog )

•ECC Support for S stem Memor DDR4

PIP4x-x •Custom Assembl for series with 100 pieces and more

•Please contact MPL AG for further information

2023 b MPL AG 7 MEH-1088-001 Rev. D

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1.7.2 Housing Options

Housing Name Picture

Open rame

Standard

AN option with

venting openings

on the sides

MIL

2023 b MPL AG 8 MEH-1088-001 Rev. D

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2 SPECI ICATION

This chapter provides an overview of the PIP4x product and its features

2.1 ELECTRICAL

2.1.1 Processor

•Intel Coffee Lake H and Coffee Lake H Refresh CPU

•Intel Long Life C cle Program (15Y)

•Up to 8 Cores

•Up to 5 GHz

•Up to 16MB Cache

•Up to 45W

•XEON, i9, i7, i5, i3, Pentium and Celeron Processors

•Intel Turbo Boost Technolog 2.0

•cTDP, Configurable TDP

2.1.2 BIOS

•Customizable b MPL

2.1.3 Memory

•2x SO-DIMM 260 DDR4

•Up to 2666 MT/s

•Up to 64GB (2x 32GB)

•ECC (onl supported b XEON and i3 Processors)

2.1.4 Graphics

•Intel HD Graphics 630 (XEON: Intel HD Graphics P630)

•Direct X12, OpenGL 4.6, OpenCL 2.6, Vulkan 1.1.103

•Hardware Video Decode Acceleration MPEG-2 (H.262), MPEG-4 AVC (H.264), JPEG/MJPEG, HEVC

(H.265), VC-1, VP8, VP9

2.1.5 Mass Storage

•2x SATA 6Gb/s (~600MB/s)

•2x mSATA 6Gb/s (~600MB/s)

•m.2 Ke -B SATA 6Gb/s (~600MB/s)

•m.2 Ke -M PCIe x4 (~3500 MB/s) / SATA 6Gb/s (~600MB/s)

2.1.6 Intel AMT (only supported by XEON and i7)

•Remote maintanance and administration over LAN-Interface

•Power ON/OFF

•Serial over LAN-Interface

•Remote Desktop (even in BIOS/UEFI)

•Firmware Update

•Remotel OS Installation

2.1.7 EC (Embedded Controller)

•Voltage and CPU Temperature Supervisor

•Smart Batter Support

•FAN Controller

•Eas in Field Firmware Updates

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2.1.8 Ethernet

•Intel i219-LM 1Gb/s Ethernet Connection on RJ45

•Optional 2-8 additional Intel i210 1Gb/s Ethernet Controller (9.5KB Jumbo Frame support)

2.1.9 Indicators

•Power LED

•Activit LED (HDD / mPCIe / m.2)

•LAN LED (Speed / Activit )

2.1.10 TPM 2.0

•Infineon SLB9670

•Certification CC EAL4+, FIPS 140-2 level 2

•As mmetric Cr ptograph ECC, ECC BN-256, ECC NIST P-256, ECC256, ECDH, RSA1024, RSA2048

•S mmetric Cr ptograph AES, HMAC, SHA-1, SHA-256

2.1.11 Ignition and Power Button Signal

•Combined Signal, one Pin

•Power Button Signal (active if pulled low)

•Ignition Signal (active if pushed high)

2.1.12 Serial Ports (Optional Modules)

•XR28V384 (V384) Quad Universal As nchronous Receiver and Transmitter (UART)

•Integrated Hardware Watchdog

•16550 UART compatible

•128 B te FIFO

•Up to 115.2 kBaud

•Automatic RS485 direction control (RS-485/RS-422)

•Up to 4 galvanic isolated SERIF-ISO Modules

•SERIF1-ISO (RS-232) TX, RX, RTS, CTS

•SERIF2-ISO (RS-485) RX+/- (RS-485)

2.1.13 Interfaces

•m.2 Ke -A (PCIe x1, USB2.0)

•2x mPCIe (PCIe x1, USB2.0)

•PCIe/104 (PEG x16, PCIe 4x, USB2.0)

•USB2.0

•SPI

•I2C

•PCIe 4x

•eDP

•DP

•SD-Card Header

•HD Audio Header

•12V Header

•SerLED MKII Header

•Smart Batter Header

2023 b MPL AG 10 MEH-1088-001 Rev. D

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