Omron B3SN-3012 Bedienungsanleitung

Tactile Switch (Sealed SMD Type) B3SN

Designed as Surface-mounting Device

(SMD) Meeting High-density Mounting

Requirements

SMD

actile Switch ideal for high-density mounting.

Compact and more than 1 mm thinner than

conventional tactile switches.

Available with ground terminals for protection

against static electricity.

Sealed construction conforming to IP64 (IEC-529)

provides high reliability in dusty or humid

environments.

Ordering Information

Model Number Legend:

B3SN-jjjjj

12345

1. Height

3: 3.1

2. Ground terminal

Without ground terminal

With ground terminal

3. Sealing

IP64 (IEC529)

4. Operating force (OF)

1.57 N {160 gf}

Shipment package

None: Bag

Embossed tape

List of Models

Type Bags Embossed

tape (see note)

ithout ground terminal

B3SN-3012 B3SN-3012P

ith ground terminal

B3SN-3112 B3SN-3112P

Note:

Switches on embossed tape must be ordered in units of 3,000 pieces.

For details on packing, refer to

Switch Pacing

on page

17.

Specifications

Ratings/Characteristics

Switching

capacity

1 to 30 mA, 5 to 24 VDC (resistive load)

Contact configuration

SPST-NO

Contact resistance

100 m

Ω

max. (initial value) (rated: 1 mA, 5 VDC)

Insulation resistance

100 M

Ω

min. (at 250 VDC)

Dielectric strength

250 V

AC, 50/60 Hz for 1 min

Bounce time

5 ms max.

ibration resistance

Malfunction: 10 to 55 Hz, 1.5-mm double amplitude

Shock resistance

Destruction: 1,000 m/s

{approx. 100G} max.

Life expectancy

100,000 operations min.

Ambient temperature

Operating: –25

C to 70

C (with no icing)

Ambient humidity

Operating: 35% to 85%

Weight

Approx. 0.2 g

B3SN B3SN

Engineering Data

Operating Force vs. Stroke (Typical)

Stroke

S (mm)

Operating force (N {gf})

1.96 {200}

1.47 {150}

0.98 {100}

0.49 {50}

Nomenclature Film

Push

button

Cover

Terminals

Plunger

Contact dome

Fixed contact

Base

B3SN B3SN

Dimensions

Note: 1.

All units are in millimeters unless otherwise indicated.

2. No

terminal numbers are indicated on

the Switches. The numbers used for terminals in the following graphics are indicated in the

“Bottom

iew” diagram below

. In this diagram, the Switch is rotated so that the terminals

are on the right and left-hand sides, and the

OMRON

logo appears the right way up.

(Bottom V

iew)

Without Ground Terminal

B3SN-3012

B3SN-3012P

With Ground Terminal

B3SN-3112

B3SN-3112P

PCB

Mounting

op V

iew) T

erminal Arrangement

/Internal Connections

op V

iew)

9.5

2.6 5.4

3 dia.

1.2 0.7

6.5

(4.6)

7±0.5

4±0.2

9.5

2.6 5.4

1.4

3 dia.

(4.6)

1.2

6.5

0.70.7

7±0.5

4±0.2

3.4±0.2

PCB

Mounting

op V

iew) T

erminal Arrangement

/Internal Connections

op V

iew)

3.1+0.3

0.1

Operating Characteristics

Operating force (OF) 1.57±

0.49 N {160

50 gf} max.

Releasing force (RF)

0.29 N {30 gf} min.

Pretravel (PT) 0.25±

0.15 mm

Precautions

Soldering

not apply flow

soldering, otherwise fragments of solder and flux

may

have a bad influence on the operation of the pushbutton.

Apply reflow soldering according to the optimum heating curve

shown below. Reflow soldering equipment may have a high peak

value.

Be sure to conduct a test before use.

Soldering

may be

repeated only once at a minimum interval of five

minutes

if the Switch is not soldered properly

Note: The above heating curve applies if the

thickness

of the circuit board is 1.6 mm.

emperature ( C)

Room

temperature

ime (s)

to 90 s

20 max.

10 max.

Preheating

B3SN B3SN

Do not apply additional force to the plunger once it has stopped

moving.

Do not repeatedly press the plunger off-center or from an acute

angle.

Cleaning

B3SN

Switches are designed to allow submersed cleaning after sol

dering.

When cleaning, follow the guidelines given as follows:

1. Clean

with alcohol solvents. Do not use chlorine solvents

water.

2. When using ultrasonic cleaning in two- or three-tank

systems,

do not clean for more than one minute at a time or for

than three minutes total.

Do not apply external force to the Switch while cleaning.

4. Do

not clean immediately after

soldering. Allow components

stand for at least three minutes before

cleaning if possible.

5. The Switch cannot be used where subject to direct contact

with

water

Switch Packing

Switches

are packed on tape as shown below

(18) Label Tape drawing direction

Reel

Tape drawing direction

5.5

(3.6)

13 dia. 380±2 dia.

1.75±0.1

8±0.1

4±0.1

12±0.3

1.5+0.1

0 dia.

Package 3,000 Switches

Heat resistance

50°

C for 24 hours (not to be deformed)

Note: The

ground terminals of the Switches are on the guide hole

side

of the package.

ALL DIMENSIONS SHOWN ARE IN MILLIMETERS.

convert millimeters into inches, multiply by 0.03937. T

o convert grams into ounces, multiply by 0.03527.

Cat. No. C096-E1-2A

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