Panasonic DMP-BD60GN Bedienungsanleitung

©Panasonic Corporation 2009.

Unauthorized copying and distribution is a violation

of law.

ORDER NO.CHM0903012CE

Blu-ray Disc Player

Model No. DMP-BD60GN

DMP-BD60GA

DMP-BD60GZ

DMP-BD60GC

DMP-BD60PU

DMP-BD80GN

Vol. 2

Colour

(K).......................Black Type

TABLE OF CONTENTS PAGE PAGE

1 Safety Precautions -----------------------------------------------3

1.1. General guidelines-----------------------------------------3

2Warning--------------------------------------------------------------4

2.1. Prevention of Electrostatic Discharge (ESD)

to Electrostatic Sensitive (ES) Devices---------------4

2.2. Service caution based on legal restrictions----------5

3 Service Navigation------------------------------------------------6

3.1. Caution when Replacing EEPROM or

DIGITAL P.C.B. ---------------------------------------------6

4 Specifications------------------------------------------------------7

5 Service Mode-------------------------------------------------------9

5.1. Self-Diagnosis and Special Mode Setting------------9

6 Service Fixture & Tools ---------------------------------------18

7 Measurements and Adjustments --------------------------19

7.1. Service Positions-----------------------------------------19

7.2. Adjustment of BDP/Digital P.C.B. Module----------20

1 Safety Precautions

1.1. General guidelines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

1.1.1. Leakage current cold check

1. Unplug the AC cord and connect a jumper between the

two prongs on the plug.

2. Measure the resistance value, with an ohmmeter,

between the jumpered AC plug and each exposed metal-

lic cabinet part on the equipment such as screwheads,

connectors, control shafts, etc. When the exposed metal-

lic part has a return path to the chassis, the reading

should be between 1MΩand 5.2MΩ.

When the exposed metal does not have a return path to

the chassis, the reading must be .

1.1.2. Leakage current hot check

(See Figure 1.)

1. Plug the AC cord directly into the AC outlet. Do not use

an isolation transformer for this check.

2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a

0.15μF capacitors, between each exposed metallic part

on the set and a good earth ground such as a water pipe,

as shown in Figure 1.

3. Use an AC voltmeter, with 1000 ohms/volt or more sensi-

tivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the volt-

age at each point.

5. Reverse the AC plug in the AC outlet and repeat each of

the above measurements.

6. The potential at any point should not exceed 0.75 volts

RMS. A leakage current tester (Simpson Model 229 or

equivalent) may be used to make the hot checks, leakage

current must not exceed 1/2 milliampere. In case a mea-

surement is outside of the limits specified, there is a pos-

sibility of a shock hazard, and the equipment should be

repaired and rechecked before it is returned to the cus-

tomer.

Figure 1

2Warning

2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive

(ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-

trostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistor-sand semi-

conductor chip components. The following techniques should be used to help reduce the incidence of component damage caused

by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,

which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-

num foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as anti-static (ESD protected) can

generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-

ble conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the

brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient

to damage an ES device).

2.2. Service caution based on legal restrictions

2.2.1. General description about Lead Free Solder (PbF)

The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this

equipment in considering the globally environmental conservation.

The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin

(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86°F) more than that

of the normal solder.

Definition of PCB Lead Free Solder being used

Service caution for repair work using Lead Free Solder (PbF)

• The lead free solder has to be used when repairing the equipment for which the lead free solder is used.

(Definition: The letter of PbF is printed on the PCB using the lead free solder.)

• To put lead free solder, it should be well molten and mixed with the original lead free solder.

• Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.

• Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt the

lead free solder.

• Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30 degrees

C (662±86°F).

Recommended Lead Free Solder (Service Parts Route.)

• The following 3 types of lead free solder are available through the service parts route.

RFKZ03D01KS-----------(0.3mm 100g Reel)

RFKZ06D01KS-----------(0.6mm 100g Reel)

RFKZ10D01KS-----------(1.0mm 100g Reel)

Note

* Ingredient: tin (Sn), 96.5%, silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%

The letter of PbF is printed either foil side or components side on the PCB using the lead free solder.

(See right figure)

3 Service Navigation

3.1. Caution when Replacing EEPROM or DIGITAL P.C.B.

When replacing EEPROM (IC51601) or DIGITAL P.C.B. only, change the destination as following the steps below mentioned.

1. Select the destination and Model No. from the latest version of “DIGA Repair Support Navi PAL”.

2. Select “Serial Remote” function.

After performing above steps, update to the latest firmware.

4 Specifications

5 Service Mode

5.1. Self-Diagnosis and Special Mode Setting

5.1.1. Self-Diagnosis Functions

Self-Diagnosis Function provides information for errors to service personnel by Self-Diagnosis Display when any error has

occurred.

U**, H** and F** are stored in memory and held.

You can check latest error code by transmitting [0] [1] of Remote Controller in Service Mode.

Automatic Display on FL will be cancelled when the power is turned off or AC input is turned off during self-diagnosis display is ON.

Error Code Diagnosis contents Description Monitor Display Automatic FL display

U30 Remote control code error Display appears when main unit and remote

controller codes are not matched. No display

*is remote controller code of the

main unit.

Display for 5 seconds.

U59 Abnormal inner temperature

detected Display appears when the drive temperature

exceeds 70°C.

The power is turned off forcibly.

For 30 minutes after this, all key entries are

disabled. (Fan motor operates at the highest

speed for the first 5 minutes. For the remain-

ing 25 minutes, fan motor is also stopped.)

The event is saved in memory as well.

No display

U59 is displayed for 30 minutes.

U71 HDMI incompatible error

(HDCP incompatible) Display this error when the equipment (com-

patible with DVI such as TV, amplifier etc.)

connected to the unit by HDMI is incompatible

with HDCP.

*HDCP = High-bandwidth Digital Content Pro-

tection

No display

U72 HDMI connection error

(communication error) This error is displayed when there are any

communication problems with the unit and the

equipments (TV, amplifier etc.) connected to

the unit by HDMI. (or when there is a problem

with the HDMI cable)

No display

U72 display disappears when

error has been solved by Power

OFF/ON of connecting equipment

or by inserting/removing of HDMI

cable.

U73 HDMI connection error

(authentication error) when authentication error occurs while the

equipments (TV, amplifier etc.) are connected

by HDMI. (or when there is a problem with the

HDMI cable)

No display

U73 display disappears when

error has been solved by Power

OFF/ON of connecting equipment

or by inserting/removing of HDMI

cable.

F99 Hang-up Displayed when communication error has

occurred between Main microprocessor and

Timer microprocessor.

No display

Displayed is left until the [POWER]

key is pressed.

H19 02 Inoperative fan motor When inoperative fan motor is detected after

powered on, the power is turned off

automatically.

The event is saved in memory.

No display No display

F00 No error information Initial setting for error code in memory

(Error code Initialization is possible with error

code initialization and main unit initialization.)

No display No display

F34 Initialization error When initialization error is detected after

starting up main microprocessor, the power is

turned off automatically.

The event is saved in memory.

No display No display

F58 Drive hardware error When drive unit error is detected, the event is

saved in memory. No display No display

5.1.2. Special Modes Setting

UNSUP-

PORT Unsupported disc error *An unsupported format disc was played,

although the drive starts normally.

*The data format is not supported, although

the media type is supported.

*Exceptionally in case of the disc is dirty.

This disc is

incompatible. Display for 5 seconds.

The character indication flows

sideways.

NO READ Disc read error *A disc is flawed or dirty.

*A poor quality failed to start.

*The track information could not be read.

Cannot read.

Please check the

disc.

HARD

ERR Drive error The drive detected a hard error. DVD drive error. Display for 5 seconds.

The character indication flows

sideways.

SELF

CHECK Restoration operation Since the power cord fell out during a power

failure or operation, it is under restoration

operation.

*It will OK, if a display disappears automati-

cally. If a display does not disappear, there is

the possibility that defective Digital P.C.B. /

BDP drive.

No display

The character indication flows

sideways.

PLEASE

WAIT Unit is in termination process Unit is in termination process now.

BYE is displayed and power will be turned off. No display

The character indication flows

sideways.

UNFOR-

MAT Unformatted disc error You have inserted an unformatted BD-RE/

BD-R/DVD-RAM/DVD-RW or raw +R/+R DL,

or DVD-RW of DVD-Video format.

This disc is not for-

matted properly.

Cannot be played.

The character indication flows

sideways.

No PLAY When there is a viewing restric-

tion on a BD-Video or DVD-

Video.

Rating password is set. No display

Item FL display Key operation

Mode name Description Front Key

Rating password The audiovisual level setting password is ini-

tialized to Level 8.Open the tray, and press [SKIP REV

(Remote Controller)] and [PLAY]

simultaneously for 5 seconds.

Service Mode Setting every kind of modes for servicing.

*Details are described in 5.1.3. Service Mode

at a glance.

When the power is off, press

[PAUSE], [PLAY] and [SETUP

(Remote Controller)] keys simulta-

neously for 5 seconds.

BD-ROM history cleaning < Persistent Storage> of BD-ROM standard is

cleaned.

Screen display: [The history has been

cleared] is displayed for five seconds. Same display as before execution.

When the power is on, disc is not in

tray, press [STOP] and [POWER

(Remote Controller)] keys simulta-

neously for 5 seconds.

Forced disc eject Removing a disc that cannot be ejected.

The tray will open and unit will shift to P-off

mode.

While Demonstration Lock is being set, this

Forced disc eject function is not accepted.

The display before execution

leaves. When the power is off, press

[PAUSE] and [OPEN/CLOSE] keys

simultaneously for 5 seconds.

NTSC/PAL system select To switch PAL/NTSC alternately. The display before execution

leaves. When the power is on (SS mode),

press [STOP] and [OPEN/CLOSE]

simultaneously for 5 seconds.

Forced power-off When the power button is not effective while

power is ON, turn off the power forcibly. Display in P-off mode. Press [POWER] key over than 4

seconds.

Error Code Diagnosis contents Description Monitor Display Automatic FL display

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