Panasonic AG-DVC30P Bedienungsanleitung

ORDERNO. BSD04030090

D21

Digital VideoCameraRecorder/ XLRMicrophoneAdapter

AG-DVC30P/ AG-DVC30E/ AG-DVC32EN/ AG-DVC33MC/

AG-MYA30G

Please refer to theOperating Instructionsin theappendix

folder. / (Go to Appendix List)

SAFETYPRECAUTIONS

GENERALGUIDELINES

1. Whenservicing, observetheoriginal leaddress. Ifashort/ circuit

isfound, replace all parts, whichhavebeenover-heatedor

damagedbytheshortcircuit.

2. Afterservicing, see toitthat all theprotectivedevices suchas

insulation barriers, insulation papersshieldsareproperly

installed.

3. Afterservicing, make thefollowing leakagecurrentchecks to

preventthecustomerfrom being exposedtoshock hazards.

LEAKAGECURRENTCOLD CHECK

1. Unplug theACcord and connect ajumperbetweenthetwo

prongson theplug.

2. Measuretheresistance value, withanohm meter, betweenthe

jumperedACplug and eachexposedmetalliccabinet parton the

equipmentsuchas screwheads, connectors, control shafts, etc.

Theresistance valuemust bemorethan5M .

Figure1

LEAKAGECURRENTHOTCHECK (See Figure 1)

1. Plug theACcord directlyintotheACoutlet. / Donotuse an

isolation transformerfor thischeck.

2. Connect a1.5k , 10Wresistor, inparallel witha0.15 F

capacitor, betweeneachexposedmetallicparton theset ana

good earthground suchas awaterpipe, as showninFigure1.

3. Use anACvoltmeter, with1000 ohms/voltor moresensitivity, to

measurethepotential across theresistor.

4. Check eachexposedmetallicpart, and measurethevoltageat

eachpoint.

5. Reverses theACplug intheACoutlet repeat eachoftheabove

measurements.

6. Thepotential at anypointshouldnotexceed0.15 volts RMS. A

leakagecurrenttester(Simpson Model 229 equivalent) maybe

usedtomake thehotchecks, leakagecurrentmust notexceed

0.1milliamp. Incase ameasurementisoutsideofthelimits

specified, thereisapossibilityofashock hazard, and the

equipmentshouldberepairedand recheckedbeforeitisreturned

tothecustomer.

ABOUTLEAD FREE SOLDER (PbF)

Distinction of Pbf PCB:

PCBs (manufactured) using leadfree solderwill have a PbF indication on the PCB.

Caution:

1. Pbfree solderhas ahighermelting pointthanstandard solder;

Typicallythemelting pointis50-70°F(30-40°C) higher. Please use

ahigh temperaturesoldering iron. Incase ofthesoldering iron

withtemperaturecontrol, please set itto700±20°F(370±10°C).

2. Pbfree solderwill tend tosplashwhenheatedtoo high (about

1100°F/600°C).

ELECTROSTATICALLYSENSITIVE (ES)DEVICES

Some semiconductor(solidstate)devices canbe damagedeasilybystatic electricity. Such

components commonlyare calledElectrostaticallysensitive (ED)Devices. Examples of typical

ES devices are integratedcircuits and some field-effecttransistors and semiconductor“chip”

components. The following techniques shouldbe usedto helpreduce the incidence of

component damage causedbystatic electricity.

1. Immediatelybeforehandling anysemiconductor componentor

semiconductor-equippedassembly, drainoff anyelectrostatic

chargeon your bodybytouching aknownearthground. /

Alternatively, obtainand wearacommerciallyavailable

discharging wrist trapdevice, whichshouldberemovedfor

potential shock reasonsprior toapplying powertotheunitunder

test.

2. Afterremoving anelectrical assemblyequippedwithES devices,

place theassemblyon aconductivesurface suchas aluminum

foil, topreventelectrostaticchargebuildup or exposureofthe

assembly.

3. Use onlyagroundedtipsoldering iron tosolderor unsolderES

devices.

4. Use onlyananti-staticsolderremoval device classifiedas “anti-

static”cangenerate electrical charges sufficienttodamageES

devices.

5. Donotuse freon-propelledchemicals. These cangenerate

electrical charges sufficienttodamageES devices.

6. DonotremoveareplacementES device from its protective

packageuntil immediatelybeforeyou arereadytoinstall it. /

(most replacementES devices arepackagewithleadselectrically

shortedtogetherbyconductivefoam, aluminum foil or

comparableconductivematerial).

7. Immediatelybeforeremoving theprotectivematerial from the

leadsofareplacementES device, touchtheprotectivematerial to

thechassisor circuitassemblyintowhichthedevice will be

installed. / CAUTION:Besureno powerisappliedtothechassis

or circuit, and observeall othersafetyprecautions.

8. Minimizebodilymotionswhenhandling unpackedreplacement

ES devices. (Otherwise hamless motion suchas thebrushing

togetherofyour clothes fabricor thelifting ofyour footfrom a

carpetedfloor cangenerate staticelectricitysufficienttodamage

anES device).

X-RADIATION

WARNING

1. Thepotential source ofX-radiation inEVFsets istheHigh Voltage

section and thepicturetube.

2. Whenusing apicturetubetest jigfor service, ensurethat jigis

capableofhandling 10kV withoutcausing X-Radiation.

Note :

Itis important to use anaccurate periodicallycalibratedhigh voltage meter.

3. MeasuretheHigh Voltage. Themeter(electrictype) reading

shouldindicate 2.5kV, ±0.15kV. Ifthemeterindication isoutof

tolerance, immediate service and correction isrequiredtoprevent

thepossibilityofprematurecomponentfailure. TopreventanX-

Radiation possibility, itisessential touse thespecifiedpicture

tube.

1. Service Information

2. DisassemblyProcedures

3. Mechanical Adjustment

4. Electrical Adjustment

5. Block Diagrams

6. SchematicDiagrams

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