Panasonic DMR-EH50P Bedienungsanleitung

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DMR-EH50P

DMR-EH50PC

Vol. 1

Colour

(S).......... .............S ilver Type

DVD Video Recorder

ORDER NO.DSD0503038C1

B24

DMR -EH50 P / DMR -EH50 PC

1 Specifications 4

2 Safety precautions 5

2.1. General guidelines 5

2.2. Caution for fuse replacement 5

3 Prevention of Electrostatic Discharge (ESD) to Electrostatic

Sensitive (ES) Devices 6

4 Precaution of Laser Diode 7

5 How to replace the Lithium Battery 8

6 Handling the Lead-free Solder 8

6.1. About lead free solder (PbF) 8

7 Each Button 9

8 New Feature 11

8.1. Quick start function(REC) 11

9 Taking out the Disc from RAM-Drive Unit when the Disc

cannot be ejected by OPEN/CLOSE button 12

9.1. Forcible Disc Eject 12

9.2. When the Forcible Disc Eject can not be done. 12

10 Service Explorer 13

11 Self-Diagnosis and Special Mode Setting 16

11.1. Self-Diagnosis Functions 16

11.2. Special Modes Setting 17

11.3. Service Modes 19

12 Assembling and Disassembling 23

12.1. Disassembly Flow Chart 23

12.2. P.C.B. Positions 23

12.3. Top Cover 24

12.4. Front Panel 24

12.5. SD Card P.C.B. 24

12.6. Digital P.C.B. 24

12.7. DVD-RAM Drive 25

12.8. HDD 25

12.9. LED P.C.B. 26

12.10. Power P.C.B. 26

12.11. Rear Panel 27

12.12. Front (L) P.C.B. 27

12.13. Main P.C.B. 28

13 Service Fixture and Tools 29

14 Service Positions 29

14.1. Checking and Repairing of Power P.C.B. 29

14.2. Checking and Repairing of Digital P.C.B. 30

14.3. Checking and Repairing of Main P.C.B. 31

14.4. Checking and Repairing of DVD-RAM Drive 33

14.5. Checking and Repairing of HDD 34

15 Caution after replacing parts 35

15.1. After replacing the RAM Drive with new one 35

15.2. When the unit does not operate normally after replacing

the Timer Microprocessor or Main P.C.B. 35

16 Standard Inspection Specifications after Making Repairs 35

17 Voltage and Waveform Chart 36

17.1. Power P.C.B. 36

17.2. Main P.C.B. 36

17.3. Tuner P.C.B. 38

17.4. LED P.C.B. 38

17.5. P9001 Connector 39

17.6. Waveform Chart 40

18 Abbreviations 41

19 Block Diagram 43

19.1. Power Supply Block Diagram 43

19.2. Analog Video Block Diagram 45

19.3. Analog Audio Block Diagram 46

19.4. Analog Timer Block Diagram 47

20 Schematic Diagram 49

20.1. Interconnection Schematic Diagram

20.2. Main Power Schematic Diagram 50

20.3. Sub Power Section (Main P.C.B. (1/6)) Schematic

Diagram (P) 52

20.4. Main Net Section (Main P.C.B. (2/6)) Schematic Diagram

(M) 53

20.5. Video I/O Section (Main P.C.B. (3/6)) Schematic Diagram

(V) 54

20.6. Audio Main Section (Main P.C.B. (4/6)) Schematic

Diagram (A) 56

20.7. Timer Section (Main P.C.B. (5/6)) Schematic Diagram (T)

20.8. UART/IR Section (Main P.C.B. (6/6)) Schematic Diagram

(U) 59

20.9. Tuner Pack Schematic Diagram 60

20.10. SD Card Schematic Diagram 61

20.11. LED Schematic Diagram 62

21 Print Circuit Board 63

21.1. Power P.C.B. 63

21.2. Main P.C.B. 64

21.3. Tuner P.C.B. 69

21.4. SD Card P.C.B. 70

21.5. LED P.C.B. , Front (L) P.C.B. 71

22 Exploded Views 73

22.1. Casing Parts & Mechanism Section 73

22.2. Packing & Accessories Section 74

23 Replacement Parts List 75

CONTENTS

Page Page

DMR -EH50 P / DMR -EH50 PC

1 Specifications

DMR -EH50 P / DMR -EH50 PC

2.1.1. Leakage current cold check

1. Unplug the AC cord and connect a jumper between the two

prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between

the jumpered AC plug and each exposed metallic cabinet

part on the equipment such as screwheads, connectors,

control shafts, etc. When the exposed metallic part has a

return path to the chassis, the reading should be between

1MΩand 5.2MΩ.

When the exposed metal does not have a return path to

the chassis, the reading must be .

Figure 1

2.1.2. Leakage current hot check

(See Figure 1 .)

1. Plug the AC cord directly into the AC outlet. Do not use an

isolation transformer for this check.

2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF

capacitors, between each exposed metallic part on the set

and a good earth ground such as a water pipe, as shown in

Figure 1.

3. Use an AC voltmeter, with 1000 ohms/volt or more

sensitivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the

voltage at each point.

5. Reverse the AC plug in the AC outlet and repeat each of the

above measuremen ts.

6. The potential at any point should not exceed 0.75 volts

RMS. A leakage current tester (Simpson Model 229 or

equivalent) may be used to make the hot checks, leakage

current must not exceed 1/2 milliampere. In case a

measuremen t is outside of the limits specified, there is a

possibility of a shock hazard, and the equipment should be

repaired and rechecked before it is returned to the

customer.

2 Safety precautions

2.1. General guidelines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

2.2. Caution for fuse replacement

DMR -EH50 P / DMR -EH50 PC

3 Prevention of Electrostatic Discharge (ESD) to

Electrostatic Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called

Electrostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistor- sand

semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage

caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,

which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as

aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can

generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propell ed chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable

conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing

together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage

an ES device).

DMR -EH50 P / DMR -EH50 PC

4 Precaution of Laser Diode

DMR -EH50 P / DMR -EH50 PC

5 How to replace the Lithium Battery

REPLACEMENT PROCEDURE

1. Remove the Top case and DVD-RAM drive unit with Main P.C.B. by referring the Disassemblin g Procedure.

2. Unsolder the Lithium Batteries: B7501 and then replace it into new one.

( As shown in 21.2.4. The Main P.C.B. )

NOTE:

The lithium battery is a critical component. ( Type No.: CR2450HE4Y Manufactured by SONY. )Part No.: N4BCT50A0005

It must never be subjected to excessive heat or discharge.

It must therefore only be fitted in equipment designed specifically for its use.

Replacement batteries must be of the same type and manufacture.

They must be fitted in the same manner and location as the original battery, with the correct polarity contacts observed.

Do not attempt to re-charge the old battery or re-use it for any other purpose.

It should be disposed of in waste products destined for burial rather than incineration.

6 Handling the Lead-free Solder

6.1. About lead free solder (PbF)

Distinction of PbF P.C.B.:

P.C.B.s (manufactured) using lead free solder will have a PbF stamp on the P.C.B.

Caution:

Pb free solder has a higher melting point than standard solder; Typically the melting point is 50 - 70°F (30 - 40°C) higher.

Please use a high temperature soldering iron. In case of the soldering iron with temperature control, please set it to 700 ±

20°F (370 ± 10°C).

Pb free solder will tend to splash when heated too high (about 1100°F/600°C).

When soldering or unsoldering, please completely remove all of the solder on the pins or solder area, and be sure to heat

the soldering points with the Pb free solder until it melts enough.

DMR -EH50 P / DMR -EH50 PC

7 Each Button

DMR -EH50 P / DMR -EH50 PC

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