Panasonic DMR-EH57EC Bedienungsanleitung

rights reserved. Unauthorized copying and

distribution is a violation of law.

Vol. 1

Colour

(S).......................Silver Type

(K).......................Black Type (EH57EC/EP, EH575EG)

DVD Recorder

ORDER NO.DSD0703003CE

Model No.

1 Safety Precaution 4

1.1. General guidelines 4

2 Warning 5

2.1. Prevention of Electrostatic Discharge (ESD) to

Electrostatic Sensitive (ES) Devices 5

2.2. Precaution of Laser Diode 6

2.3. Service caution based on legal restrictions 7

3 Service Navigation 8

3.1. Service Information 8

3.2. Caution for DivX 8

4 Specifications 9

5 Location of Controls and Components 11

6 Operation Instructions 13

6.1. Taking out the Disc from DVD-Drive Unit when the Disc

cannot be ejected by OPEN/CLOSE button 13

7 Service Mode 16

7.1. Self-Diagnosis and Special Mode Setting 16

8 Service Fixture & Tools 28

9 Disassembly and Assembly Instructions 29

9.1. Disassembly Flow Chart 29

9.2. P.C.B. Positions 30

9.3. Top case 31

9.4. Front Panel 31

9.5. HDD, ATAPI P.C.B. 32

9.6. RAM/Digital P.C.B. Module 34

9.7. DV Jack P.C.B. 35

9.8. Rear Panel 36

9.9. Power P.C.B. 36

9.10. HDMI P.C.B. 37

9.11. Main P.C.B., Front Jack P.C.B. and Front (L) P.C.B. 37

10 Measurements and Adjustments 38

10.1. Service Positions 38

10.2. Caution for Replacing Parts 42

10.3. Standard Inspection Specifications after Making Repairs

11 Block Diagram 45

11.1. Power Supply Block Diagram 45

11.2. Analog Video Block Diagram 47

11.3. Analog Audio Block Diagram 48

11.4. Analog Timer Block Diagram 49

11.5. HDMI Block Diagram 50

12 Schematic Diagram 51

12.1. Interconnection Schematic Diagram 51

12.2. Power Supply Schematic Diagram 52

12.3. Main Net (1/4) Section (Main P.C.B. (1/4)) Schematic

Diagram (M) 53

12.4. Main Net (2/4) Section (Main P.C.B. (1/4)) Schematic

Diagram (M) 54

CONTENTS

Page Page

DMR-EH57EC / DMR-EH57EP / DMR-EH57EE / DMR-EH575EG

12.5. Main Net (3/4) Section (Main P.C.B. (1/4)) Schematic

Diagram (M) 55

12.6. Main Net (4/4) Section (Main P.C.B. (1/4)) Schematic

Diagram (M) 56

12.7. AV I/O (1/4) Section (Main P.C.B. (2/4)) Schematic

Diagram (AV) 58

12.8. AV I/O (2/4) Section (Main P.C.B. (2/4)) Schematic

Diagram (AV) 59

12.9. AV I/O (3/4) Section (Main P.C.B. (2/4)) Schematic

Diagram (AV) 60

12.10. AV I/O (4/4) Section (Main P.C.B. (2/4)) Schematic

Diagram (AV) 61

12.11. Tuner Section (Main P.C.B. (3/4)) Schematic Diagram

(TU) 63

12.12. Timer (1/4) Section (Main P.C.B. (4/4)) Schematic

Diagram (T) 65

12.13. Timer (2/4) Section (Main P.C.B. (4/4)) Schematic

Diagram (T) 66

12.14. Timer (3/4) Section (Main P.C.B. (4/4)) Schematic

Diagram (T) 67

12.15. Timer (4/4) Section (Main P.C.B. (4/4)) Schematic

Diagram (T) 68

12.16. HDMI Schematic Diagram 69

12.17. DV Jack Schematic Diagram 70

12.18. Front Jack Schematic Diagram 70

12.19. Front (L) Schematic Diagram 70

12.20. ATAPI Schematic Diagram 70

13 Printed Circuit Board 71

13.1. Power P.C.B. and DV Jack P.C.B. 71

13.2. Main P.C.B. 72

13.3. HDMI P.C.B. 77

13.4. Front Jack P.C.B. and Front (L) P.C.B. 78

13.5. ATAPI P.C.B. 79

14 Appendix for Schematic Diagram 81

14.1. Voltage and Waveform Chart 81

15 Parts and Exploded Views 88

15.1. Exploded Views 88

15.2. Replacement Parts List 90

DMR-EH57EC / DMR-EH57EP / DMR-EH57EE / DMR-EH575EG

1.1.1. Leakage current cold check

1. Unplug the AC cord and connect a jumper between the two

prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between

the jumpered AC plug and each exposed metallic cabinet

part on the equipment such as screwheads, connectors,

control shafts, etc. When the exposed metallic part has a

return path to the chassis, the reading should be between

1MWand 5.2MW.

When the exposed metal does not have a return path to the

chassis, the reading must be .

1.1.2. Leakage current hot check

(See Figure 1 .)

1. Plug the AC cord directly into the AC outlet. Do not use an

isolation transformer for this check.

2. Connect a 1.5kW, 10 watts resistor, in parallel with a 0.15µF

capacitors, between each exposed metallic part on the set

and a good earth ground such as a water pipe, as shown in

Figure 1.

3. Use an AC voltmeter, with 1000 ohms/volt or more

sensitivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the

voltage at each point.

5. Reverse the AC plug in the AC outlet and repeat each of the

above measurements.

6. The potential at any point should not exceed 0.75 volts

RMS. A leakage current tester (Simpson Model 229 or

equivalent) may be used to make the hot checks, leakage

current must not exceed 1/2 milliampere. In case a

measurement is outside of the limits specified, there is a

possibility of a shock hazard, and the equipment should be

repaired and rechecked before it is returned to the

customer.

Figure 1

1 Safety Precaution

1.1. General guidelines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

DMR-EH57EC / DMR-EH57EP / DMR-EH57EE / DMR-EH575EG

2 Warning

2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive

(ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called

Electrostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistor-sand

semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage

caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,

which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as

aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can

generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable

conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the

brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient

to damage an ES device).

DMR-EH57EC / DMR-EH57EP / DMR-EH57EE / DMR-EH575EG

2.2. Precaution of Laser Diode

DMR-EH57EC / DMR-EH57EP / DMR-EH57EE / DMR-EH575EG

2.3. Service caution based on legal restrictions

2.3.1. General description about Lead Free Solder (PbF)

The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this

equipment in considering the globally environmental conservation.

The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin

(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86°F) more than that

of the normal solder.

Definition of PCB Lead Free Solder being used

The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder.

(See right figure)

Service caution for repair work using Lead Free Solder (PbF)

· ·

· The lead free solder has to be used when repairing the equipment for which the lead free solder is used.

(Definition: The letter of “PbF” is printed on the PCB using the lead free solder.)

· ·

· To put lead free solder, it should be well molten and mixed with the original lead free solder.

· ·

· Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.

· ·

· Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt

the lead free solder.

· ·

· Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30

degrees C (662±86°F).

Recommended Lead Free Solder (Service Parts Route.)

· ·

· The following 3 types of lead free solder are available through the service parts route.

RFKZ03D01K-----------(0.3mm 100g Reel)

RFKZ06D01K-----------(0.6mm 100g Reel)

RFKZ10D01K-----------(1.0mm 100g Reel)

Note

* Ingredient: tin (Sn), 96.5%, silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%

DMR-EH57EC / DMR-EH57EP / DMR-EH57EE / DMR-EH575EG

3 Service Navigation

3.1. Service Information

3.2. Caution for DivX

DMR-EH57EC / DMR-EH57EP / DMR-EH57EE / DMR-EH575EG

4 Specifications

DMR-EH57EC / DMR-EH57EP / DMR-EH57EE / DMR-EH575EG

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