Panasonic DMR-ES25P Bedienungsanleitung

ORDERNO.CHM0604022CE

B24

DVDRecorder

DMR-ES25P / DMR-ES25PC

Vol. 1

Colour

(S).......................Silver Type

SPECIFICATIONS

Unauthorized copying and distribution isaviolation of law.

1. Safety Precaution

1.1. General guidelines

1. When servicing, observe the original lead dress. Ifashort circuit

isfound, replace all parts which have been overheated or

damaged bythe short circuit.

2. After servicing, see to itthat all the protective devices such as

insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following leakage current checks to

prevent the customer from being exposed to shock hazards.

1.1.1. Leakage current coldcheck

1. Unplug the AC cord and connect ajumper between the two

prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between the

jumpered AC plug and each exposed metalliccabinet part on the

equipment such as screwheads, connectors, control shafts, etc.

When the exposed metallicpart has areturn path to the chassis,

the reading shouldbe between 1M and 5.2M .

When the exposed metal does not have areturn path to the

chassis, the reading must be .

Figure 1

1.1.2. Leakage current hot check / (See Figure 1 .)

1. Plug the AC cord directlyinto the AC outlet. Donot use an

isolation transformer for thischeck.

2. Connect a1.5k , 10 watts resistor, inparallel with a0.15 F

capacitors, between each exposed metallicpart on the set and a

good earth ground such as awater pipe, as shownin Figure 1.

3. Use an AC voltmeter, with 1000 ohms/voltor more sensitivity, to

measure the potential across the resistor.

4. Check each exposed metallicpart, and measure the voltage at

each point.

5. Reverse the AC plug inthe AC outlet and repeat each of the above

measurements.

6. The potential at anypoint shouldnot exceed 0.75 volts RMS. A

leakage current tester (Simpson Model 229 or equivalent) maybe

used to make the hot checks, leakage current must not exceed 1/2

milliampere. Incase ameasurement isoutside of the limits

specified, there isapossibilityof ashock hazard, and the

equipment shouldbe repaired and rechecked before itisreturned

to the customer.

1.2. Caution for fuse replacement

2. Warning

2.1. Prevention of ElectrostaticDischarge (ESD)to Electrostatic

Sensitive (ES) Devices

Some semiconductor(solidstate) devices canbe damagedeasilybystatic electricity. Such

components commonlyare calledElectrostatic Sensitive (ES) Devices. Examples of typical ES

devices are integratedcircuits and some field-effect transistor-sand semiconductor"chip"

components. The following techniques shouldbe usedtohelpreduce the incidence of

component damage causedbyelectrostatic discharge (ESD).

1. Immediatelybefore handling anysemiconductor component or

semiconductor-equipped assembly, drainoff anyESDon your

bodybytouching aknownearth ground. Alternatively, obtainand

wear acommerciallyavailabledischarging ESDwrist strap, which

shouldbe removed for potential shock reasons prior to applying

power to the unitunder test.

2. After removing an electrical assemblyequipped with ES devices,

place the assemblyon aconductive surface such as aluminum

foil, to prevent electrostaticcharge buildup or exposure of the

assembly.

3. Use onlyagrounded-tipsoldering iron to solder or unsolder ES

devices.

4. Use onlyan anti-staticsolder removal device. Some solder

removal devices not classified as "anti-static(ESDprotected)"

can generate electrical charge sufficient to damage ES devices.

5. Donot use freon-propelled chemicals. These can generate

electrical charges sufficient to damage ES devices.

6. Donot remove areplacement ES device from its protective

package until immediatelybefore you are readyto install it. (Most

replacement ES devices are packaged with leads electrically

shorted together byconductive foam, aluminum foil or

comparableconductive material).

7. Immediatelybefore removing the protective material from the

leads of areplacement ES device, touch the protective material to

the chassisor circuitassemblyinto which the device will be

installed.

Caution

Besure no power isapplied to the chassisor circuit, and observe

all other safetyprecautions.

8. Minimize bodilymotions when handling unpackaged replacement

ES devices. (Otherwise hamless motion such as the brushing

together of your clothes fabricor the lifting of your foot from a

carpeted floor can generate staticelectricitysufficient to damage

an ES device).

2.2. Precaution of Laser Diode

2.3. Service caution based on legal restrictions

2.3.1. General description about Lead Free Solder(PbF)

The leadfree solderhas beenusedinthe mounting process of all electrical components on the

printedcircuit boards usedforthis equipment inconsidering the globallyenvironmental

conservation.

The normal solderis the alloyof tin(Sn) and lead(Pb). Onthe otherhand, the leadfree solderis

the alloymainlyconsists of tin(Sn), silver(Ag) and Copper(Cu), and the melting point of the

leadfree solderis higherapprox.30 degrees C (86°F) more thanthat of the normal solder.

Definition of PCB LeadFree Solderbeing used

The letterof “PbF” is printedeitherfoil side orcomponents side on the PCB

using the leadfree solder.

(See right figure)

Service caution forrepairwork using LeadFree Solder(PbF)

-The lead free solder has to be used when repairing the equipment

for which the lead free solder isused.

(Definition: The letter of “PbF” isprinted on the PCB using the

lead free solder.)

-To put lead free solder, itshouldbe well molten and mixed with the

original lead free solder.

-Remove the remaining lead free solder on the PCB cleanlyfor

soldering of the new IC.

-Since the melting point of the lead free solder ishigher than that of

the normal lead solder, ittakes the longer time to meltthe lead

free solder.

-Use the soldering iron (more than 70W) equipped with the

temperature control after setting the temperature at 350±30

degrees C(662±86°F).

RecommendedLeadFree Solder(Service Parts Route.)

-The following 3types of lead free solder are availablethrough the

service parts route.

RFKZ03D01K-----------(0.3mm 100g Reel)

RFKZ06D01K-----------(0.6mm 100g Reel)

RFKZ10D01K-----------(1.0mm 100g Reel)

Note

*Ingredient: tin(Sn), 96.5%, silver(Ag) 3.0%, Copper(Cu) 0.5%, Cobalt (Co) / Germanium(Ge)

0.1 to0.3%

3. Service Navigation

3.1. Service Information

4. Specifications

5. Feature

5.1. HDAVI Control (HDMI Link)

Linkedoperations byHDAVI Control (HDMI Link)

5.1.1. What isHDMI

HDMI is abbreviation of [High-Definition Multimedia Interface], and is digital interface standard

fornext generation TV corresponding tofollows.

1. Non-compressing high qualitydigital image

2. Digital transmission of multi channel digital audio.

3. Twowaycommunication of control signal of control

straightening between equipments

PinName

Pinlayout of plug of HDMI cable seenfromoutside.

5.1.2. Link functions withEquipmentsCorresponding Table

Functions

(1) Automatic Input switch

(2) Link of Power

Incase setting of [FUNCTIONS] [Setup] [TV Screen] [Functions of HDMI] [Control

withHDMI] are on, all above equipments Link functions are effective.

5.1.3. Outline of EquipmentsLinked functions

(1) Automatic Input switch

At starting of playback/ GUI displaybyDIGA, it turns on powerof VIErA, and it displays picture

of DIGA ontoscreenof VIErA.

Starting of playback:

It includes automatic playback of DVD-Videoand soon. And it includes picture of screensaver

too.

GUI display:

FUNCTIONS, DIRECTNAVIGATOR, TV PROGRAM, PROG/CHECK, TimerRecording, G-code,

Initial setting, Playback setting, Playlist, SD/DVD guide, Warning messages that usercanselect

and soon.

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