Panasonic SA-HT330EB Bedienungsanleitung

nAmplifier Section

RMS Output power : Dolby Digital Mode

Front Ch 65 W per channel (6 Ω), 1 kHz,

10% THD

Surround Ch 65 W per channel (6 Ω), 1 kHz,

10% THD

Center Ch 65 W per channel (6 Ω), 1 kHz,

10% THD

Subwoofer Ch 75 W per channel (4 Ω), 100 kHz,

10% THD

Total RMS Dolby Digital mode

power

400 W

DIN Output Power : Dolby Digital Mode

Front Ch 55 W per channel (6 Ω), 1 kHz,

1% THD

Surround Ch 55 W per channel (6 Ω), 1 kHz,

1% THD

Center Ch 55 W per channel (6 Ω), 1 kHz,

1% THD

Subwoofer Ch 65 W per channel (4 Ω), 100 Hz,

1% THD

Total DIN Dolby Digital mode

power

340 W

nFM/AM Tuner, Terminals Section

Preset station FM 15 stations

AM/MW 15 stations

Frequency Modulation (FM)

Frequency range 87.50 - 108.00 MHz (50-kHz step)

rights reserved. Unauthorized copying and

distribution is a violation of law.

SA-HT330EB

Colour

(S)... Silver Type

Sensitivity 1.5 µV

S/N 26 dB 1.2 µV

ntenna terminals 75 Ω(unbalance)

mplitude Modulation (AM/MW)

Frequency range 522 - 1629 kHz (9 - kHz step)

M Sensitivity S/N 20 dB at 999

kHz

560 µV/m

Phone jack

Terminal Stereo, 3.5 mm jack

nDisc Section

Discs played ( 8 cm or 12 cm)

(1) DVD-RAM (DVD-VR compatible, JPEG formatted discs)

(2) DVD-Audio

(3) DVD-Video

(4) DVD-R, DVD-RW (DVD-Video compatible)

+R, +RW (video compatible)

(5) CD-Audio (CD-DA)

(6) Video CD

(7) SVCD (Conforming to IEC62107)

(8) CD-R/RW (CD-DA, Video-CD, SVCD, MP3, WMA, JPEG

formatted disc)

(9) MP3/WMA*

lCompatible compression rate:

MP3 : between 32 kbps and 320 kbps

WMA : between 48 kbps and 320 kbps

(10) JPEG*

lExif Ver 2.1 JPEG Baseline files

DVD Home Theater Sound System

Specification

ORDER NO. MD0506225C2

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lPicture resolution : between 320 x 240 and 6144 x 4096 pixels (sub

sampling is 4:2:2 or 4:2:0)

(11) HighMAT Level 2 (Audio and Image)

The total combined maximum number of recognizable audio and

picture contents and groups: 4000 audio and picture contents and

400 groups.

Pick up

Wavelength CD 785 nm

DVD 662 nm

Laser power CLASS 2 / CLASS 3A

udio output (Disc)

Number of channels 5.1ch (FL, FR, C, SL, SR, SW)

nVideo Section

Video system

Signal system PAL625/50, PAL525/60, NTSC

Composite video output

Output level 1Vp-p(75Ω)

Terminal Pin jack (1 system)

Scart jack (1 system)

S-video output

Y output level 1Vp-p(75Ω)

C output level PAL; 0.3 Vp-p (75 Ω)

NTSC; 0.286 Vp-p (75 Ω)

Terminal S terminal (1 system)

Scart jack (1 system)

Component video output

[NTSC: 525 (480) p/525 (480) i, PAL: 625 (576) p/625 (576) i]

Y output level 1Vp-p(75Ω)

PB output level 0.7 Vp-p (75 Ω)

1 Safety Precautions 4

1.1. GENERAL GUIDELINES 4

2 Caution for AC Mains Lead 5

3 Before Repair and Adjustment 6

4 Protection Circuitry 6

5 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices 7

6 Handling the Lead-free Solder 7

6.1. About lead free solder (PbF) 7

7 Precaution of Laser Diode 8

8 Handling Precautions for Optical Pickup Unit 9

8.1. Cautions to be taken in handling the Optical Pickup Unit

8.2. Cautions to be taken when replacing the Optical Pickup

Unit 9

8.3. Grounding for electrostatic breakdown prevention 9

9 Accessories 11

PR output level 0.7 Vp-p (75 Ω)

Terminal Pin jack (Y: green, PB: blue,

PR: red) (1 system)

RGB video output

R output level 0.7 Vp-p (75 Ω)

G output level 0.7 Vp-p (75 Ω)

B output level 0.7 Vp-p (75 Ω)

Terminal Scart jack (1 system)

nGeneral

Power supply AC 230 - 240 V, 50 Hz

Power consumption Main unit 80 W

Dimensions (W x H x D) 430 mm x 60 mm x 337 mm

Mass Main unit 3.3 kg

Operating temperature range +5 °C to +35 °C

Operating humidity range 5%to90%RH(no

condensation)

Power consumption in standby

mode

approx 0.5 W

Notes :

1. Specifications are subject to change without notices.

Mass and dimensions are approximate.

2. Total harmonic distortion is measured by the digital spectrum

analyzer.

10 Operation Procedures 12

11 Disc information 13

12 About HighMAT 15

12.1. What 痴HighMAT? 15

12.2. Why take advantage of HighMAT? 15

12.3. Benefits of HighMAT? 16

13 Assembling and Disassembling 19

13.1. Disassembly flow chart 19

13.2. P.C.B. Locations 20

13.3. Disassembly of Top Cabinet 21

13.4. Disassembly of SMPS Module P.C.B. 21

13.5. Disassembly of Rear Panel 21

13.6. Disassembly of AC Inlet P.C.B. 22

13.7. Disassembly of Digital Amplifier (side A & side B) P.C.B.

CONTENTS

Page Page

SA-HT330EB

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13.8. Disassembly of DVD Lid (when taking out disc manually)

13.9. Disassembly of Front Panel 23

13.10. Disassembly of Headphone, Panel and Tact Switch P.C.B.

13.11. Disassembly of DVD Mechanism unit 25

13.12. Disassembly of Main P.C.B. 25

13.13. Disassembly and Assembly Mechanism Unit 26

14 Service Positions 34

14.1. Checking procedure 34

15 Optical Pick-up Self-Diagnosis and Replacement Procedure

15.1. Optical Pickup Breakdown Diagnosis 36

15.2. Service Mode Table 1 37

15.3. DVD Self Diagnostic Function-Error Code 37

15.4. Service mode table 2 39

15.5. Sales demonstration lock function 41

15.6. Handling After Completing Repairs 41

16 Self-Diagnosis Function 42

16.1. Automatic Displayed Error Codes 42

16.2. Memorized Error Codes 42

17 Service Precautions 43

17.1. Recovery after the DVD player is repaired 43

17.2. Firmware version-up of the DVD player 43

18 Adjustment Procedure 44

18.1. Service Tools and Equipment 44

18.2. Important points in adjustment 44

18.3. Storing and Handling Test Discs 44

18.4. Optical adjustment 45

19 Abbreviations 47

20 Voltage Measurement and Waveform Chart 49

20.1. Voltage Measurement 49

20.2. Waveform Chart 54

21 Block Diagram 55

21.1. DVD MODULE BLOCK 55

21.2. MAIN BLOCK 58

22 Notes of Schematic Diagram 64

23 Schematic Diagram 65

23.1. OPTICAL PICKUP UNIT CIRCUIT 65

23.2. DVD MODULE CIRCUIT 66

23.3. MAIN CIRCUIT 73

23.4. PANEL CIRCUIT 82

23.5. SMPS MODULE CIRCUIT and AC INLET CIRCUIT 83

23.6. DIGITAL AMPLIFIER CIRCUIT 85

23.7. HEADPHONE CIRCUIT, TACT SWITCH CIRCUIT and CD

TRAY LOADING CIRCUIT 88

24 Printed Circuit Board 89

24.1. DVD MODULE P.C.B 89

24.2. MAIN P.C.B. 91

24.3. PANEL P.C.B, HEADPHONE P.C.B and TACT SWITCH

P.C.B 93

24.4. DIGITAL AMPLIFIER P.C.B 94

24.5. CD TRAY LOADING P.C.B and AC INLET P.C.B 95

25 Wiring Connection Diagram 96

26 Illustration of IC 痴, Transistors and Diodes 98

27 Terminal Function of ICｴs 99

27.1. IC2018 (C2CBHG000197): MICROPROCESSOR IC 99

28 Parts Location and Replacement Parts List 100

28.1. DVD Loading Mechanisms 101

28.2. Cabinet Part List 103

28.3. Electrical Part List 106

28.4. Packaging Materials & Accessories Parts List 116

28.5. Packaging 116

SA-HT330EB

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1 Safety Precautions

1.1. GENERAL GUIDELINES

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

2. After servicing, ensure that all the protective devices such as insulation barriers, insulation papers shields are properly installed.

3. After servicing, check for leakage current checks to prevent from being exposed to shock hazards.

1.1.1. LEAKAGE CURRENT COLD CHECK

1. Unplug the AC cord and connect a jumper between the two prongs on the plug.

2. Using an ohmmeter measure the resistance value, between the jumpered AC plug and each exposed metallic cabinet part on

the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the

chassis, the reading should be between 1MΩand 5.2Ω.

When the exposed metal does not have a return path to the chassis, the reading must be .

Fig. 1

1.1.2. LEAKAGE CURRENT HOT CHECK (See Figure 1.)

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF capacitors, between each exposed metallic part on the set and a

good earth ground such as a water pipe, as shown in Figure 1.

3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.

6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may

be used to make the hot checks, leakage current must not exceed 1/2 milliamp. should the measurement is outside of the limits

specified, there is a possibility of a shock hazard, and the equipment should be repaired and re-checked before it is returned

to the customer.

SA-HT330EB

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2 Caution for AC Mains Lead

SA-HT330EB

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3 Before Repair and Adjustment

Disconnect AC power, discharge Power Supply Capacitors C506, C507 & C508 through a 10Ω, 1W resistor to ground.

DO NOT SHORT-CIRCUIT DIRECTLY (with a screwdriver blade, for instance), as this may destroy solid state devices.

After repairs are completed, restore power gradually using a variac, to avoid overcurrent.

Current consumption at AC 230-240 V, 50 Hz in NO SIGNAL mode should be ~650 mA.

4 Protection Circuitry

The protection circuitry may have operated if either of the following conditions are noticed:

No sound is heard when the power is turned on.

Sound stops during a performance.

The function of this circuitry is to prevent circuitry damage if, for example, the positive and negative speaker connection wires are

"shorted", or if speaker systems with an impedance less than the indicated rated impedance of the amplifier are used.

If this occurs, follow the procedure outlines below:

1. Turn off the power.

2. Determine the cause of the problem and correct it.

3. Turn on the power once again after one minute.

Note:

When the protection circuitry functions, the unit will not operate unless the power is first turned off and then on again.

SA-HT330EB

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5 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by electricity. Such components commonly are called

Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and

semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage

caused by electro static discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equiped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,

which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equiped with ES devices, place the assembly on a conductive surface such as aluminium

foil, to prevent electrostatic charge build up or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder remover device. Some solder removal devices not classified as “anti-static (ESD protected)” can

generate electrical charge to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminium foil or

comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the

brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD)

sufficient to damage an ES device).

6 Handling the Lead-free Solder

6.1. About lead free solder (PbF)

Distinction of PbF P.C.B.:

P.C.B.s (manufactured) using lead free solder will have a PbF stamp on the P.C.B.

Caution:

Pb free solder has a higher melting point than standard solder; Typically the melting point is 50 - 70°F (30 - 40°C) higher. Please

use a high temperature soldering iron. In case of soldering iron with temperature control, please set it to 700 ± 20°F (370 ±

10°C).

Pb free solder will tend to splash when heated too high (about 1100°F/600°C).

When soldering or unsoldering, please completely remove all of the solder on the pins or solder area, and be sure to heat the

soldering points with the Pb free solder until it melts enough.

SA-HT330EB

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7 Precaution of Laser Diode

Caution :

This product utilizes a laser diode with the unit turned "ON", invisible laser radiation is emitted from the pick up lens.

Wavelength : 780 nm

Maximum output radiation power from pick up : 100 µW/VDE

Laser radiation from pick up unit is safety level, but be sure the followings:

1. Do not disassemble the optical pick up unit, since radiation from exposed laser diode is dangerous.

2. Do not adjust the variable resistor on the pick up unit. It was already adjusted.

3. Do not look at the focus lens using optical instruments.

4. Recommend not to look at pick up lens for a long time.

ACHTUNG :

Dieses Produkt enthält eine Laserdiode. Im eingeschalteten Zustand wird unsichtbare Laserstrahlung von der Lasereinheit

abgestrahlt.

Wellenlänge : 780nm

Maximale Strahlungsleistung der Lasereinheit :100µW/VDE

Die Strahlung an der Lasereinheit ist ungefährlich, wenn folgende Punkte beachtet werden:

1. Die Lasereinheit nicht zerlegen, da die Strahlung an der freigelegten Laserdiode gefährlich ist.

2. Den werkseitig justierten Einstellregler der Lasereinhit nicht verstellen.

3. Nicht mit optischen Instrumenten in die Fokussierlinse blicken.

4. Nicht über längere Zeit in die Fokussierlinse blicken.

ADVARSEL :

I dette a apparat anvendes laser.

CAUTION!

THIS PRODUCT UTILIZES A LASER.

USE OF CONTROLS OR ADJUSTMENTS OR PERFORMANCE OF PROCEDURES OTHER THAN THOSE SPECIFIED HEREIN MAY RESULT

IN HAZARDOUS RADIATION EXPOSURE.

nUse of Caution Labels

SA-HT330EB

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8 Handling Precautions for Optical Pickup Unit

The laser diode in the optical pickup unit may break down due to static electricity of clothes or human body. Special care must be

taken avoid to electrostatic breakdown when servicing and handling the laser diode.

8.1. Cautions to be taken in handling the Optical Pickup Unit

The laser diode in the optical pickup unit may be damaged due to electrostatic discharge generating from clothes or human body.

Special care must be taken avoid to electrostatic discharge damage when servicing the laser diode.

1. Do not give a considerable shock to the optical pickup unit as it has an extremely high-precise structure.

2. To prevent the laser diode from the electrostatic discharge damage, the flexible cable of the optical pickup unit removed should

be short-circuited with a short pin or a clip.

3. The flexible cable may be cut off if an excessive force is applied to it. Use with caution when handling the flexible cable.

4. The antistatic FPC is connected to the new optical pickup unit. After replacing the optical pickup unit and connecting the flexible

cable, cut off the antistatic FPC.

8.2. Cautions to be taken when replacing the Optical Pickup Unit

The flexible cable of the optical pickup unit which was supplied as a component is equipped with a short clip to prevent the laser

diode from being damaged due to electrostatic discharge. Remove the short clip before connecting the flexible cable and make

sure that the short land is open. (If the flexible cable is short-circuited, remove the solder.)

8.3. Grounding for electrostatic breakdown prevention

Some devices such as the DVD player use the optical pickup (laser diode) and the optical pickup will be damaged by static

electricity in the working environment. Proceed servicing works under the working environment where grounding works is

completed.

8.3.1. Worktable grounding

1. Put a conductive material (sheet) or iron sheet on the area where the optical pickup is placed, and ground the sheet.

SA-HT330EB

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8.3.2. Human body grounding

1. Use the anti-static wrist strap to discharge the static electricity form your body.

SA-HT330EB

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