Panasonic SA-HT530EB Bedienungsanleitung

ORDERNO. MD0501005C2

DVDHomeTheaterSound System

SA-HT530EB

Colour

(S)...SilverType

SPECIFICATIONS

Specification

AmplifierSection

RMSOutputPower:DolbyDigital Mode

FrontCh

55 W perchannel (6), 1kHz, 10%THD

Surround Ch

55 W perchannel (6), 1kHz, 10%THD

CenterCh

160 W perchannel (6), 1kHz, 10%THD

SubwooferCh

220 W perchannel (4), 100 Hz, 10%THD

Total RMSDolbyDigital Mode

Power 600 W

DINOutputPower:DolbyDigital Mode

FrontCh

40 W perchannel (6), 1kHz, 1%THD

Surround Ch

40 W perchannel (6), 1kHz, 1%THD

CenterCh

120 W perchannel (6), 1kHz, 1%THD

SubwooferCh

150 W perchannel (4), 100 Hz, 1%THD

Total DINDolbyDigital Mode

Power 430 W

FM/AMTuner, Terminals

Section

Presetstation FM15 stations

AM/MW 15 stations

FrequencyModulation (FM)

FrequencyRange

87.50-108.00 MHz(50-kHzstep)

Sensitivity 1.5V(IHF)

S/N26 dB 1.2V

Antennaterminals 75 (unbalanced)

AmplitudeModulation (AM/MW)

FrequencyRange 522-1629 kHz(9-kHzstep)

AMSensitivityS/N20 dBat999

kHz 560 V/m

PhoneJack

Terminal Stereo, 3.5mm jack

Disc Section

Disc played [8cm or12 cm]

1. DVD-RAM(DVD-VRcompatible, JPEGformatted disc)

2. DVD-Audio

3. DVD-Video

4. DVD-R, DVD-RW (DVD-Video compatible)+R, +RW (Video

compatible)

5. CD-Audio (CD-DA)

6. Video CD

7. SVCD(Conforming to IEC62107)

8. CD-R/RW (CD-DA, Video-CD, SVCD, MP3, WMA, JPEG

formatted disc)

9. MP3/WMA*1

-Compatiblecompression rate:

MP3:between32 kbpsand 320 kbps

WMA:between48 kbpsand 320 kbps

10. JPEG*1

-ExifVer2.1JPEGBaselinefiles

-Pictureresolution: between320 x240 and 6144 x4096 pixels(sub

sampling is4:2:2or4:2:0)

11. HighMATLevel 2(Audio and Image)

*1Thetotal combined maximumnumberofrecognizableaudio

and picturecontentsand groups:4000 audio and picture

contentsand 400 groups.

Pick up

Wavelength CD785 nm

DVD662 nm

Laserpower CLASS 2/CLASS 3A

Audio output(Disc)

Numberofchannels 5.1ch (FL, FR, C, SL, SR, SW)

Video Section

Video System

Signal system PAL625/50, PAL525/60, NTSC

Compositevideo output

Outputlevel 1Vp-p (75 )

Terminal Pin jack (1system)

Scartjack (1system)

S-video output

Youtputlevel 1Vp-p (75 )

Coutputlevel PAL;0.3Vp-p (75 )

NTSC;0.286 Vp-p (75 )

Terminal Sterminal (1system)

Scartjack (1system)

ComponentVideo Output(480p/480i)

Youtputlevel 1Vp-p (75 )

PBoutputlevel 0.7Vp-p (75 )

PRoutputlevel 0.7Vp-p (75 )

Terminal

Pin jack (Y:green, PB:blue, PR:red)(1system)

RGBvideo output

Routputlevel 0.7Vp-p (75 )

Goutputlevel 0.7Vp-p (75 )

Boutputlevel 0.7Vp-p (75 )

Terminal Scartjack (1system)

General

PowerSupply AC230-240 V, 50 Hz

Powerconsumption 25 W (SA-HT530), / 250 W (SB

-WA530)

Dimensions(W xHxD) 430 x60 x348.3mm

Mass 2.7kg (SA-HT530)

Operating temperaturerange +5 °Cto +35 °C

Operating

temperature

range

Operating humidityrange

5%to 90 %RH(no condensation)

Powerconsumption in standbymode:approx. 0.7W

*2Rating with lowcutfilterequipped amplifier

System

SC-HT530 (EB) Main unit: SA-HT530 (EB)

Satellitespeakers:SB-HT530 (EB)

Activesubwoofer:SB-WA530 (EB)

Satellitespeakers:SB-HT530 (EB)

Frontspeakers:SB-FS530 (EB)x2

Surround speakers:SB-FS530 (EB)x2

Centerspeaker:SB-PC730 (P-S1)x1

Note:

1. Specificationsaresubjectto changewithout notice. Mass and

dimensionsareapproximate.

2. Total harmonicdistortion ismeasuredbythedigital spectrum analyzer.

1. Caution forACMains Lead

2. Use of ActiveSubwoofer

2.1. Checking MainUnitwhenActiveSubwooferisUsed

2.2. Checking MainUnitUsing PowerJig

Iftheactive subwooferisnotavailableduring timeofrepairtotheunit, thefollowing equipment

couldbeused.

Jigproductnumber

RFKZ0182 (110V , 127V, 220V, 230V -240V for withvoltageselector overseas domesticuse).

3. BeforeRepairand Adjustment

DisconnectACpower, dischargePowerSupplyCapacitorsC2080 through a10 , 10 Wresistor

toground.

DONOTSHORT-CIRCUITDIRECTLY(withascrewdriverblade, for instance), as thismay destroy

solidstatedevices.

Afterrepairsarecompleted, restorepowergraduallyusing avariac, toavoidovercurrent.

Currentconsumption atAC230V-240V, 50HzinNOSIGNALmodeshouldbe~850 mA(Active

Subwoofer).

4. SAFETYPRECAUTIONS

4.1. GENERALGUIDELINES

1. Whenservicing, observetheoriginal leaddress. Ifashortcircuit

isfound, replace all parts whichhavebeenoverheatedor

damagedbytheshortcircuit.

2. Afterservicing, ensurethat all theprotectivedevices suchas

insulation barriers, insulation papersshieldsareproperlyinstalled.

3. Afterservicing, make thefollowing leakagecurrentchecks to

preventthecustomerfrombeing exposedtoshock hazards.

4.1.1. LEAKAGE CURRENTCOLDCHECK (FORACTIVE SUBWOOFER)

1. Unplug theACcordand connect ajumperbetweenthetwoprongs

on theplug.

2. Measuretheresistance value, withanohmmeter, betweenthe

jumperedACplug and eachexposedmetalliccabinet parton the

equipmentsuchas screwheads, connectors, control shafts, etc.

Whentheexposedmetallicparthas areturnpathtothechassis,

thereading shouldbebetween1M and 5.2 . / Whenthe

exposedmetal does nothaveareturnpathtothechassis, the

reading must be . Fig. 1

4.1.2. LEAKAGE CURRENTHOTCHECK (See Figure1.)

1. Plug theACcorddirectlyintotheACoutlet. Donotuse an

isolation transformerforthischeck.

2. Connect a1.5k , 10 watts resistor, inparallel witha0.15 F

capacitor, betweeneachexposedmetallicparton theset and a

good earthground suchas awaterpipe, as showninFigure1.

3. Use anACvoltmeter, with1000 ohms/voltormoresensitivity, to

measurethepotential across theresistor.

4. Check eachexposedmetallicpart, and measurethevoltageat

eachpoint.

5. Reverse theACplug intheACoutlet and repeat eachoftheabove

measurements.

6. Thepotential at anypointshouldnotexceed0.75 volts RMS. A

leakagecurrenttester(Simpson Model 229 orequivalent) maybe

usedtomake thehotchecks, leakagecurrentmust notexceed1/2

milliamp. Incase ameasurementisoutsideofthelimits specified,

thereisapossibilityofashock hazard, and theequipmentshould

berepairedand recheckedbeforeitisreturnedtothecustomer.

5. Handling the Lead Solder

5.1. Aboutleadfree solder(PbF)

Distinction ofPbF P.C.B. :

P.C.B.s(manufactured)using leadfree solderwill have aPbF stampon theP.C.B.

Caution:

-Pbfree solderhas ahighermelting pointthat standardsolder;

Typicallythemelting pointis50 -70°F(30 -40°C)higher. / Please

use ahigh temperaturesoldering iron. Incase ofthesoldering iron

withtemperaturecontrol, please set itto700 ±20°F(370 ±10°C).

-Pbfree solderwill tend tosplashwhenheatedtoo high (about

1100°F/600°C).

-Whensoldering orunsoldering, please completelyremoveall ofthe

solderon thepinsorsolderarea, and besuretoheat thesoldering

points withthePbfree solderuntil itmelts enough.

6. Protection Circuitry

Theprotection circuitrymay have operatedifeitherofthefollowing conditionsarenoticed:

-Nosound isheardwhenthepoweristurnedon.

-Sound stopsduring aperformance.

Thefunction ofthiscircuitryistopreventcircuitrydamageif, for example, thepositive and

negative speakerconnection wires are

“shorted”, or ifspeakersystemswithanimpedance less thantheindicatedratedimpedance of

theamplifierareused.

Ifthisoccurs, followtheprocedureoutlines below:

1. Turnoff thepower.

2. Determinethecause oftheproblemand correct it.

3. Turnon thepoweronce againafteroneminute.

Note:

Whentheprotection circuitryfunctions, theunitwill notoperateunless thepowerisfirstturned

off and thenon again.

7. Prevention of ElectroStaticDischarge (ESD) to

ElectrostaticallySensitive(ES) Devices

Somesemiconductor (solidstate)devices canbedamagedeasilybyelectricity. Such

componentscommonlyarecalledElectrostaticallySensitive (ES)Devices. Examples oftypical

ES devices areintegratedcircuitsand somefield-effecttransistorsand semiconductor “chip”

components. Thefollowing techniques shouldbeusedtohelpreduce theincidence of

componentdamagecausedbyelectro staticdischarge(ESD).

1. Immediatelybeforehandling anysemiconductorcomponentor

semiconductor-equipedassembly, drainoff anyESDon yourbody

bytouching aknownearthground. Alternatively, obtainand wear

acommerciallyavailabledischarging ESDwrist strap, which

shouldberemovedforpotential shock reasonspriortoapplying

powertotheunitundertest.

2. Afterremoving anelectrical assemblyequipedwithES devices,

place theassemblyon aconductivesurface suchas aluminium

foil, topreventelectrostaticchargebuildup orexposureofthe

assembly.

3. Use onlyagrounded-tipsoldering iron tosolderorunsolderES

devices.

4. Use onlyananti-staticsolderremoverdevice. Somesolder

removal devices notclassifiedas “anti-static(ESDprotected)”can

generate electrical chargetodamageES devices.

5. Donotuse freon-propelledchemicals. These cangenerate

electrical charges sufficienttodamageES devices.

6. DonotremoveareplacementES device fromits protective

packageuntil immediatelybeforeyou arereadytoinstall it. (Most

replacementES devices arepackagedwithleadselectrically

shortedtogetherbyconductivefoam, aluminiumfoil or

comparableconductivematerial).

7. Immediatelybeforeremoving theprotectivematerial fromthe

leadsofareplacementES device, touchtheprotectivematerial to

thechassisorcircuitassemblyintowhichthedevice will be

installed.

Caution

Besureno powerisappliedtothechassisorcircuit, and observe

all othersafetyprecautions.

8. Minimizebodilymotionswhenhandling unpackagedreplacement

ES devices. (Otherwise harmless motion suchas thebrushing

togetherofyourclothes fabricorthelifting ofyourfootfroma

carpetedfloorcangenerate staticelectricity(ESD)sufficientto

damageanES device).

8. Cautions toBeTaken When Handling Optical

Pickup

-Thelaserdiodeusedinsidetheoptical pickup couldbedestroyed

duetostaticelectricity(potential difference iscausedby

electrostaticloaddischargedfromclothes and humanbody).

Handletheparts carefullytoavoidelectrostaticdestruction during

repair&during replacement.

8.1. Handling Optical Pickup

1. Donotcause anystrong impact on optical pickup as theunit

structurallyuses anextremelyprecise technology.

2. Short-circuittheflexiblecableofoptical pickup removedfromthe

circuitboardusing ashort-circuitpinorclipinordertoprevent

laserdiodefromelectrostaticdestruction. (Referto Fig. 8-1 and

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