Panasonic TX-22LT3 Bedienungsanleitung

ORDERNO. ITD0310055C2

LCD TV

TX-22LT3

LH12 Chassis

SPECIFICATIONS

Power Source

AC 100~240V, 50/60Hz

Power Consumption

Averageuse: 67W

Stand-bycondition: 1.8W

TV set DC 15V, 3.8Amax.

LCD

22-inch(558 mm), 16:9aspect ratioLCD panel

ScreenSize

486.8mm(W) x273.6mm(H)

Channel Capability-100

UHF: 21-68

Sound

Speaker

4cm, 2pcs, 16

AudioOutput

11W(3.0W+3.0W+5.0W(Woofer)), 10%THD

Headphones

M3(3.5mm) Jack x1

Receiving System/ Band name

PALI

UHFE21 - 68

PAL525/60

Playback of NTSC tapefromsome PALvideorecorders

(VCR)

M.NTSC

Playback fromM.NTSC Videorecorders (VCR)

NTSC (AV input only)

Playback fromNTSC Videorecorders (VCR)

Aerial-Rear

UHF

Operating Conditions

Temperature: 41°F-95°F(5-35°C)

Humidity: 5%-90%RH (non-condensing)

Connection Terminals

AV1(Scart connecter)

21 Pinsocket (Audio/Videoin, Audio/Videoout, RGB in,

Q-Link)

AV2(Scart connecter)

21 Pinsocket (Audio/Videoin, Audio/Videoout, S-Video

in, Q-Link)

AV3

VIDEO

RCAPIN Type× 1

S-VIDEO

Mini DIN 4-pin

AUDIO L-R

RCAPIN Type× 2

Dimensions(WxD xH)

Including TV Stand

586mm x255mm x428mm

TV Set Only

586mm x96mm x387mm

Weight (Mass)

11kgNet

Note:

Design and Specificationsare subject tochangewithout notice.

Weight and Dimensionsshownare approximate.

Unauthorized copying and distribution isaviolation of law.

1. Safety Precautions

1.1. General Guidelines

1. When servicing, observe the original lead dress. Ifashort circuit

isfound, replace all parts which have been overheated or

damaged bythe short circuit.

2. After servicing, see to itthat all the protective devices such as

insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following leakage current checks to

prevent the customer from being exposed to shock hazards.

1.2. Touch-Current Check

1. Plug the AC cord directlyinto the AC outlet. Donot use an

isolation transformer for thischeck.

2. Connect ameasuring network for touch currents between each

exposed metallicpart on the set and agood earth ground such as

awater pipe, as showninFigure 1.

3. Use Leakage Current Tester (Simpson 228 or equivalent) to

measure the potential across the measuring network.

4. Check each exposed metallicpart, and measure the voltage at

each point.

5. Reserve the AC plug inthe AC outlet and repeat each of the above

measure.

6. The potential at anypoint (TOUGHCURRENT) expressed as

voltage U1and U2, does not exceed the following values:

For a. c.:U1= 35 V(peak) and U2= 0.35 V(peak);

For d. c.:U1= 1.0V,

Note:

The limit value of U2= 0.35 V (peak) fora. c. and U1= 1.0 V ford. c. correspond tothe values 0.7

mA (peak) a. c. and 2.0 mA d. c.

The limit value U1= 35 V (peak) fora. c. correspond tothe value 70 mA (peak) a. c. for

frequencies greaterthan100 kHz.

7. Incase ameasurement isout of the limits specified, there isa

possibilityof ashock hazard, and the equipment shouldbe

repaired and rechecked before itisreturned to the customer.

Figure 1

2. Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor(solidstate) devices canbe damagedeasilybystatic electricity. Such

components commonlyare calledElectrostaticallySensitive (ES) Devices. Examples of typical

ES devices are integratedcircuits and some field-effect transistorsand semiconductor"chip"

components. The following techniques shouldbe usedtohelpreduce the incidence of

component damage causedbyelectrostatic discharge (ESD).

1. Immediatelybefore handling anysemiconductor component or

semiconductor-equipped assembly, drainoff anyESDon your

bodybytouching aknownearth ground. Alternatively, obtainand

wear acommerciallyavailabledischarging ESDwrist strap,

whichshouldbe removed for potential shock reasons prior to

applying power to the unitunder test.

2. After removing an electrical assemblyequipped with ES devices,

place the assemblyon aconductive surface such as alminum foil,

to prevent electrostaticcharge buildup or exposure of the

assembly.

3. Use onlyagrounded-tipsoldering iron to solder or unsolder ES

devices.

4. Use onlyan anti-staticsolder removal device. Some solder

removal devices not classified as "anti-static(ESDprotected)"

can generate electrical charge sufficient to damage ES devices.

5. Donot use freon-propelled chemicals. These can generate

electrical charges sufficient to damage ES devices.

6. Donot remove areplacement ES device from its protective

package until immediatelybefore you are readyto install it. (Most

replacement ES devices are packaged with leads electrically

shorted together byconductive foam, alminum foil or

comparableconductive material).

7. Immediatelybefore removing the protective material from the

leads of areplacement ES device, touch the protective material to

the chassisor circuitassemblyinto which the device will be

installed.

Caution

Besure no power isapplied to the chassisor circuit, and observe

all other safetyprecautions.

8. Minimize bodilymotions when handling unpackaged replacement

ES devices. (Otherwise hamless motion such as the brushing

together of your clothes fabricor the lifting of your foot from a

carpeted floor can generate staticelectricity(ESD)sufficient

todamage an ES device).

3. Self Check

1. Self-Check isused to automaticallycheck the bus lines and

hexadecimal code of the TV set.

2. To get into the Self-Check mode press the Down( )button on

the customer controlsat the front of the set, at the same time

pressing the Recall button on the remote control, andthe screen

will show :

If the CCU ports have beencheckedand found tobe incorrect ornot locatedthen“--” will

appearinplace of “O.K.”.

Display Ref. No. Description P.C.B.

MEM IC1004 EEPROM DG-Board

GC2M IC9001 Global Core DG-Board

HAD IC9007 RGB A/D Converter DG-Board

AVSW IC4001 AV selector A-Board

Tun1 TNR001 Tuner B-Board

MSP IC2501 Multi Sound Processor A-Board

LCDMCU IC3002 LCD MCU DG-Board

MEM IC3001 EEPROM DG-Board

PIXL IC6004 Pixel Converter DG-Board

HAD+ IC6003 RGB A/D Converter DG-Board

PNL - LCD Panel -

4. Chasis Board Layout

BoardName Function

A-Board Main(DC PowerSupply, Audio, Input Select, AV

Connector)

B - Board Tuner

DG - Board Global Core, RGB Processor, MicroProcessor, Pixel

Converter)

K - Board Switch

PD - Board Back Light Inverter

PH - Board Back Light Inverter

V - Board RM, LED

5. Servicing method

5.1. Removing the tiltbase

1. Laydownthe mainunitso that the rear cover faces upward.

2. Remove the AVcablecover.

3. Remove the tuner cablecover.

4. Remove the fixing screw (1pcs).

5. Remove the hinge cover.

6. Remove the fixing screws(4pcs).

7. Remove the tiltbase.

5.2. Removing the rear cover

1. Remove the tiltbase. (See 5.1.)

2. Remove the fixing screws(9pcs).

3. Remove the rear cover.

5.3. Removing the shieldplate

1. Remove the rear cover. (See 5.2.)

2. Remove the fixing screws(8psc).

3. Remove the shieldplate.

5.4. Removing the PHshieldplate and the PDshieldplate

1. Remove the shieldplate. (See 5.3.)

2. Remove the fixing screws(5psc).

3. Remove the PHshieldplate.

4. Remove the fixing screws(4psc).

5. Remove the PDshieldplate.

5.5. Removing the speaker box

1. Remove the shieldplate (See 5.3.)

2. Remove the fixing screwsA(2pcs) and B(2pcs).

3. Remove the angle.

4. Disconnect the coupler(A9), and unlock the cableclamper and

hook to free the cable

5. Remove the speaker box.

5.6. Removing the V-Board

1. Remove the speaker box. (See 5.5.)

2. Disconnect the coupler (A5).

3. Remove the fixing screw (1pcs).

4. Remove the V-Board.

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