Panasonic TX-32LX77M-MALAYSIA Bedienungsanleitung
© 2007 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TX-32LX77M-MALAYSIA
LH60 Chassis
WIDE LCD TV
Specifications
Power Source : AC AUTO 110-240V, 50/60 Hz
Power Consumption
Average Use 178W
Standby condition 0.9W
Display panel
Aspect Ratio 16:9
Visible screen size 698 mm (W) × 392 mm (H)
(No. of pixels) 1,049,088 (1,366 (W) × 768 (H))
Sound
Speaker 12 cm x 6 cm × 2 pcs, 4 Ω
Audio Output 20 W (10 W + 10 W), 10% THD
Headphones M3 (3.5 mm) Jack × 1
ORDER NO. MTV0701562CE
Receiving System / Band name
Aerial - Rear VHF / UHF
Operation Conditions Temperature : 0 °C - 40 °C
Humidity : 20% -- 80% RH (non-condensing)
Connection Terminals :
AV1 AUDIO L-R RCA PIN Type × 2 0.5 V[rms]
Input VIDEO RCA PIN Type × 1 1.0 V[p-p] (75Ω)
S VIDEO Mini DIN 4-pin Y: 1.0 V[p-p] (75Ω) C: 0.286 V[p-p] (75Ω)
AV2 AUDIO L-R RCA PIN Type × 2 0.5 V[rms]
Input VIDEO RCA PIN Type × 1 1.0 V[p-p] (75Ω)
COMPONENT Y 1.0 V[p-p] (including synchronization)
PB / CB , PR / CR ±0.35 V[p-p]
AV3 AUDIO L-R RCA PIN Type × 2 0.5 V[rms]
Input VIDEO RCA PIN Type × 1 1.0 V[p-p] (75Ω)
S VIDEO Mini DIN 4-pin Y: 1.0 V[p-p] (75Ω) C: 0.286 V[p-p] (75Ω)
Others HDMI 1/2 Input TYPE A Connectors
Audio for HDMI 1
Input
RCA PIN Type × 2 0.5 V[rms]
Audio Input RCA PIN Type × 2 0.5 V[rms]
Monitor AUDIO L-R RCA PIN Type × 2 0.5 V[rms] (high impedance)
Output VIDEO RCA PIN Type × 1 1.0 V[p-p] (75Ω)
Dimensions (W × H × D)
791 mm × 615 mm × 239 mm (With TV Stand) (32 inch)
791 mm × 563 mm × 129 mm (TV only) (32 inch)
Weight
18 kg Net
Notes:
Design and Specifications are subject to change without notice. Weight and Dimensions shown are approximate.
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TX-32LX77M-MALAYSIA
1 Safety Precautions 4
1.1. General Guidelines 4
1.2. Touch-Current Check 4
2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 5
3 About lead free solder (PbF) 6
4 Self Check Function 7
4.1. Self Check 7
4.2. Power LED Blinking timing chart 7
5 Chassis Board Layout 9
6 Location of Lead Wiring 10
6.1. Wire Dressing 10
6.2. Wire Dressing and connections 11
7 Disassembly for Service 12
7.1. AC CODE INSTALLATION 12
7.2. LCD MTG INSTALLATION 13
7.3. Installation Pedestal 14
7.4. EMI 15
7.5. REAR FIXING MTG (L/R) INSTALLATION 16
7.6. LCD PANEL ASSY INSTALLATION 17
8 Service Mode Adjustment 18
8.1. SERVICE 1 18
8.2. SERVICE 2 18
8.3. Self Check Mode 18
8.4. Hotel Mode Adjustment 18
9 Adjustment 20
9.1. Voltage chart of A Board 20
9.2. Voltage chart of AP Board 20
9.3. DVCO adjustment 20
10 Conductor Views 21
10.1. A-Board 21
10.2. A-Board 22
11 Schematic Diagram 23
11.1. Schematic Diagram Notes 23
11.2. A Board 24
11.3. AP Board 34
11.4. V Board 38
11.5. G Board 40
11.6. P Board 42
12 Parts Location & Mechanical Replacement Parts List 44
12.1. Parts Location 44
13 Packing Exploded View 45
14 Electrical Replacement Parts List 46
14.1. Electrical Replacement Parts List 47
CONTENTS
Page Page
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TX-32LX77M-MALAYSIA
1 Safety Precautions
1.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.2. Touch-Current Check
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground such
as a water pipe, as shown in Figure 1.
3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Check each exposed metallic part, and measure the voltage at each point.
6. The potential at any point (TOUGH CURRENT) expressed as voltage U1 and U2, does not exceed the following values:
For a. c.: U1 = 35 V (peak) and U2 = 0.35 V (peak);
For d. c.: U1 = 1.0 V,
NOTE :
The limit value of U2 = 0.35 V (peak) for a. c. and U1 = 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0mA
d. c.
The limit value U1 = 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100 kHz.
7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the customer.
Figure 1
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TX-32LX77M-MALAYSIA
2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are
called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-
effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the
incidence of component damage caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
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TX-32LX77M-MALAYSIA
3 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB..
Caution
• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40°C) higher.
Please use a high temperature soldering iron and set it to 700 20 °F (370 10 °C).
• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper)
solder.However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
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TX-32LX77M-MALAYSIA
4 Self Check Function
4.1. Self Check
1. Self-Check is used to automatically check the bus lines and hexadecimal code of the TV set.
2. To get into the Self -Check mode press the Down button on the customer controls at the front of the set, at the same time
pressing the MENU button on the remote control, and the screen will show :
3. Turn off the TV to reset JPEG Viewer mode after SELF-CHECK.
4.2. Power LED Blinking timing chart
1. Subject
Information of LED Flashing timing chart.
2. Contents
When an abonormality has occurred the unit, the protection circuit operates and reset to the stand by mode. At this time, the
defective block can be identified by the number of blinking of the Power LED on the front panel of the unit.
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TX-32LX77M-MALAYSIA
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TX-32LX77M-MALAYSIA
5 Chassis Board Layout
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TX-32LX77M-MALAYSIA
6 Location of Lead Wiring
6.1. Wire Dressing
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TX-32LX77M-MALAYSIA
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