Panasonic TX-32LX77M-MALAYSIA Bedienungsanleitung

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TX-32LX77M-MALAYSIA

LH60 Chassis

WIDE LCD TV

Specifications

Power Source : AC AUTO 110-240V, 50/60 Hz

Power Consumption

Average Use 178W

Standby condition 0.9W

Display panel

Aspect Ratio 16:9

Visible screen size 698 mm (W) × 392 mm (H)

(No. of pixels) 1,049,088 (1,366 (W) × 768 (H))

Sound

Speaker 12 cm x 6 cm × 2 pcs, 4 Ω

Audio Output 20 W (10 W + 10 W), 10% THD

Headphones M3 (3.5 mm) Jack × 1

ORDER NO. MTV0701562CE

Receiving System / Band name

Aerial - Rear VHF / UHF

Operation Conditions Temperature : 0 °C - 40 °C

Humidity : 20% -- 80% RH (non-condensing)

Connection Terminals :

AV1 AUDIO L-R RCA PIN Type × 2 0.5 V[rms]

Input VIDEO RCA PIN Type × 1 1.0 V[p-p] (75Ω)

S VIDEO Mini DIN 4-pin Y: 1.0 V[p-p] (75Ω) C: 0.286 V[p-p] (75Ω)

AV2 AUDIO L-R RCA PIN Type × 2 0.5 V[rms]

Input VIDEO RCA PIN Type × 1 1.0 V[p-p] (75Ω)

COMPONENT Y 1.0 V[p-p] (including synchronization)

PB / CB , PR / CR ±0.35 V[p-p]

AV3 AUDIO L-R RCA PIN Type × 2 0.5 V[rms]

Input VIDEO RCA PIN Type × 1 1.0 V[p-p] (75Ω)

S VIDEO Mini DIN 4-pin Y: 1.0 V[p-p] (75Ω) C: 0.286 V[p-p] (75Ω)

Others HDMI 1/2 Input TYPE A Connectors

Audio for HDMI 1

Input

RCA PIN Type × 2 0.5 V[rms]

Audio Input RCA PIN Type × 2 0.5 V[rms]

Monitor AUDIO L-R RCA PIN Type × 2 0.5 V[rms] (high impedance)

Output VIDEO RCA PIN Type × 1 1.0 V[p-p] (75Ω)

Dimensions (W × H × D)

791 mm × 615 mm × 239 mm (With TV Stand) (32 inch)

791 mm × 563 mm × 129 mm (TV only) (32 inch)

Weight

18 kg Net

Notes:

Design and Specifications are subject to change without notice. Weight and Dimensions shown are approximate.

TX-32LX77M-MALAYSIA

1 Safety Precautions 4

1.1. General Guidelines 4

1.2. Touch-Current Check 4

2 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices 5

3 About lead free solder (PbF) 6

4 Self Check Function 7

4.1. Self Check 7

4.2. Power LED Blinking timing chart 7

5 Chassis Board Layout 9

6 Location of Lead Wiring 10

6.1. Wire Dressing 10

6.2. Wire Dressing and connections 11

7 Disassembly for Service 12

7.1. AC CODE INSTALLATION 12

7.2. LCD MTG INSTALLATION 13

7.3. Installation Pedestal 14

7.4. EMI 15

7.5. REAR FIXING MTG (L/R) INSTALLATION 16

7.6. LCD PANEL ASSY INSTALLATION 17

8 Service Mode Adjustment 18

8.1. SERVICE 1 18

8.2. SERVICE 2 18

8.3. Self Check Mode 18

8.4. Hotel Mode Adjustment 18

9 Adjustment 20

9.1. Voltage chart of A Board 20

9.2. Voltage chart of AP Board 20

9.3. DVCO adjustment 20

10 Conductor Views 21

10.1. A-Board 21

10.2. A-Board 22

11 Schematic Diagram 23

11.1. Schematic Diagram Notes 23

11.2. A Board 24

11.3. AP Board 34

11.4. V Board 38

11.5. G Board 40

11.6. P Board 42

12 Parts Location & Mechanical Replacement Parts List 44

12.1. Parts Location 44

13 Packing Exploded View 45

14 Electrical Replacement Parts List 46

14.1. Electrical Replacement Parts List 47

CONTENTS

Page Page

TX-32LX77M-MALAYSIA

1 Safety Precautions

1.1. General Guidelines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

1.2. Touch-Current Check

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground such

as a water pipe, as shown in Figure 1.

3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Check each exposed metallic part, and measure the voltage at each point.

6. The potential at any point (TOUGH CURRENT) expressed as voltage U1 and U2, does not exceed the following values:

For a. c.: U1 = 35 V (peak) and U2 = 0.35 V (peak);

For d. c.: U1 = 1.0 V,

NOTE :

The limit value of U2 = 0.35 V (peak) for a. c. and U1 = 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0mA

d. c.

The limit value U1 = 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100 kHz.

7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be

repaired and rechecked before it is returned to the customer.

Figure 1

TX-32LX77M-MALAYSIA

2 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are

called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-

effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the

incidence of component damage caused by electro static discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,

which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum

foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can

generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable

conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing

together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to

damage an ES device).

TX-32LX77M-MALAYSIA

3 About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements.

In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.

The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).

That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d

suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB..

Caution

• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40°C) higher.

Please use a high temperature soldering iron and set it to 700 20 °F (370 10 °C).

• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb

solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto

the opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper)

solder.However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

TX-32LX77M-MALAYSIA

4 Self Check Function

4.1. Self Check

1. Self-Check is used to automatically check the bus lines and hexadecimal code of the TV set.

2. To get into the Self -Check mode press the Down button on the customer controls at the front of the set, at the same time

pressing the MENU button on the remote control, and the screen will show :

3. Turn off the TV to reset JPEG Viewer mode after SELF-CHECK.

4.2. Power LED Blinking timing chart

1. Subject

Information of LED Flashing timing chart.

2. Contents

When an abonormality has occurred the unit, the protection circuit operates and reset to the stand by mode. At this time, the

defective block can be identified by the number of blinking of the Power LED on the front panel of the unit.

TX-32LX77M-MALAYSIA

5 Chassis Board Layout

TX-32LX77M-MALAYSIA

6 Location of Lead Wiring

6.1. Wire Dressing

TX-32LX77M-MALAYSIA

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