Panasonic TX-LR32ET5 Bedienungsanleitung

Service Manual

LCD Television

TX-L32ET5B

TX-L32ET5Y

TX-LR32ET5

LA35 Chassis

Specifications

Power Source: 220-240V AC, 50 / 60Hz

Rated Power Consumption: 82W

Stand-by Power Consumption: 0.30W

Aerial Impedance: 75unbalanced, Coaxial Type

Receiving System: L32ET5B ( UK )

DVB-T/T2 Digital terrestrial services via UHF aerial input (MPEG2 and MPEG4-AVC(H.264))

PAL I UHF E21-E68

PAL 525/60 (AV only)

M.NTSC (AV only)

NTSC (AV only)

L32ET5B ( Ireland )

DVB-T Digital terrestrial services (MPEG2 and MPEG4-AVC(H.264))

PAL I VHF A-J

UHF E21-E69

CATV S1-S20

CATV S21-S41(Hyperband)

PAL 525/60 (AV only)

M.NTSC (AV only)

NTSC (AV only)

L32ET5Y

DVB-T/T2 Digital terrestrial services (MPEG2 and MPEG4-AVC(H.264))

DVB-C Digital cable services (MPEG2 and MPEG4-AVC(H.264))

PAL I/H, B/G,

SECAM B/G, L/L’

VHF E2-E12 VHF H1-H2 ( ITALY )

VHF A-H ( ITALY ) UHF E21-E69

CATV (S01-S05) CATV S1-S10(M1-M10)

CATV S11-S20 (U1-U10) CATV S21-S41 (HYPERBAND)

PAL D/K,

SECAM D/K

VHF R1-R2 VHF R3-R5

VHF R6-R12 UHF E21-E69

PAL 525/60 (AV only)

M.NTSC (AV only)

NTSC (AV only)

Unauthorized copying and

distribution is a violation of law.

ORDER No. PCZ1203055CE

LR32ET5

DVB-T/T2 Digital terrestrial services (MPEG2 and MPEG4-AVC(H.264))

DVB-C Digital cable services (MPEG2 and MPEG4-AVC(H.264))

PAL D/K,

SECAM D/K

VHF R1-R2 VHF R3-R5

VHF R6-R12 UHF E21-E69

PAL 525/60 (AV only)

M.NTSC (AV only)

NTSC (AV only)

Aerial - Rear: L32ET5B ( UK ) L32ET5B ( Ireland ) / L32ET5Y / LR32ET5

UHF VHF/UHF

Operating Conditions: Temperature: 0°C 35°C

Humidity: 20% 80% RH (non condensing)

Terminals:

AV1 IN Video (21 pin) 1V p-p 75

Audio (21 pin) 500mV rms 10k

RGB (21 pin) 0.7V p-p 75

AV1 OUT Video (21 pin) 1V p-p 75

Audio (21 pin) 500mV rms 1k

AV2 IN Video (RCAx1) 1V p-p 75

(COMPONENT/VIDEO) Audio (RCAx2) 500mV rms 10k(used for HDMI_ with the supplied AV cable)

Video (RCAx3) Y:1V p-p 75(including synchronization)

Pb, Pr: ±0.35V p-p 75

HDMI1, HDMI2, HDMI3, HDMI4 Type A Connectors

HDMI 1/3/4 :3D, Content Type, Deep Colour

HDMI 2 :3D, Content Type, Audio Return Channel, Deep Colour

This TV supports “HDAVI Control 5” function.

DIGITAL AUDIO OUT PCM / Dolby digital / DTS, Fiber optic

USB 1/2/3 USB 2.0 DC 5V Max 500mA

PC HIGH-DENSITY D_SUB 15PIN R,G,B: 700mV p-p 75

HD,VD/TTL Level 2-5V p-p (high impedance)

ETHERNET RJ45, IEEE802.3 10BASE-T / 100BASE-TX

CARD SLOT SD CARD slot x1

Common interface slot (Complies with CI+) x1

Wireless LAN:

Standard Compliance IEEE802.11a/n , IEEE802.11b/g/n

Frequency Range IEEE802.11a/n: 5.180 GHz – 5.320 GHz

5.500 GHz – 5.580 GHz

5.660 GHz – 5.700 GHz

IEEE802.11b/g/n: 2.412 GHz – 2.472 GHz

Security WPA2-PSK (TKIP/AES)

WPA-PSK (TKIP/AES)

WEP(64 bit/128 bit)

3D Eyewear:

Dimensions (W x H x D) 149mm x 44m x 171mm

Mass 18g

Lens Type Circularly-polarised filter

Usage Temperature Range 0°C 40°C

Materials Main body / Lens section: Resin

LCD screen: L5EDDYY00364

1920 x 1080, 16:9

Visible Diagonal 800mm

Audio Output: 20W (2 x 10W)

Headphones: 3.5mm, 8Impedance

Accessories supplied : Remote Control

2 x R6 (UM3) Batteries

SCART Cable

AV Cable

Dimensions:

Width: Height: Depth:

Including TV stand 764mm 519mm 230m

TV set only 764mm 473mm 52mm

Mass:

Including TV stand 11.5kg

TV set only 9.5kg

Design and Specifications are subject to change without notice. Mass and dimensions shown are approximate.

This equipment complies with the EMC standards listed below:

EN55013, EN61000-3-2, EN61000-3-3, EN55020, EN55022, EN55024

This service information is designed for experienced repair technicians only and is not designed for use by the general public. It does not

contain warnings or cautions to advise non-technical individuals of potencial dangers in attempting to service a product. Products

powered by electricity should be serviced or repaired only by experienced professional technicians. Any attempt to service or repair the

product or products deal within this service information by anyone else could result in serious injury or death.

Warning

CONTENTS

SAFETY PRECAUTIONS ........................................... 5

GENERAL GUIDE LINES...................................... 5

TOUCH – CURRENT CHECK............................... 5

PREVENTION OF ELECTROSTATIC DISCHARGE

(ESD) TO ELECTROSTATICALLY SENSITIVE (ES)

DEVICES .................................................................... 6

ABOUT LEAD FREE SOLDER (PBF)......................... 7

SUGGESTED PB FREE SOLDER........................ 7

APPLICABLE SIGNALS.............................................. 8

SERVICE HINTS ........................................................ 9

CHASSIS BOARD LAYOUT ..................................... 10

LOCATION OF LEAD WIRING ................................. 10

TECHNICAL DESCRIPTION ................................….11

SPECIFICATION OF KEY FOR CI PLUS,

DTCP-IP, ONE-TO-ONE, WIDEVINE, NETFLIX. 11

GENERAL INFORMATION ................................. 11

REPLACEMENT OF ICS..................................... 11

MODEL AND KEYS ............................................ 11

USB HDD RECORDING ..................................... 11

SETTING INSPECTION............................................ 12

SELF CHECK ........................................................... 13

HOTEL MODE .......................................................... 18

DATA COPY BY SD CARD....................................... 19

DATA COPY FROM TV SET TO SD CARD ............. 20

DATA COPY FROM SD CARD TO TV SET ............. 21

OPTION BYTES DESCRIPTION .............................. 22

ADJUSTMENT METHOD.......................................... 23

WIRING DIAGRAM ................................................... 24

BLOCK DIAGRAM (1 OF 3)...................................... 25

PARTS LOCATION................................................... 28

REPLACEMENT PARTS LIST.................................. 30

SCHEMATIC DIAGRAMS ......................................... 41

A-BOARD (1 OF 20) SCHEMATIC DIAGRAM .... 42

P-BOARD (1 OF 2) SCHEMATIC DIAGRAM ...... 62

FR-BOARD (1 OF 5) SCHEMATIC DIAGRAM.... 64

K-BOARD ............................................................ 69

CONDUCTOR VIEWS .............................................. 70

POWER LED BLINKING TIMING CHART ................ 14

SERVICE MODE FUNCTION ................................... 15

SERVICE ................................................................ 16

SERVICE TOOL MODE............................................ 17

Safety Precautions

General Guide Lines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated

or damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following touch current checks to prevent the customer from being exposed to shock hazards.

4. Always ensure cover label TBM4GU113 is correctly replaced before returning to customer (see Fig.1).

Touch-Current Check

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth

ground such as a water pipe, as shown in Fig. 2.

3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reserve the AC plug in the AC outlet and repeat each of the above measure.

6. The potential at any point (TOUCH CURRENT) expressed as voltage U1 and U2, does not exceed the following values:

For a. c.: U1 = 35 V (peak) and U2 = 0.35 V (peak);

For d. c.: U1 = 1.0 V,

Note:

The limit value of U2 = 0.35 V (peak) for a. c. and U1 = 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and

2.0 mA d. c.

The limit value U1 = 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100

kHz.

7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should

be repaired and rechecked before it is returned to the customer.

Fig. 2

APPLIANCES

EXPOSED

METAL PARTS

Resistance values in ohms ()

R0=500



RS=1500



CS=0.22



10k



0.022



COLD

WATER PIPE

(EARTH GROUND)

V: Voltmetr or oscilloscope

(r.m.s. or peak reading)

Measuring network for TOUCH CURRENTS

Input resistance: 1M



Input capacitance:200pF

Frequency range: 15Hz to 1MHz and d.c.respectively

NOTE – Appropriate measures should be taken to obtain the correct value in case of non-sinusoidal waveforms

U2(V)

Fig. 1

U1(V)

Prevention of Electrostatic Discharge (ESD) to Electrostatically

Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are

called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect

transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of

component damage caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on

your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD

wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as

aluminum foil, to prevent electrostatic charge build up or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD

protected)" can generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it.

(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil

or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective

material to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the

brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity

(ESD) sufficient to damage an ES device).

There are special components used in this equipment which are important for safety.

These parts are marked by in schematic diagrams, exploded views and replacement parts list. It is essential that

these critical parts should be replaced with manufacturer’s specified parts to prevent shock, fire, or other hazards. Do

not modify the original design without permission of manufacturer.

IMPORTANT SAFETY NOTICE

About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements.

In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.

The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).

That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work,

we’d suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol

stamped on the back of PCB.

Caution

Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40°C)

higher. Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before

applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

After applying PbF solder to double layered boards, please check the component side for excess solder which may

flow onto the opposite side. (see Fig.3)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.

However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used. (see Fig.4)

Fig.3

Fig.4

Applicable Signals

Applicable input signal for PC is basically compatible to VESA standard timing.

Signal name Horizontal frequency (kHz) Vertical frequency (Hz)

640 480 @60 Hz 31.47 59.94

800 600 @60 Hz 37.88 60.32

852 480 @60Hz 31.44 59.89

1,024 768 @60Hz 48.36 60.00

1,280 768 @60Hz 47.70 60.00

1,280 1,024 @60Hz 63.98 60.02

1,366 768 @60Hz 48.39 60.04

Applicable input signal for PC is basically compatible to HDMI standard timing.

Signal name Horizontal frequency (kHz) Vertical frequency (Hz)

640 480 @60 Hz 31.47 60.00

1,280 720 @60 Hz 45.00 60.00

1,920 1,080 @60Hz 67.50 60.00

Note:

Signals other than above may not be displayed properly.

The above signals are reformatted for optimal viewing on your display.

PC signal is magnified or compressed for display, so that it may not be possible to show fine detail

with sufficient clarity.

Signal name COMPONENT HDMI

525 (480) / 60i,60p * *

625 (576) / 50i, 50p * *

750 (720) / 60p, 50p * *

1,125 (1,080) / 60i, 50i * *

1,125 (1,080) / 60p *

1,125 (1,080) / 50p *

1,125 (1,080) / 24p *

PC (from D-sub 15P)

PC (from HDMI terminal)

Component (Y, Pb, Pr) (from AV2 terminal), HDMI

Service Hints

How to remove the backcover

Remove the 4 fixing screws, the 1 fixing screw and WIFI DONGLE. (see Fig.5)

Remove the 26 fixing screws, 4 caps and the backcover. (see Fig.6)

How to remove the pedestal assembly.

Lay the main unit face down. (see Fig.7)

Remove the 4 fixing screws and the pedestal assembly. (see Fig.8)

Fig.5

(1)

SCREWS

(1) THTD030J /1pcs/

(4) XYN4+F25FJK /4pcs/

(4)

(4) (4)

(4)

Fig.7 Fig.8

(4) (4)

(4)

(1) (1) (1) (1)

SCREWS

(1) THTD030J /13pcs/

(2) THEC1509 /13pcs/

(3) TKKL5521 /4pcs/

(1)

(1) (1)

(1)

(1) (1)

(1)

(3) (3)

Fig.6

(1)

(2)

(2) (2)

(2)

Chassis Board Layout

Location of Lead Wiring

To find the Part Number of required wire in Replacement Parts List click on the wire name in red box.

Board Name Function

A-Board AV Terminal, HDMI, HDMI Switch, USB, USB HUB, Digital Audio Out,

Tuner DVB-T/T2/C, DVB-T/T2/C Dem, SD Card, CI slot, PC, Ethernet,

Wireless LAN, Peaks IC, Speaker out, EEPROM, Flash Memory, DDR SDRAM

FR-Board Image Processor, SPI Flash

P-Board Main Input, Power Supply, Key control, Power switch

K-Board Remote Receiver, Power and Timer LED, C.A.T.S

P-BOARD

K-BOARD

A-BOARD

FR-BOARD

A02

SP_L

A10

A20

K10

A15

SP_R

TC11

A10-K10 WIRE

P4-LD WIRE

WIFI DONGLE CABLE

A02-P2 WIRE LVDS FFC

JK7100

TC02 TC01

CN CN

A12

TU6705

WIFI

A12-SPK WIRE

LVDS FFC3 LVDS FFC2

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