Panasonic TH-103PF12U Bedienungsanleitung

Unauthorized copying and distribution is a violation

of law.

Order Number ITD0911162CE

B34 Canada: D10

High Definition Plasma Display

Model No. TH-103PF12U

GPF12D Chassis

TABLE OF CONTENTS

PAGE PAGE

1 Safety Precautions----------------------------------------------- 3

1.1. General Guidelines---------------------------------------- 3

2 Warning -------------------------------------------------------------- 4

2.1. Prevention of Electrostatic Discharge (ESD)

to Electrostatically Sensitive (ES) Devices---------- 4

2.2. About lead free solder (PbF)---------------------------- 5

3 Service Navigation ----------------------------------------------- 6

3.1. Service Hint ------------------------------------------------- 6

3.2. Applicable signals ----------------------------------------- 8

4 Specifications ----------------------------------------------------10

5 Operating Instructions-----------------------------------------11

6 Service Mode -----------------------------------------------------13

6.1. CAT (Computer Aided Test) mode -------------------13

6.2. IIC mode structure (following items value is

sample data) -----------------------------------------------16

7 Troubleshooting Guide ----------------------------------------17

7.1. Self Check--------------------------------------------------17

7.2. No Power ---------------------------------------------------19

7.3. No Picture --------------------------------------------------19

7.4. Local screen failure-------------------------------------- 20

8 Service Fixture & Tools --------------------------------------- 21

8.1. SC jig-------------------------------------------------------- 21

9 Disassembly and Assembly Instructions--------------- 22

9.1. Rear Cover and Board---------------------------------- 22

9.2. Location of Rear Cover screws----------------------- 23

9.3. Removal of Side Angle (L), (R) ----------------------- 25

9.4. Removal of HHH-Board -------------------------------- 26

9.5. Removal of HA-Board----------------------------------- 27

9.6. Removal of H5-Board ----------------------------------- 27

9.7. Removal of DS-Board ---------------------------------- 27

9.8. Removal of HX-Board----------------------------------- 28

9.9. Removal of DN-Board ---------------------------------- 28

9.10. Removal of PB-Board----------------------------------- 29

9.11. Removal of D-Board------------------------------------- 29

9.12. Removal of P-Board (MAIN_1) ----------------------- 29

9.13. Removal of P-Board (MAIN_2) ----------------------- 30

9.14. Removal of P-Board (SUB)---------------------------- 30

9.15. Removal of S1-Board and V2-Board---------------- 30

TH-103PF12U

9.16. Removal of SU-Board ---------------------------------- 31

9.17. Removal of SM-Board ---------------------------------- 32

9.18. Removal of SD-Board ---------------------------------- 32

9.19. Removal of SC-Board----------------------------------- 33

9.20. Removal of SS2-Board -------------------------------- 34

9.21. Removal of SS3-Board -------------------------------- 35

9.22. Removal of SS-Board ----------------------------------- 35

9.23. Removal of Fan------------------------------------------- 36

9.24. Removal of C1-Board (upper) ------------------------ 37

9.25. Removal of C2-Board (upper) ------------------------ 37

9.26. Removal of C3-Board (upper) ------------------------ 38

9.27. Removal of C4-Board (upper) ------------------------ 38

9.28. Removal of C5-Board (upper) ------------------------ 39

9.29. Removal of C6-Board (upper) ------------------------ 39

9.30. Removal of C1-Board (lower) ------------------------- 39

9.31. Removal of C2-Board (lower) ------------------------- 40

9.32. Removal of C3-Board (lower) ------------------------- 40

9.33. Removal of C4-Board (lower) ------------------------- 40

9.34. Removal of C5-Board (lower) ------------------------- 41

9.35. Removal of C6-Board (lower) ------------------------- 41

9.36. Removal of AC Inlet ------------------------------------- 41

9.37. Removal of Front Glass, V1, V3-Board and

Cabinet Assy ---------------------------------------------- 42

9.38. Removal of Plasma Display Panel------------------- 45

10 Measurements and Adjustments -------------------------- 50

10.1. Adjustment Procedure ---------------------------------- 50

10.2. Adjustment ------------------------------------------------- 55

11 Block Diagram --------------------------------------------------- 59

11.1. Diagram Notes ------------------------------------------- 59

11.2. Main Block (1 of 2) Diagram--------------------------- 60

11.3. Main Block (2 of 2) Diagram--------------------------- 61

11.4. Block (1 of 8) Diagram ---------------------------------- 62

11.5. Block (2 of 8) Diagram ---------------------------------- 63

11.6. Block (3 of 8) Diagram ---------------------------------- 64

11.7. Block (4 of 8) Diagram ---------------------------------- 65

11.8. Block (5 of 8) Diagram ---------------------------------- 66

11.9. Block (6 of 8) Diagram ---------------------------------- 67

11.10. Block (7 of 8) Diagram ---------------------------------- 68

11.11. Block (8 of 8) Diagram ---------------------------------- 69

12 Wiring Connection Diagram --------------------------------- 71

12.1. Wiring (1) --------------------------------------------------- 71

12.2. Wiring (2) --------------------------------------------------- 72

12.3. Wiring (3) --------------------------------------------------- 73

13 Exploded View and Replacement Parts List ----------- 74

TH-103PF12U

1 Safety Precautions

1.1. General Guidelines

1. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.

2. When wiring units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the

wires have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.

3. When conducting repairs and servicing, do not twist the Faston connectors but plug them straight in or unplug them straight

out.

4. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

5. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

1.1.1. Leakage Current Cold Check

1. Unplug the AC cord and connect a jumper between the

two prongs on the plug.

2. Measure the resistance value, with an ohmmeter,

between the jumpered AC plug and each exposed metal-

lic cabinet part on the equipment such as screwheads,

connectors, control shafts, etc. When the exposed metal-

lic part has a return path to the chassis, the reading

should be between 1Mohm and 5.2Mohm.

When the exposed metal does not have a return path to

the chassis, the reading must be .

Figure 1

1.1.2. Leakage Current Hot Check (See

Figure 1.)

1. Plug the AC cord directly into the AC outlet. Do not use

an isolation transformer for this check.

2. Connect a 1.5kohm, 10 watts resistor, in parallel with a

0.15µF capacitors, between each exposed metallic part

on the set and a good earth ground such as a water pipe,

as shown in Figure 1.

3. Use an AC voltmeter, with 1000 ohms/volt or more sensi-

tivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the volt-

age at each point.

5. Reverse the AC plug in the AC outlet and repeat each of

the above measurements.

6. The potential at any point should not exceed 0.75 volts

RMS. A leakage current tester (Simpson Model 229 or

equivalent) may be used to make the hot checks, leakage

current must not exceed 1/2 milliamp. In case a measure-

ment is outside of the limits specified, there is a possibility

of a shock hazard, and the equipment should be repaired

and rechecked before it is returned to the customer.

TH-103PF12U

2 Warning

2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensi-

tive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-

trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and

semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage

caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,

which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-

num foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can

generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-

ble conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brush-

ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient

to damage an ES device).

TH-103PF12U

2.2. About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements.

In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.

The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).

That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d

suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.

Caution

• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please

use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-

der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the

opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-

ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

TH-103PF12U

3 Service Navigation

3.1. Service Hint

TH-103PF12U

Board Name Function Board Name Function

DN Digital Signal Processor, Microcomputer S1 Power switch

D Format Converter, Plasma AI Processor

Sub-Field Processor

C1 (upper) Data drive (1) (upper)

C2 (upper) Data drive (2) (upper)

DS Slot Interface (Audio / Video / Sync Input Switch),

Sync Processor, Audio Processor, DC-DC Converter

C3 (upper) Data drive (3) (upper)

C4 (upper) Data drive (4) (upper)

SC Scan drive C5 (upper) Data drive (5) (upper)

SU Scan out (Upper)

Non serviceable.

SU-Board should be exchanged for service.

C6 (upper) Data drive (6) (upper)

C1 (lower) Data drive (1) (lower)

C2 (lower) Data drive (2) (lower)

SM Scan out (Middle)

Non serviceable.

SM-Board should be exchanged for service.

C3 (lower) Data drive (3) (lower)

C4 (lower) Data drive (4) (lower)

C5 (lower) Data drive (5) (lower)

SD Scan out (Lower)

Non serviceable.

SD-Board should be exchanged for service.

C6 (lower) Data drive (6) (lower)

P(MAIN_1) Power supply

P(MAIN_2) Power supply

SS Sustain drive P(SUB) Power supply

SS2 Sustain out (Upper) PB Fan Control

SS3 Sustain out (Lower) HX PC / RS-232C

V1 LED-G, R H5 Audio Out terminal

V2 Key switch HHH Dual HDMI terminal

V3 Remote receiver HA Component Video terminal (BNC)

TH-103PF12U

3.2. Applicable signals

TH-103PF12U

4 Specifications

Power Source 200-240 V AC, 50/60Hz

Power Consumption

Power on 1400 W

Stand-by condition Save OFF 1.2 W, Save ON 0.7 W

Power off condition 0.4 W

Plasma Display panel Drive method: AC type 103-inch,

16:9 aspect ratio

Screen size 89.3" (2,269 mm) (W) ×50.2" (1,276 mm) (H) ×102.4" (2,603 mm) (diagonal)

(No. of pixels) 2,073,600 (1,920 (W) ×1,080 (H)) [5,760 ×1,080 dots]

Operating condition

Temperature 32 °F - 104 °F (0 °C - 40 °C)

Humidity 20 % - 80 %

Applicable signals

Scanning format 525 (480) / 60i 60p, 625 (575) / 50i 50p, 750 (720) / 60p 50p, 1125 (1080) /

60i 60p 50i 50p 24p 25p 30p 24sF, 1250 (1080) / 50i

PC signals VGA, SVGA, XGA, SXGA

UXGA ..... (compressed)

Horizontal scanning frequency 15 - 110 kHz

Vertical scanning frequency 48 - 120 Hz

Connection terminals

HDMI A-B TYPE A Connector ×2

COMPONENT / RGB IN Y / G (BNC) with sync 1.0 Vp-p (75-ohm)

PB/B (BNC), PR/R (BNC) 0.7 Vp-p (75-ohm)

AUDIO IN (RCA PIN JACK ×2) 0.5 Vrms

PC IN (HIGH-DENSITY Mini-D-SUB 15PIN) Y or G with sync 1.0 Vp-p (75-ohm)

Y or G without sync 0.7 Vp-p (75-ohm)

B / PB/ CB: 0.7 Vp-p (75-ohm)

R / PR/ CR: 0.7 Vp-p (75-ohm)

HD / VD: 1.0 - 5.0 Vp-p (high impedance)

AUDIO IN (M3 JACK) 0.5 Vrms

SERIAL EXTERNAL CONTROL TERMINAL (D-SUB 9PIN) RS-232C COMPATIBLE

AUDIO OUT RCA PIN JACK ×2 (L / R)

OUTPUT LEVEL : VARIABLE (- - 0 dB) [INPUT 1KHz / 0dB, 10Kohm Load]

Accessories Supplied

Remote Control Transmit-

ter

EUR7636070R

Batteries AA Size ×2

Fixing band TMME203 ×2

Dimensions (W ×H ×D) 95.0" (2,412 mm) ×55.9" (1,419 mm) ×5.1" (129 mm) (5.6" (141 mm) when including protruding portion of slots)

Mass (weight) approx. 443.2 lbs

Note:

• Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.

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