Panasonic TH-42PHD6A Bedienungsanleitung

ORDERNO. ITD0310049A3

High Difinition WidePlasmaDisplay

TH-42PHD6AY

GPH6D

Please fileand use thismanual togetherwiththeservice manual for

Model No.TH-42PHD6UY, OrderNo.ITD0308027C0.

Unauthorizedcopying and distribution isaviolation oflaw.

1. Difference point

1.1. Mechanical ReplacementParts List

Ref. No. PartNo. PartsName&Description

Remarks

TH-42PHD6UY TH-42PHD6AY

K2CG3DH00025 K2CK3DH00017 ACCORD CHANGED

TPCB40402 TPCB34120 CARTONBOX CHANGED

TPDA0675 ----- CUSHION(UPPERRIGHT/LEFT) DELTED

TPDA0676 ----- CUSHION(UPPERCENTER) DELTED

TPDA0794 ----- CUSHION(BOTTOMRIGHT/LEFT DELTED

TPDF0905 ----- PAD(UPPER) DELTED

TPGA2141 ----- CARTONBOX DELTED

TPGA2150 ----- BOTTOMCARTON DELTED

TQBC0570 TQBC0582 INSTRUCTIONBOOK(ENGLISH) CHANGED

TQBC0571 ----- INSTRUCTIONBOOK(FRENCH) DELTED

TQBC0572 ----- INSTRUCTIONBOOK(SPANISH) DELTED

TTUA0675 TTUA0730 REARCOVER CHANGED

ORDERNO. ITD0308027C0

D10 Canada:B07

High Definition PlasmaDisplay

TH-42PHW6EX / TH-42PHD6EX / TH-42PHD6BX/ TH-

42PHD6UY

GPH6DChassis

SPECIFICATIONS

Specifications

PowerSource: AC120V50/60Hz(UYversion)

AC220-240V50/60Hz

(ExceptUYversion model)

PowerConsumption: 265 W

Saveoff 1.6W, Saveon 0.9W (stand-by

condition)

(UYversion)

Saveoff 1.9W, Saveon 1.1W (stand-by

condition)

(ExceptUYversion model)

0.2W (Poweroff condition)

(UYversion model)

0.4W (Poweroff condition)

(ExceptUYversion model)

Plasma Displaypanel:Drivemethod ACtype

16:9aspectratio

ContrastRatio 3000:1

Screen size: 920 mm (W)×518 mm (H)

1,056 mm (diagonal)

No. ofpixels

786,432 (1,024 (W)×768 (H))

[3,072 ×768 dots]

Operating condition:

Temperature 34 °F -104 °F (0°C-40 °C)

Humidity 20 %-80 %

Horizontal scanning frequency15 -110kHz

Vertical scanning frequency48 -120Hz

Connection terminals:

Video in 1.0Vp-p (75-ohm)

S-VIDEOIN/ (MINI DIN

4PIN) Y:1Vp-p (75-ohm), C:0.286 Vp-p

(75-ohm)

AUDIOIN/ (RCAPIN

JACK ×2) 0.5Vrms (high impedance)

COMPONENT/RGB

Y/G 1.0Vp-p/composite(75-ohm)

0.7Vp-p/non-composite(75-ohm)

PB/B 0.7Vp-p (75-ohm)

PR/R 0.7Vp-p (75-ohm)

HD 1.0-5.0Vp-p (high impedance)

VD 1.0-5.0Vp-p (high impedance)

AUDIOIN

(RCAPINJACK×2) 0.5Vrms (high impedance)

(HIGH-DENSITY

D-SUB15PIN) R,G,B/0.7Vp-p (75-ohm)

HD, VD/1.0-5.0Vp-p (high

impedance)

AUDIOIN(M3JACK) 0.5Vrms (high impedance)

SERIAL

EXTERNAL CONTROL

TERMINAL (D-SUB9PIN) RS-232CCOMPATIBLE

SPEAKERS(External

speakers)(6 ) 16W [8W+8W](10%THD)

Dimensions(W×H×D):1,020 mm ×610 mm 89 mm

Weight(Mass) approx. 29.5kg net(main unitonly)

approx. 33.7kg net(with speakers)

Unauthorizedcopying and distribution isaviolation oflaw.

1. Applicablesignals

2. SafetyPrecautions

2.1. General Guidelines

1. Whenservicing, observetheoriginal leaddress. Ifashortcircuit

isfound, replace all parts whichhavebeenoverheatedor

damagedbytheshortcircuit.

2. Afterservicing, see toitthat all theprotectivedevices suchas

insulation barriers, insulation papersshieldsareproperlyinstalled.

3. Afterservicing, make thefollowing leakagecurrentchecks to

preventthecustomerfrombeing exposedtoshock hazards.

2.1.1. LeakageCurrentColdCheck

1. Unplug theACcordand connect ajumperbetweenthetwoprongs

on theplug.

2. Measuretheresistance value, withanohmmeter, betweenthe

jumperedACplug and eachexposedmetalliccabinet parton the

equipmentsuchas screwheads, connectors, control shafts, etc.

Whentheexposedmetallicparthas areturnpathtothechassis,

thereading shouldbebetween1M and 5.2M . / Whenthe

exposedmetal does nothaveareturnpathtothechassis, the

reading must be . Figure1

2.1.2. LeakageCurrentHotCheck (See Figure 1 .)

1. Plug theACcorddirectlyintotheACoutlet. Donotuse an

isolation transformerforthischeck.

2. Connect a1.5k , 10 watts resistor, inparallel witha0.15 F

capacitors, betweeneachexposedmetallicparton theset and a

good earthground suchas awaterpipe, as shownin Figure1.

3. Use anACvoltmeter, with1000 ohms/voltormoresensitivity, to

measurethepotential across theresistor.

4. Check eachexposedmetallicpart, and measurethevoltageat

eachpoint.

5. Reverse theACplug intheACoutlet and repeat eachoftheabove

measurements.

6. Thepotential at anypointshouldnotexceed0.75 volts RMS. A

leakagecurrenttester(Simpson Model 229 orequivalent) maybe

usedtomake thehotchecks, leakagecurrentmust notexceed1/2

milliamp. Incase ameasurementisoutsideofthelimits specified,

thereisapossibilityofashock hazard, and theequipmentshould

berepairedand recheckedbeforeitisreturnedtothecustomer.

3. Prevention of ElectroStaticDischarge (ESD) to

ElectrostaticallySensitive(ES) Devices

Somesemiconductor (solidstate)devices canbedamagedeasilybystaticelectricity. Such

componentscommonlyarecalledElectrostaticallySensitive (ES)Devices. Examples oftypical

ES devices areintegratedcircuitsand somefield-effecttransistorsand semiconductor "chip"

components. Thefollowing techniques shouldbeusedtohelpreduce theincidence of

componentdamagecausedbyelectro staticdischarge(ESD).

1. Immediatelybeforehandling anysemiconductorcomponentor

semiconductor-equippedassembly, drainoff anyESDon your

bodybytouching aknownearthground. Alternatively, obtainand

wearacommerciallyavailabledischarging ESDwrist strap,

whichshouldberemovedforpotential shock reasonspriorto

applying powertotheunitundertest.

2. Afterremoving anelectrical assemblyequippedwithES devices,

place theassemblyon aconductivesurface suchas alminumfoil,

topreventelectrostaticchargebuildup orexposureofthe

assembly.

3. Use onlyagrounded-tipsoldering iron tosolderorunsolderES

devices.

4. Use onlyananti-staticsolderremoval device. Somesolder

removal devices notclassifiedas "anti-static(ESDprotected)"can

generate electrical chargesufficienttodamageES devices.

5. Donotuse freon-propelledchemicals. These cangenerate

electrical charges sufficienttodamageES devices.

6. DonotremoveareplacementES device fromits protective

packageuntil immediatelybeforeyou arereadytoinstall it. (Most

replacementES devices arepackagedwithleadselectrically

shortedtogetherbyconductivefoam, alminumfoil or

comparableconductivematerial).

7. Immediatelybeforeremoving theprotectivematerial fromthe

leadsofareplacementES device, touchtheprotectivematerial to

thechassisorcircuitassemblyintowhichthedevice will be

installed.

Caution

Besureno powerisappliedtothechassisorcircuit, and observe

all othersafetyprecautions.

8. Minimizebodilymotionswhenhandling unpackagedreplacement

ES devices. (Otherwise hamless motion suchas thebrushing

togetherofyourclothes fabricorthelifting ofyourfootfroma

carpetedfloorcangenerate staticelectricity(ESD)sufficient

todamageanES device).

4. About lead free solder(PbF)

Note:Leadislistedas (Pb)intheperiodictableofelements.

Intheinformation below, Pbwill refertoLeadsolder, and PbF will refertoLeadFree Solder.

TheLeadFree Solderusedinour manufacturing process and discussedbelowis(Sn+Ag+Cu).

ThatisTin(Sn), Silver(Ag)and Copper(Cu)although othertypes areavailable.

Thismodel uses PbFree solderinit’smanufactureduetoenvironmental conservation issues.

For service and repairwork, we’dsuggesttheuse ofPbfree solderas well, although Pbsolder

may beused.

PCBsmanufacturedusing leadfree solderwill have thePbF withinaleafSymbol

stampedon theback ofPCB.

Caution

-Pbfree solderhas ahighermelting pointthanstandardsolder.

Typicallythemelting pointis50 ~70 °F(30~40 °C)higher. Please

use ahigh temperaturesoldering iron and set itto700 ±20 °F(370

±10 °C).

-Pbfree solderwill tend tosplashwhenheatedtoo high (about1100

°For600 °C).

Ifyou must use Pbsolder, please completelyremoveall ofthePb

free solderon thepinsorsolderarea beforeapplying Pbsolder. If

thisisnotpractical, besuretoheat thePbfree solderuntil itmelts,

beforeapplying Pbsolder.

-Afterapplying PbF soldertodoublelayeredboards, please check

thecomponentsideforexcess solderwhichmayflow ontothe

opposite side. (see figurebelow)

SuggestedPbfree solder

Thereareseveral kindsofPbfree solderavailablefor purchase. Thisproductuses Sn+Ag+Cu

(tin, silver, copper)solder. However, Sn+Cu(tin, copper), Sn+Zn+Bi (tin, zinc, bismuth)soldercan

alsobeused.

5. PCB Structuresheet of GPH6Dchassis

Board Name Function Remarks

DDigital Signal Processor 1

JSlotInterface &SYNC

processor 1

ZAudioout, DC-DC converter

SS SustainOut 1

SC Scanout 1

SU Sustainconnection (Upper) 1

SD Sustainconnection (Lower) 1

C1 DataDrive (UpperRight)

C2 DataDrive (UpperLeft)

C3 DataDrive (LowerLeft)

C4 DataDrive (LowerLeft)

H3 Speakerterminal

S1 Powerswitch

SS2 Sustainconnection (Upper)

SS3 Sustainconnection (Lower)

V1 FrontSW. &Remotereceiver

PF Linefilter

PPowersupply 1

HX PC_type_Inputterminal

HY BNC Composite/Component

Video 2

HZ BNC ComponentVideo 3

Remarks

1. Recommend PCB'sforinitial service forGPH6Dchassis.

2. ForSystemmodel exceptBX, EX version

3. ForConsumermodel exceptBX, EX version

6. Service Hint

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