Panasonic TH-65PHD8BK Bedienungsanleitung

ORDERNO. ITD0509054CE

D10

High Definition PlasmaDisplay

TH-65PHD8BK / TH-65PHD8EK/ TH-65PHD8UK

GPH8DChassis

SPECIFICATIONS

Specifications

Power

Source (UK) 120 VAC, 50/60Hz

Power

Source (BK/EK) 220 -240 VAC, 50/60 Hz

Power

Consumption (UK)

Maximum 675 W

Stand-bycondition SaveOFF 0.7W, SaveON0.5W

Poweroff condition 0.2W

Power

Consumption (BK/EK)

Normal use 615 W

Stand-bycondition Saveoff 0.9W, Saveon 0.7W

Poweroff condition 0.35 W

Plasma

Displaypanel Drivemethod:ACtype65-inch, 16:9aspectratio

ContrastRatio 3000:1

Screen

size 56.5”(1,434 mm)(W)×31.7”(806 mm)(H)×65”(1,645 mm)(diagonal)

(No. ofpixels) 1,049,088 (1,366 (W)×768 (H)) [4,098 ×768 dots]

Operating

condition

Temperature 32 °F -104 °F (0°C-40 °C)

Humidity 20 %-80 %

Applicable

signals

ColorSystem NTSC, PAL, PAL60, SECAM, Modified NTSC

Scanning format 525 (480)/ 60i 60p, 625 (575)/ 50i 50p, 750 (720)/ 60p 50p, 1125 (1080)/ 60i 50i 24p 25p

30p

24sF .... SMPTE274M, 1250 (1080)/ 50i

PCsignals VGA, SVGA, XGA, SXGA, UXGA..... (compressed)

Horizontal scanning frequency15 -110 kHz

Vertical scanning frequency48 -120 Hz

Connection

terminals

AV VIDEOIN/ OUT(BNC) 1.0Vp-p (75-ohmorhigh impedance)

SVIDEOIN(MINI DIN4PIN) Y:1Vp-p (75-ohm), C:0.286 Vp-p (75-ohm)

AUDIOIN(RCAPINJACK ×2) 0.5Vrms (high impedance)

COMPONENT/ RGB(UK) Y/ G(BNC) 1.0Vp-p / composite(75-ohm)

0.7Vp-p / non-composite(75-ohm)

PB/B(BNC), PR/R(BNC) 0.7Vp-p (75-ohm)

AUDIOIN(RCAPINJACK ×2) 0.5Vrms (high impedance)

PC(UK) (HIGH-DENSITYMini-D-SUB 15PIN) R,G,B/ 0.7Vp-p (75-ohm)

HD, VD/ 1.0-5.0Vp-p (high impedance)

Component

Y:1.0Vp-p (75-ohm:includesync)

PB/ CB:0.7Vp-p (75-ohm)

PR/ CR:0.7Vp-p (75-ohm)

AUDIOIN(M3JACK) 0.5Vrms (high impedance)

PC(BK/EK) (HIGH-DENSITYMini-D-SUB 15PIN) R,G,B/ 0.7Vp-p (75-ohm)

HD, VD/ 1.0-5.0Vp-p (high impedance)

AUDIOIN(M3JACK) 0.5Vrms (high impedance)

SERIAL EXTERNAL CONTROL TERMINAL (D-SUB 9PIN) RS-232CCOMPATIBLE

SPEAKERS(8 ) 20 W [10 W +10 W](10 %THD)

Accessories

Supplied

RemoteControl Transmitter EUR7636070R

(UK)

RemoteControl Transmitter EUR7636090R

(BK/EK)

Batteries (UK) 2×AA Size

Batteries (BK/EK) 2×R6Size

Fixing bands (TMME203)×2

Dimensions

(W ×H×D) 61.2”(1,554 mm)×36.4”(925 mm)×3.9”(99 mm)

(exclusiveofprotruding portion)

Mass

(weight) (UK)

main unitonly approx. 172.0lbs

with speakers approx. 181.7lbs

Mass

(weight) (BK/EK)

main unitonly approx. 78.0kg net

with speakers approx. 82.4kg

Notes

Design

and specificationsaresubjectto changewithout notice. Mass and dimensionsshownareapproximate.

This

equipment complies with theEMC standardslistedbelow. EN55022, EN55024, EN61000-3-2, EN61000-3-3. (BK/EK)

1. Applicablesignals

2. SafetyPrecautions

2.1. General Guidelines

1. Whenservicing, observetheoriginal leaddress. Ifashortcircuit

isfound, replace all parts whichhavebeenoverheatedor

damagedbytheshortcircuit.

2. Afterservicing, see toitthat all theprotectivedevices suchas

insulation barriers, insulation papersshieldsareproperlyinstalled.

3. Afterservicing, make thefollowing leakagecurrentchecks to

preventthecustomerfrombeing exposedtoshock hazards.

2.1.1. LeakageCurrentColdCheck

1. Unplug theACcordand connect ajumperbetweenthetwoprongs

on theplug.

2. Measuretheresistance value, withanohmmeter, betweenthe

jumperedACplug and eachexposedmetalliccabinet parton the

equipmentsuchas screwheads, connectors, control shafts, etc.

Whentheexposedmetallicparthas areturnpathtothechassis,

thereading shouldbebetween1M and 5.2M . / Whenthe

exposedmetal does nothaveareturnpathtothechassis, the

reading must be . Figure1

2.1.2. LeakageCurrentHotCheck (See Figure 1 .)

1. Plug theACcorddirectlyintotheACoutlet. Donotuse an

isolation transformerforthischeck.

2. Connect a1.5k , 10 watts resistor, inparallel witha0.15 F

capacitors, betweeneachexposedmetallicparton theset and a

good earthground suchas awaterpipe, as shownin Figure1.

3. Use anACvoltmeter, with1000 ohms/voltormoresensitivity, to

measurethepotential across theresistor.

4. Check eachexposedmetallicpart, and measurethevoltageat

eachpoint.

5. Reverse theACplug intheACoutlet and repeat eachoftheabove

measurements.

6. Thepotential at anypointshouldnotexceed0.75 volts RMS. A

leakagecurrenttester(Simpson Model 229 orequivalent) maybe

usedtomake thehotchecks, leakagecurrentmust notexceed1/2

milliamp. Incase ameasurementisoutsideofthelimits specified,

thereisapossibilityofashock hazard, and theequipmentshould

berepairedand recheckedbeforeitisreturnedtothecustomer.

3. Prevention of ElectroStaticDischarge (ESD) to

ElectrostaticallySensitive(ES) Devices

Somesemiconductor (solidstate)devices canbedamagedeasilybystaticelectricity. Such

componentscommonlyarecalledElectrostaticallySensitive (ES)Devices. Examples oftypical

ES devices areintegratedcircuitsand somefield-effecttransistorsand semiconductor "chip"

components. Thefollowing techniques shouldbeusedtohelpreduce theincidence of

componentdamagecausedbyelectro staticdischarge(ESD).

1. Immediatelybeforehandling anysemiconductorcomponentor

semiconductor-equippedassembly, drainoff anyESDon your

bodybytouching aknownearthground. Alternatively, obtainand

wearacommerciallyavailabledischarging ESDwrist strap, which

shouldberemovedforpotential shock reasonspriortoapplying

powertotheunitundertest.

2. Afterremoving anelectrical assemblyequippedwithES devices,

place theassemblyon aconductivesurface suchas aluminum

foil, topreventelectrostaticchargebuildup orexposureofthe

assembly.

3. Use onlyagrounded-tipsoldering iron tosolderorunsolderES

devices.

4. Use onlyananti-staticsolderRemovedevice. Somesolder

Removedevices notclassifiedas "anti-static(ESDprotected)"can

generate electrical chargesufficienttodamageES devices.

5. Donotuse freon-propelledchemicals. These cangenerate

electrical charges sufficienttodamageES devices.

6. DonotremoveareplacementES device fromits protective

packageuntil immediatelybeforeyou arereadytoinstall it. (Most

replacementES devices arepackagedwithleadselectrically

shortedtogetherbyconductivefoam, aluminumfoil orcomparable

conductivematerial).

7. Immediatelybeforeremoving theprotectivematerial fromthe

leadsofareplacementES device, touchtheprotectivematerial to

thechassisorcircuitassemblyintowhichthedevice will be

installed.

Caution

Besureno powerisappliedtothechassisorcircuit, and observe

all othersafetyprecautions.

8. Minimizebodilymotionswhenhandling unpackagedreplacement

ES devices. (Otherwise hamless motion suchas thebrushing

togetherofyourclothes fabricorthelifting ofyourfootfroma

carpetedfloorcangenerate staticelectricity(ESD)sufficient

todamageanES device).

4. About lead free solder(PbF)

Note:Leadislistedas (Pb)intheperiodictableofelements.

Intheinformation below, Pbwill refertoLeadsolder, and PbF will refertoLeadFree Solder.

TheLeadFree Solderusedinour manufacturing process and discussedbelowis(Sn+Ag+Cu).

ThatisTin(Sn), Silver(Ag)and Copper(Cu)although othertypes areavailable.

Thismodel uses PbFree solderinit’smanufactureduetoenvironmental conservation issues.

For service and repairwork, we’dsuggesttheuse ofPbfree solderas well, although Pbsolder

may beused.

PCBsmanufacturedusing leadfree solderwill have thePbF withinaleafSymbol

stampedon theback ofPCB.

Caution

-Pbfree solderhas ahighermelting pointthanstandardsolder.

Typicallythemelting pointis50 ~70 °F(30~40 °C)higher. Please

use ahigh temperaturesoldering iron and set itto700 ±20 °F(370

±10 °C).

-Pbfree solderwill tend tosplashwhenheatedtoo high (about1100

°For600 °C).

Ifyou must use Pbsolder, please completelyremoveall ofthePb

free solderon thepinsorsolderarea beforeapplying Pbsolder. If

thisisnotpractical, besuretoheat thePbfree solderuntil itmelts,

beforeapplying Pbsolder.

-Afterapplying PbF soldertodoublelayeredboards, please check

thecomponentsideforexcess solderwhichmayflow ontothe

opposite side. (see figurebelow)

SuggestedPbfree solder

Thereareseveral kindsofPbfree solderavailablefor purchase. Thisproductuses Sn+Ag+Cu

(tin, silver, copper)solder. However, Sn+Cu(tin, copper), Sn+Zn+Bi (tin, zinc, bismuth)soldercan

alsobeused.

5. PCB Structuresheet of GPH8Dchassis

Board Name Function Remarks

DDigital Signal Processor,

FormatConverter,

PlasmaAIProcessor

JSlotInterface (Audio/Video/Sync

inputSwitch), SYNC processor,

Audioprocessor,

Speakeroutamplifier,

DC-DC converter

SS Sustaindrive 1

SC Scandrive 1

SU Scanout(Upper) 1

SD Scanout(Lower) 1

C1 DataDrive (UpperRight)

C2 DataDrive (UpperCenter)

C3 DataDrive (UpperLeft)

C4 DataDrive (LowerLeft)

C5 DataDrive (LowerCenter)

C6 DataDrive (LowerRight)

H3 Speakerterminal

S1 Powerswitch

SS2 Sustainout(Upper)

SS3 Sustainout(Lower)

V1 LED(stand-by/ Poweron)&

Remotereceiver 1

PB Fancontrol 1

P Linefilter, Powersupply 1

HX PC/ RS-232C

HB BNC CompositeVideo 2

HA BNC ComponentVideo 3

Remarks

1:Recommend PCB'sforinitial service forGPH8Dchassis.

2:ForTH-65PHD8BK/EK/UK

3:ForTH-65PHD8UK

6. Service Hint

Note:

Extension cablekitfor SlotBoard issuppliedas service fixtures and tools.

(PartNo. TZSC0704)

7. Disassembly

-To removeP.C.B., waitfor1minute afterpowerwas off for

dischargefromelectrolysiscapacitors.

- and marks indicate screw positions.

7.1. Removal oftheBack Cover

1. Removethescrews(×20 , ×9 , ×4 ) and thenremove

theBack Cover.

7.2. Removal oftheHA-Boardand theHB-Board

7.2.1. TH-65PHD8UK

-Removal oftheHB-Board

1. Removethe4screws(A)oftheHB Terminal Block and then

removetheHB Terminal Block.

2. Removethe4screws(B).

3. Removethe2screws(C)and thenremovetheHB-Board.

-Removal oftheHA-Board

1. Removethe4screws(D)oftheHATerminal Block and then

removetheHATerminal Block.

2. Removethe4screws(E).

3. Removethe2screws(F)and thenremovetheHA-Board.

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