Panasonic TH-42PV8DA Bedienungsanleitung

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ORDER NO.MD0809003CE

Plasma Television

Model No. TH-42PV8DA

TH-42PV8HA

TH-42PV8HMA

TH-42PV8MA

TH-42PV8MRA

TH-42PV8MSA

TH-42PV8MTA

GPH11DA Chassis

1 Safety Precautions

1.1. General Guidelines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

4. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

5. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

1.2. Touch-Current Check

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground

such as a water pipe, as shown in Figure 1.

3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reserve the AC plug in the AC outlet and repeat each of the above measure.

6. The potential at any point (TOUGH CURRENT) expressed as voltage U1and U2, does not exceed the following values:

For a. c.: U1= 35 V (peak) and U2= 0.35 V (peak);

For d. c.: U1= 1.0 V,

Note:

The limit value of U2= 0.35 V (peak) for a. c. and U1= 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0

mA d. c.

The limit value U1= 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100 kHz.

7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be

repaired and rechecked before it is returned to the customer.

Figure 1

2Warning

2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensi-

tive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-

trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and

semiconductor [chip] components. The following techniques should be used to help reduce the incidence of component damage

caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,

which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-

num foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as [anti-static (ESD protected)] can

generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-

ble conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brush-

ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient

to damage an ES device).

2.2. About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements.

In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.

The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).

That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d

suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.

Caution

• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please

use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-

der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the

opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-

ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

3 Service Navigation

3.1. Important Notice

3.1.1. Model Name Identification

1. Model number is indicated the previous model number and space with A name plate as shown in figure.

2. TH-42PV8D/H/HM/M/MR/MS/MT will be discontinued and TH-42PV8DA/HA/HMA/M/AMRA/MSA/MTA will be introduced from

Aug/2008.

3.2. Different P.C.B.

Parts No. Parts name & Description Remarks

TH-42PV8D/H/HM/M/MR/MS/

TH-42PV8DA/HA/HMA/MA/

MRA/MSA/MTA

TZTNP01RWTM TZTNP01BUUM CIRCUIT BOARD A PAVCSG DA/HA/HMA/MA/

MRA/MTA

TZTNP01RWTQ TZTNP01BUUQ CIRCUIT BOARD A PAVCSG MSA

TXNGS1RWTM CIRCUIT BOARD GS PAVCSG

LSEP1260MTHB LSEP1260WTHB CIRCUIT BOARD P PAVCSG DA/HA/HMA/MTA

LSEP1260MMHB LSEP1260WMHB CIRCUIT BOARD P PAVCSG MA/MRA/MSA

TXNC11RRTM TXNC11BDUM CIRCUIT BOARD C1 PAVCSG

TXNC21RRTM TXNC21BDUM CIRCUIT BOARD C2 PAVCSG

TXNSC1RRTM TXNSC1BDUM CIRCUIT BOARD SC PAVCSG

TXNSD1RRTM CIRCUIT BOARD SD PAVCSG

TXNSS1RRTM TXNSS1BDUM CIRCUIT BOARD SS PAVCSG

TXNSU1RRTM CIRCUIT BOARD SU PAVCSG

TXN/G1RRTM CIRCUIT BOARD G PAVCSG

TXN/K1RWTM CIRCUIT BOARD K PAVCSG

TXN/S1RRTM CIRCUIT BOARD S PAVCSG

3.3. Service Hint

Board Name Function Board Name Function

P Power Supply C1 Data Driver (Lower Right)

A DC-DC Converter

Speaker out, Sound Processor

AV Terminal, AV Switch

Digital Signal Processor, MPU, HDMI Interface

Peaks Lite 2p

Format Converter, Plasma AI, Sub-Field Processor

C2 Data Driver (Lower Left)

SC Scan Drive

SU Scan out (Upper)

SD Scan out (Lower)

SS Sustain Drive

G Key Switch, Front Terminal

K Remote receiver, Power LED GS SD Card Slot

S Power Switch

3.4. Applicable signals

4 Specifications

Power Source AC 220 - 240 V, 50/60 Hz (DA/HA/HMA/MA/MRA/MTA)

Power Consumption AC 110 - 240 V, 50/60 Hz (MSA)

Average use 335 W (DA/HA/HMA/MA/MRA/MTA)

340 W (MSA)

Standby condition 0.7 W

Plasma Display panel

Aspect Ratio 16:9

Visible screen size 106 cm (diagonal)

922 mm (W) ×518 mm (H)

Number of pixels 786,432 (1,024 (W) ×768 (H)) [3,072 ×768 dots]

Sound

Speaker 160 mm ×42 mm ×2 pcs, 8 Ω

Audio Output 20 W (10 W + 10 W), 10% THD

Headphones M3 (3.5 mm) stereo mini Jack ×1

PC signals VGA, SVGA, XGA

SXGA ....... (compressed)

Horizontal scanning frequency 31 - 69 kHz

Vertical scanning frequency 59 - 86 Hz

Receiving Systems / Band name

Receiving Channels

(Regular TV)

VHF BAND

2 - 12 (PAL/SECAM B, K1)

0 - 12 (PAL B AUST.)

1 - 9 (PAL B N.Z.)

1 - 12 (PAL/SECAM D)

1 - 12 (NTSC M Japan)

2 - 13 (NTSC M USA)

UHF BAND

21 - 69 (PAL G, H, I/SECAM G, K, K1)

28 - 69 (PAL B AUST.)

13 - 57 (PAL D, K)

13 - 62 (NTSC M Japan)

14 - 69 (NTSC M USA)

CATV

S1 - S20 (OSCAR)

1 - 125 (USA CATV)

C13 - C49 (JAPAN)

S21 - S41 (HYPER)

Z1 - Z37 (CHINA)

5A, 9A (AUST.)

Aerial - Rear VHF/UHF

Operating Conditions

Temperature: 0 °C - 40 °C

Humidity: 20 % - 80 % RH (non-condensing)

Connection Terminals

AV1 Input

AUDIO L - R RCA PIN Type ×2 0.5 V [rms]

VIDEO RCA PIN Type ×1 1.0 V [p-p] (75 Ω)

COMPONENT Y 1.0 V [p-p] ((including synchronization)

PB/CB, PR/CR± 0.35 V [p-p]

AV2 Input

AUDIO L - R RCA PIN Type ×2 0.5 V [rms]

VIDEO RCA PIN Type ×1 1.0 V [p-p] (75 Ω)

COMPONENT Y 1.0 V [p-p] ((including synchronization)

PB/CB, PR/CR± 0.35 V [p-p]

AV3 Input

AUDIO L - R RCA PIN Type ×2 0.5 V [rms]

VIDEO RCA PIN Type ×1 1.0 V [p-p] (75 Ω)

S VIDEO Mini DIN 4-pin Y:1.0 V [p-p] (75 Ω) C:0.286 V [p-p] (75 Ω)

AV4 Input

AUDIO L - R RCA PIN Type ×2 0.5 V [rms]

VIDEO RCA PIN Type ×1 1.0 V [p-p] (75 Ω)

S VIDEO Mini DIN 4-pin Y:1.0 V [p-p] (75 Ω) C:0.286 V [p-p] (75 Ω)

Note

• Design and Specifications are subject to change without notice. Mass and Dimensions shown are approximate.

Monitor Output

AUDIO L - R RCA PIN Type ×2 0.5 V [rms] (high impedance)

VIDEO RCA PIN Type ×1 1.0 V [p-p] (75 Ω)

Others

HDMI1 / 2 Input TYPE A Connectors This TV supports [HDAVI Control 3] function.

PC Input HIGH-DENSITY D-SUB 15PIN R, G, B/ 0.7 V [p-p] (75 Ω)

HD, VD/TTL Level 2.0 - 5.0 V [p-p] (high impedance)

Card slot SD Card slot ×1 (Factory use)

Dimensions (W ×H ×D) 1,020 mm ×727 mm ×327 mm (With Pedestal)

1,020 mm ×679 mm ×95 mm (TV only)

Mass 27.5 kg Net (With Pedestal)

25.5 kg Net (TV only)

5 Service Mode

5.1. How to enter into Service Mode

While pressing [VOLUME ( - )] button of the main unit, press [0] button of the remote control three times within 2 seconds.

5.1.1. Key command

[1] button...Main items Selection in forward direction

[2] button...Main items Selection in reverse direction

[3] button...Sub items Selection in forward direction

[4] button...Sub items Selection in reverse direction

[RED] button...All Sub items Selection in forward direction

[GREEN] button...All Sub items Selection in reverse direction

[VOL] button...Value of sub items change in forward direction ( + ), in reverse direction ( - )

Dieses Handbuch passt für folgende Modelle

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