Panasonic SA-AK630E Bedienungsanleitung

ORDERNO. MD0503064C2

CD Stereo System

SA-AK630E / SA-AK630EB / SA-AK630EG

Colour

(S)... Silver Type

AMPLIFIER SECTION

RMS output power

THD 10%, bothchannelsdriven

1kHz

(Lowchannel) 75 Wper channel (5)

10 kHz

(High channel) 70 Wper channel (5)

80 Hz

(Subwoofer channel) 160 W(8)

Total power output 450 W

FM/AM TUNER, TERMINALS SECTION

Preset station FM 15 stations

AM 15 stations

FrequencyModulation (FM)

Frequencyrange

87.50 - 108.00 MHz (50 kHz steps)

Sensitivity 1.8V (IHF)

S/N 26 dB 1.5V

Antennaterminal(s) 75 (unbalanced)

AmplitudeModulation (AM)

Frequencyrange 522 - 1629 kHz (9kHz steps)

Sensitivity

S/N 20 dB (at 999 kHz) 560 V/m

Audioperformance (Amplifier)

Input sensitivity/Input

impedance

Aux 250 mV,14.7k

Phonejack

Terminal Stereo, 3.5mm jack

CASSETTE DECK SECTION

Track system 4 track, 2channel

Heads

Record/playback Solidpermalloyhead

Erasure Doublegapferritehead

Motor DC servomotor

Recording system AC bias 100 kHz

Erasing system AC erase 100 kHz

Tapespeed 4.8cm/s

Overall frequencyresponse (+3dB, -6dB at DECK OUT)

NORMAL 35 Hz - 14 kHz

S/N ratio 50 dB (Aweighted)

Wowand flutter 0.18 %(WRMS)

Fast forwardand rewind time Approx. 120 secondswith

C-60 cassettetape

DISC SECTION

Discs played[8cm or12 cm]

(1) CD-Audio(CD-DA)

(2) CD-R/RW(CD-DA, MP3formatteddiscs)

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(3) MP3

Bit rate

MP3 32 kbps- 320 kbps

Sampling frequency

MP3 32 kHz, 44.1kHz, 48 kHz

CD 44.1kHz

Decoding 16 bit linear

Digital filter 8 fs

D/Aconverter MASH (1bit DAC)

Pickup

Wavelength 780 nm

Beam Source Semiconductorlaser

Audiooutput (Disc)

Number of channels 2(Stereo) (FL,FR)

GENERAL

Power Supply

ForE & EG only AC 230 V, 50Hz

ForEB only AC 230 -240 V, 50Hz

Power consumption 260 W

Power consumption instandby

mode 0.7W

Dimensions(WxH xD) 250 x330 x341 mm

Mass 7.1kg

Operating temperature range +5to+35°C

Operating humidityrange 5to90%RH (no condensation)

SYSTEM

SC-AK630 (E) Musiccenter: SA-AK630 (E)

Speaker: SB-AK630 (GC)

Subwoofer: SB-WAK630 (GC)

SC-AK630 (EB) Musiccenter: SA-AK630 (EB)

Speaker: SB-AK630 (GC)

Subwoofer: SB-WAK630 (GC)

SC-AK630 (EG) Musiccenter: SA-AK630 (EG)

Speaker: SB-AK630 (GC)

Subwoofer: SB-WAK630 (GC)

Notes:

1. Specificationsaresubject to changewithoutnotice. Mass and

dimensionsareapproximate.

2. Total harmonicdistortion ismeasured bythedigital spectrum analyzer.

Unauthorized copying and distribution isaviolation of law.

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1. Caution for AC Mains Lead

2. Before Repair and Adjustment

Disconnect AC power, discharge PowerSupplyCapacitors C5820 and C5840 through a 10 ,

5W resistortoground.

DO NOTSHORT-CIRCUITDIRECTLY (witha screwdriverblade, forinstance), as this may

destroysolidstate devices.

Afterrepairs are completed, restore powergraduallyusing a variac, toavoidovercurrent.

Current consumption at AC 230V, 50 Hz inNO SIGNALmode (volume minat CD mode) should

be ~ 350mA (E/EG only).

Current consumption at AC 230-240V, 50 Hz inNO SIGNALmode (volume minat CD mode)

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shouldbe ~ 350mA (EB only).

3. Protection Circuitry

The protection circuitrymayhave operatedif eitherof the following conditions are noticed:

-Nosound isheard when the power isturned on.

-Sound stops during aperformance.

The function of this circuitryis toprevent circuitrydamage if, forexample, the positive and

negative speakerconnection wires are

“shorted”, orif speakersystems withanimpedance less thanthe indicatedratedimpedance of

the amplifierare used.

If this occurs, followthe procedure outlines below:

1. Turn off the power.

2. Determine the cause of the problem and correct it.

3. Turn on the power once againafter one minute.

Note :

Whenthe protection circuitryfunctions, the unit will not operate unless the poweris first turned

off and thenon again.

4. Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor(solidstate) devices canbe damagedeasilybyelectricity. Such

components commonlyare calledElectrostaticallySensitive (ES) Devices. Examples of typical

ES devices are integratedcircuits and some field-effect transistors and semiconductor“chip”

components. The following techniques shouldbe usedtohelpreduce the incidence of

component damage causedbyelectrostatic discharge (ESD).

1. Immediatelybefore handling anysemiconductor component or

semiconductor-equipped assembly, drainoff anyESDon your

bodybytouching aknownearth ground. Alternatively, obtainand

wear acommerciallyavailabledischarging ESDwrist strap, which

shouldbe removed for potential shock reasons prior to applying

power to the unitunder test.

2. After removing an electrical assemblyequipped with ES devices,

place the assemblyon aconductive surface such as aluminium

foil, to prevent electrostaticcharge buildup or exposure of the

assembly.

3. Use onlyagrounded-tipsoldering iron to solder or unsolder ES

devices.

4. Use onlyan anti-staticsolder remover device. Some solder

removal devices not classified as “anti-static(ESDprotected)”

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can generate electrical charge to damage ES devices.

5. Donot use freon-propelled chemicals. These can generate

electrical charges sufficient to damage ES devices.

6. Donot remove areplacement ES device from its protective

package until immediatelybefore you are readyto install it. (Most

replacement ES devices are packaged with leads electrically

shorted together byconductive foam, aluminium foil or

comparableconductive material).

7. Immediatelybefore removing the protective material from the

leads of areplacement ES device, touch the protective material to

the chassisor circuitassemblyinto which the device will be

installed.

Caution

Besure no power isapplied to the chassisor circuit, and observe

all other safetyprecautions.

8. Minimize bodymotions when handling unpackaged replacement

ES devices. (Otherwise harmless motion such as the brushing

together of your clothes fabricor the lifting of your foot from a

carpeted floor can generate staticelectricity(ESD)sufficient to

damage an ES device).

5. Handling the Lead-free Solder

5.1. About lead free solder (PbF)

Distinction of PbF P.C.B.:

P.C.B.s (manufactured) using leadfree solderwill have a PbF stampon the P.C.B.

Caution:

-Pb free solder has ahigher melting point than standard solder;

Typicallythe melting point is50 -70°F (30 -40°C)higher. Please

use ahigh temperature soldering iron. Incase of soldering iron

with temperature control, please set itto 700 ± 20°F (370 ± 10°C).

-Pb free solder will tend to splash when heated too high (about

1100°F/600°C).

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-When soldering or unsoldering, please completelyremove all of

the solder on the pins or solder area, and be sure to heat the

soldering points with the Pb free solder until itmelts enough.

6. Handling Precautions For Traverse Deck

The laserdiode inthe traverse deck (optical pickup) maybreak downdue topotential difference

causedbystatic electricityof clothes orhumanbody.

So, be careful of electrostatic breakdownduring repairof the traverse deck (optical pickup).

-Handling of traverse deck (optical pickup)

1. Donot subject the traverse deck (optical pickup) to static

electricityas itisextremelysensitive to electrical shock.

2. To prevent the breakdownof the laser diode, an antistatic

shorting pinisinserted into the flexibleboard (FFCboard).

3. Take care not to applyexcessive stress to the flexibleboard (FFC

board). When removing or connecting the short pin, finish the job

inas short time as possible.

4. Donot turn the variableresistor (laser power adjustment). Ithas

alreadybeen adjusted.

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Grounding forelectrostatic breakdownprevention

1. Human bodygrounding

Use the anti-staticwrist strap to discharge the staticelectricity

from your body.

2. Work tablegrounding

Put aconductive material (sheet) or steel sheet on the area where

the traverse deck (optical pickup) isplace, and ground the sheet.

Caution :

The static electricityof yourclothes will not be groundedthrough the wrist strap. So, take care

not tolet yourclothes touchthe traverse deck (optical pickup).

Caution whenreplacing the Traverse Deck

The traverse deck has a short point shortedwithsoldertoprotect the laserdiode against

electrostatics breakdown. Be sure toremove the solderfromthe short point before making

connections.

7. Precaution of Laser Diode

Caution :

Thisproduct utilizes alaser diode with the unitturned "ON",

invisiblelaser radiation isemitted from the pick up lens. /

Wavelength :780 nm / Maximum output radiation power from pick

up :100 W/VDE/ Laser radiation from pick up unitissafetylevel,

but be sure the followings:

1. Donot disassemblethe optical pick up unit, since radiation from

exposed laser diode isdangerous.

2. Donot adjust the variableresistor on the pick up unit. Itwas

alreadyadjusted.

3. Donot look at the focus lens using optical instruments.

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4. Recommend not to look at pick up lens for along time.

ACHTUNG :

Dieses Produkt enthälteine Laserdiode. Imeingeschalteten

Zustand wird unsichtbare Laserstrahlung von der Lasereinheit

abgestrahlt. / Wellenlänge :780nm / MaximaleStrahlungsleistung

der Lasereinheit:100 W/VDE/ DieStrahlung an der Lasereinheit

ist ungefährlich, wenn folgende Punkte beachtet werden:

1. DieLasereinheitnicht zerlegen, da dieStrahlung an der

freigelegten Laserdiode gefährlich ist.

2. Den werkseitigjustierten Einstellregler der Lasereinhitnicht

verstellen.

3. Nicht mitoptischen Instrumenten indieFokussierlinse blicken.

4. Nicht über längere ZeitindieFokussierlinse blicken.

ADVARSEL: I dette a apparat anvendes laser.

CAUTION!

THIS PRODUCTUTILIZES A LASER.

USE OFCONTROLS OR ADJUSTMENTS OR PERFORMANCE OFPROCEDURES OTHER THAN

THOSE

SPECIFIED HEREIN MAY RESULT IN HAZARDOUS RADIATION EXPOSURE.

Use of caution label

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8. Accessories Remote Control

FM Antenna

AC Cord(ForE & EG only)

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