Philips BDP9000 Bedienungsanleitung

Blu-ray Disc Player Model

BDP9000

Service Manual

Contents Page

1. About this Manual 2 Contents Page

2. Safety Instructions, Warnings and Notes 3

3. System Overview 5

4. Technical Reference 7

5. Required Equipment List 13

6. Diagnosis and Repair Flowchart 14

7. Software Update and Repair 27

8. Mechanical Instructions 28

9. Circuit Diagrams and PWB Layouts 35

10. Spare Parts List 70

11. Directions for Use 73

retrieval system or transmitted, in any form or by any means, electronic,

mechanical, photocopying, or otherwise without prior permission of Philips.

Published by Consumer Electronics Printed in the Netherlands

Subject to modification EN 0000 000 00000

EN 2 1. BDP9000 About this Manual

1. About this Manual

1.1. Content of this Manual

Note: The BDP9000 will be serviced on a modular level only. Faulty modules will be identified and replaced. Detailed circuit

diagrams and technical information on a component level are therefore not provided in this document.

1.1.1. What is included in this Manual

• Safety Information

• System Overview

• Basic System Block Diagrams

• Parts / Module Identification

• Module Functional Descriptions

• Basic Module Technical Descriptions

• Basic Measuring Point Information

• Basic Fault Finding Strategy

• Module Removal & Replacement Procedures

• Parts List / 12NC Numbers

1.2. Additional Documentation

The following documentation is supplied by Philips and must be kept with this Service Manual.

• BDP9000 User Manual

• RC4380 User Manual

Safety Instructions, Warnings and Notes BDP9000 2. EN 3

2. Safety Instructions, Warnings and Notes

2.1. Safety Instructions

2.1.1. Safety components

Replace safety components, indicated by the symbol , only by components identical to the original ones. Any other component

substitution (other than original type) may increase risk of fire or electrical shock hazard.

2.1.2. After repair

• Safety regulations require that after a repair, the set must be returned in its original condition.

• Before returning the BDP9000 to the customer always do a safety check. Pay attention to the built-in protective devices, leakage

current and insulation resistance.

2.2. Warnings

2.2.1. General

Never replace modules or other components while the unit is switched “on”.

2.2.2. ESD Protection

All ICs and many other semi-conductors are susceptible to electrostatic discharges (ESD). Careless handling during

repair can reduce life drastically. When repairing, make sure that you are connected with the same potential as the

mass of the set via a wrist wrap with resistance. Keep components and tools also at this potential.

2.3. Notes

2.3.1. Handling of the optical pick-up

The laser diode in the optical pick-up may suffer electrical breakdown because of potential static electricity from clothing and your body.

The following method is recommended to prevent damage:

1. Place a conductive sheet on the work bench. You can use the black sheet that is used to wrap repair parts.

2. Place the set on the conductive sheet to ground the chassis to the sheet.

3. Place your hands on the conductive sheet to give them the same ground as the sheet.

4. Remove the optical pick-up block.

5. Perform work on top of the conductive sheet. Be careful not to touch the unit with your clothes or any other static objects.

6. Short the short terminal on the PCB in the pick-up assembly before you lift or remove the pick-up assembly.

7. After replacing the pick-up assembly, open the short terminal on the PCB.

2.3.2. Schematic notes

• All resistor values are in ohms, and the value multiplier is often used to indicate the decimal point location (e.g. 2K2 indicates

2.2 kohm).

• Resistor values with no multiplier may be indicated with either an "E" or an "R" (e.g. 220E or 220R indicates 220 ohm).

• All capacitor values are given in micro-farads (µ = x10-6), nano-farads (n = x10-9), or pico-farads (p = x10-12).

• Capacitor values may also use the value multiplier as the decimal point indication (e.g. 2p2 indicates 2.2 pF).

• An "asterisk" (*) indicates component usage varies. Refer to the diversity tables for the correct values.

• The correct component values are listed in the Spare Parts List. Therefore, always check this list when there is any doubt.

EN 4 2. BDP9000 Safety Instructions, Warnings and Notes

2.3.3. Led-free solder

Philips CE is producing lead-free sets (PBF) from 1.1.2005 onwards.

Identification: The bottom line of a type plate gives a 14-digit serial number. Digits 5 and 6 refer to the production year, digits 7 and 8

refer to production week (in example below it is 1991 week 18).

Figure 2.1-1

Regardless of the special lead-free logo (which is not always indicated), one must treat all sets from this date onwards according to the

rules as described below.

Figure 2.1-2

Due to lead-free technology some rules have to be respected by the workshop during a repair:

• Use only lead-free soldering tin Philips SAC305 with order code 0622 149 00106. If lead-free solder paste is required, please

contact the manufacturer of your soldering equipment. In general, use of solder paste within workshops should be avoided because

paste is not easy to store and to handle.

• Use only adequate solder tools applicable for lead-free soldering tin. The solder tool must be able:

- To reach a solder-tip temperature of at least 400 °C.

- To stabilize the adjusted temperature at the solder-tip.

- To exchange solder-tips for different applications.

• Adjust your solder tool so that a temperature of around 360 °C – 380 °C is reached and stabilized at the solder joint.

Heating time of the solder-joint should not exceed ~ 4 sec.

Avoid temperatures above 400 °C, otherwise wear-out of tips will increase drastically and flux-fluid will be destroyed.

To avoid wear-out of tips, switch “off” unused equipment or reduce heat.

• Mix of lead-free soldering tin/parts with leaded soldering tin/parts is possible but PHILIPS recommends strongly to avoid mixed

regimes. If this cannot be avoided, carefully clean the solder-joint from old tin and re-solder with new tin.

• Use only original spare-parts listed in the Service-Manuals.

Not listed standard material (commodities) has to be purchased at external companies.

• Special information for lead-free BGA ICs: these ICs will be delivered in so-called "dry-packaging" to protect the IC against

moisture. This packaging may only be opened shortly before it is used (soldered). Otherwise the body of the IC gets "wet" inside

and during the heating time the structure of the IC will be destroyed due to high (steam-) pressure inside the body. If the packaging

was opened before usage, the IC has to be heated up for some hours (around 90 °C) for drying (think of ESD-protection!).

Do not re-use BGAs at all!

• For sets produced before 1.1.2005, containing leaded soldering tin and components, all needed spare parts will be available till the

end of the service period. For the repair of such sets nothing changes.

In case of doubt whether the board is lead-free or not (or with mixed technologies), you can use the following method:

- Always use the highest temperature to solder, when using SAC305 (see also instructions below).

- De-solder thoroughly (clean solder joints to avoid mix of two alloys).

Caution: For BGA-ICs, you must use the correct temperature profile, which is coupled to the 12NC. For an overview of these profiles,

visit the website www.atyourservice.ce.philips.com (needs subscription, but is not available for all regions)

You will find this and more technical information within the "Magazine", chapter "Repair downloads".

For additional questions please contact your local repair help desk.

System Overview BDP9000 3. EN 5

3. System Overview

3.1. Technical Specification

System - General Connections, front

Power requirements AC 120 V, 60 Hz Card reader CF Type 1

Power consumption 51 W (< 10 W stand-by) MD

Standby/on light Red/blue SM

Weight 9.3 lbs MS Pro

Dimensions (W x D x H) 16.9 x 12.8 x 3.1 inches MS Duo (with adapter)

Operating temperature +41 °F to 104 °F MMC

Operating humidity 10 to 75% (non-condensing) RS-MMC (with adapter)

Optical drive Mini SD (with adapter)

BD Reading speed: Connections, rear

(Blu-ray Disc) 4.917 m/s Video outputs HDMI

DVD Reading speed: Component video

(Digital Versatile Disc) 3.49 - 4.06 m/s Composite video

Approx. play time: S-Video

135 min. (single side and layer) Audio outputs HDMI

CD: 12 cm Reading speed: Digital audio (S/PDIF)

(Compact Disc) 4.8 - 5.6 m/s 5.1-Channel

Max. play time: 2-Channel

74 min. Playable discs

CD: 8 cm Reading speed: Types BD:

(Compact Disc) 4.8 - 5.6 m/s BD-ROM, BD-RE

Max. play time: DVD:

20 min. DVD-VIDEO, DVD+RW (4.7

GB), DVD-RW (4.7 GB),

DVD+R (4.7 GB), DVD-R (4.7

GB),

Video output CD:

Component video Y: AUDIO-CD, CD-RW, CD-R

1.0 Vp-p (75 Ωload) Region codes BD:

Pr: A

0.70 Vp-p (75 Ωload) DVD:

Pb: All or 1

0.70 Vp-p (75 Ωload) Playable memory cards CD Type 1, MD, SM, MS PRO,

MS Duo (with adapter), MMC,

RS-MMC (with adapter), SD

Mini SD (with adapter)

Composite video I channel: Accessories

1.0Vp-p (75 Ωload) RC4380 Remote Control (with batteries)

S-Video Luminance: Quick Start Guide

1.0 Vp-p (75 Ωload) BDP9000 User Manual

Chrominance: RC4380 User Manual

0.3 Vp-p (75 Ωload) Product registration card

HDMI 480p, 720p, 1080i, 1080p HDMI cable

Audio output Component video cable

2-Channel L (1/L), R (2/R) Audio cable

5.1-Channel F/L, F/R, R/L, R/R, C, SubW

HDMI PCM multichannel audio,

Bitstream audio

PCM audio

Digital audio output Optical/Coaxial (S/PDIF)

Frequency response 48 kHz sampling:

4 Hz to 22 kHz

96 kHz sampling:

4 Hz to 44 kHz

S/N Ratio 110 dB

Dynamic range 100 dB

Total Harmonic Distortion 0.0004%

EN 6 3. BDP9000 System Overview

3.2. Video output

HDMI connection

Disc type Supported resolutions

BD (with token) 720p, 1080i, 1080p

BD, Image Constraint Token (ICT) 720p, 1080i, 1080p

BD, Digital Only Token (DOT) 720p, 1080i, 1080p

DVD 480p, 720p, 1080i, 1080p

Component video connection

Disc type Supported resolutions

BD (with token) 720p, 1080i

BD, Image Constraint Token (ICT) Not supported

BD, Digital Only Token (DOT) Not supported

DVD 480i, 480p

HDMI connection

Disc type Supported resolutions

BD (with token) Not supported

BD, Image Constraint Token (ICT) Not supported

BD, Digital Only Token (DOT) Not supported

DVD 480p, 720p, 1080i, 1080p

3.3. Audio output

2-Channel analog

Disc type Output

BD 2-Channel

DVD with Dolby Digital 2-Channel

DVD with DTS Mute

5.1-Channel analog

Disc type Output

BD 5.1-Channel

DVD with Dolby Digital 2-Channel (front left, front right)

DVD with DTS Mute

S/PDIF

Disc type Output

BD PCM: 2-Channel; Bitstream: bitstream from disc

DVD with Dolby Digital 2-Channel: (front left, front right); Bitstream: bitstream from disc

DVD with DTS PCM: Mute; Bitstream: bitstream from disc

HDMI

Disc type Output

BD PCM: 2-Channel/5.1-Channel; Bitstream: bitstream from disc

DVD with Dolby Digital 2-Channel: (front left, front right); Bitstream: bitstream from disc

DVD with DTS PCM: Mute; Bitstream: bitstream from disc

Technical Reference BDP9000 4. EN 7

4. Technical Reference

4.1. System

4.1.1. System Block Diagram

BD Loader

Flash

DDR

From BD Decoder

Digital Audio

(I2S/SPDIF)

Digital Video

S-Video / CVBS

Down Mix 2ch

YPbPr

Digital Video

HDMI

Transmitter

8ch DAC

Local Bus

IDE Bus

4MB

Flash

Front I/F

(64M Byte)

UART

MPEG2

MPEG4/VC-1

Decoder

TS I/F

Digital Video

IDE Bus

PCI Bus

Memory Card

Memory

Card

Controller

DVD

decoder

BD decoder

Main CPU

I2S

SPDIF

I2S/SPDIF

Front

Surr

CT.LFE

A bus B bus C bus

DDR

Total 320M Byte

From DVD Decoder

Video DAC

(64M Byte)

Analog Video

1080p

1080i

DDR

4MB Flash Video DAC

DDR

Figure 4.1-1

EN 8 4. BDP9000 Technical Reference

4.1.2. Wiring Diagram

Figure 4.1-2

Technical Reference BDP9000 4. EN 9

4.2. Audio - AK4358 (AIC1)

SCF

DZF

LOUT1+

LOUT1-

ROUT1+

ROUT1-

LOUT2+

LOUT2-

ROUT2+

ROUT2-

LOUT3+

LOUT3-

ROUT3+

ROUT3-

LOUT4+

LOUT4-

ROUT4+

ROUT4-

DAC DATT MCLK

LRCK

BICK

SDTI1

SDTI2

SDTI3

SDTI4

DCLK

DSDL1

DSDR1

DSDL2

DSDR2

DSDL3

DSDR3

DSDL4

DSDR4

SCF DAC DATT

SCF

AK4358

DAC DATT

Audio

I/F

Control

3-wire

or I2C

PCM

DSD

Figure 4.2-1

EN 10 4. BDP9000 Technical Reference

4.3. Video Encoder - ADV7322 (VIC4)

SD CONTROL BLOCK ADV7322

11-BIT

DAC

11-BIT

DAC

11-BIT

DAC

11-BIT

DAC

11-BIT

DAC

PROGRAMMABLE

RGB MATRIX

TIMING

GENERATOR

Y7-Y0

C7-C0

S7-S0

CLKIN_A

CLKIN_B

HSYNC

VSYNC

BLANK

PLL

COLOR CONTROL

BRIGHTNESS

DNR

GAMMA

PROGRAMMABLE

FILTERS

SD TEST PATTERN

HD CONTROL BLOCK

Figure 4.3-1

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