Renesas RYZ014A Bedienungsanleitung

R19DS0111EU0102 Rev.1.02 Page 1 of 33

Mar.29.22

Datasheet

RYZ014A

LTE Category M1 Module

Description

The RYZ014A is a complete certified LTE Category M1 module including base-band, RF and memory, for

the design of connected machine-to-machine devices, and other Internet-of-Things devices with embedded

LTE connectivity. This document provides technical information about RYZ014A LGA module.

This document is intended for engineers who are developing User Equipment (UE) for LTE systems.

Functions

Renesas RYZ014A module includes Monarch SQN3330 Cat-M1 baseband, a complete dual band RF front

end, memory and required circuitry to meet 3GPP E-UTRA (Long Term Evolution - LTE, Release 13) Cat-M1

UE specifications.

For more information on the core technology specifications see the section References on page 32. The term

RYZ014A module refers to the hardware and the associated embedded software.

Figure 1. RYZ014A Block Diagram

Table 1 provides detail on general features of the RYZ014A.

Table 2 provides detail for the LTE-related features of the RYZ014. The module’s ECCN and part number

are detailed in the section ECCN and Part Number on page 14.

RYZ014A LTE Category M1 Module Datasheet

R19DS0111EU0102 Rev.1.02 Page 2 of 33

Mar.29.22

Table 1. General Features

Feature

Description

General interfaces

•

JTAG

•I2C (reserved)

•USIM

•SPI (reserved)

•GPIO

•UART (x3, including one reserved)

•RING

•WAKE

•ADC

•

32 kHz

Supported Frequency Bands

1, 2, 3, 4, 5, 8, 12, 13, 14, 17, 18, 19, 20, 25, 26, 28, 66, 85

Operation voltages

Vbat1 (range from 3.1 V to 5.5 V) operational

Vbat1 (range from 3.1 V to 4.5 V) recommended for performance

Packaging

LGA module

108 pads (21.35 x 20.25 x 1.79 mm)

RoHS compliant, halogen-free

Operating temperature

RF compliant -30°C to +85°C (measured on board thermistor)

Operational: -40°C to +85°C (measured on board thermistor)

See also section Environmental Operating Conditions on page 16.

Humidity

•

10% to 85%

See also section Environmental Operating Conditions on page 16.

Table 2. LTE Features

Feature

Description

Standard

compliance

•3GPP E-UTRA Release 13 compliant

PHY

•One UL and one DL transceiver

•Support of HD-FDD Duplexing mode B

•Channel 1.4 MHz bandwidth

•Normal cyclic prefix

•Support of MPDCCH

•Modulation

DL: QPSK, 16QAM

UL: QPSK, 16QAM

•All coding schemes corresponding to modulations

•All channel coding (turbo-coding with interleaver, tail biting convolutional coding, block and

repetition coding) and CRC lengths

•SRS (Sounding Reference Signal)All power control schemes and DL power allocation

schemes

•HARQ Incremental Redundancy and Chase Combining

•Periodic and aperiodic CQI support

•

RSRP and RSRQ

MAC

•

Random Access procedure in CE levels 0 and 1

•Scheduling Request, Buffer Status Reporting, and Power Headroom Reporting

•Discontinuous reception (DRX, eDRX) with long and short cycles

•Fast scanning

•Hosted configuration

•IPv4, IPv6

•

Location based services (PoLTE)

RLC

•ARQ modes: UM, AM, and TM

RYZ014A LTE Category M1 Module Datasheet

R19DS0111EU0102 Rev.1.02 Page 3 of 33

Mar.29.22

Feature

Description

PDCP

•

Ciphering and deciphering: NULL, AES, SNOW 3G

•Integrity and protection: AES, SNOW 3G

RRC

•

MIB and new SIB1-BR

•Intra and inter-frequency cell reselection

•Intra-frequency connected mode mobility

•Up to 8 Data Radio Bearers supported

•Support of CE (Coverage Extension) Mode A

•

Extended Access Barring (EAB)

NAS and above

•UEPCOP (from 3GPP Release 12) Power Saving Mode

•SMS over SG

•LWM2M Client

Pin Description

Table 3. Pad Name and Function

Pad#

Pad Name

Direction

Capability

Default Function Description

Alternate Function

Description

(Contact Renesas

Support Team for detail

on persistent AT

Commands availability)

GND

N/A

All GND pads shall be connected to

the same copper.

2 GPIO3/STATUS_LED In Reserved for future use. Do not

connect. status LED

(STATUS_LED, OUT) in

option

1V8

O (power)

1.8 V reference voltage for IOs.

GNSS_VINB

N/A

Reserved, do not use. Do Not Connect

RESERVED/FFF_FFH

I/O

Reserved pad: it must be Pulled Up

and connected to a Test Point.

FFF_FFH: Active high by default (FFF:

Firmware From Flash). Firmware From

Host if driven low.

6 GPIO2/PS_STATUS I/O GPIO2: Reserved, no function.

PS_STATUS: High = modem active /

low = modem in low power modes.

Power Saving status of

the module: a high level

indicates that module is

in active mode. A low

level indicates that

module is in low power

modes (Sleep mode or

Deep Sleep mode) to

minimize power

consumption. This signal

can be used to inform a

host that the module

needs to be waken-up

with either RTS0, WAKE0

or WAKE1 signal before

sending data or

commands through one

of the UART interface.

GPIO19/CLK0

I/O

Reserved for future use. Do not

connect.

RYZ014A LTE Category M1 Module Datasheet

R19DS0111EU0102 Rev.1.02 Page 4 of 33

Mar.29.22

Pad#

Pad Name

Direction

Capability

Default Function Description

Alternate Function

Description

(Contact Renesas

Support Team for detail

on persistent AT

Commands availability)

GPIO27/CTS2

I/O

UART2/CTS (OUT). It is

recommended to pull-up this pad with

the application host processor supply

as this pad will become high

impedance when module is in low

power mode. If not used, it should be

connected to a Test Point (for debug).

CTS2 is active low.

3V0

O (power)

3.0 V power supply

10 GPIO28/RTS2 I/O UART2/RTS (IN). Host board shall

drive this signal. See Module

integration Guide for details.

RTS2 is active low.

3V0

O (power)

3.0 V power supply

12 SIM_RESETN O SIM card interface: reset output pin for

the SIM card

DNC

Do not

connect

Do not connect

SIM_CLK

SIM card interface: clock output pin for

the SIM card

DNC

Do not

connect

SIM_DETECT

I/O

SIM card presence indication (input).

GPIO in option.

Active high = SIM card inserted / low =

no SIM card inserted.

Note: It is recommended to use an

USIM connector with hardware

removal and insertion detection

capability, connected to SIM_DETECT

signal.

SIM_IO

I/O

SIM card bidirectional data

input/output (SIM card output must be

open-drain). A 4.7 kOhm pull-up

resistor on SIM_VCC is mandatory.

18 SIM_VCC O (power) SIM card supply voltage (1.8 V or

2.95V controlled by software).

ON when a SIM card is detected.

GNSS_TXD3

N/A

Reserved, do not use. Do Not Connect

GND

N/A

All GND pads shall be connected to

the same copper.

GNSS_RXD3

N/A

Reserved, do not use. Do Not Connect

22 GND N/A All GND pads shall be connected to

the same copper.

GNSS_BOOT0

N/A

Reserved, do not use. Do Not Connect

GND

N/A

All GND pads shall be connected to

the same copper.

GNSS_RSTN

N/A

Reserved, do not use. Do Not Connect

GND

N/A

All GND pads shall be connected to

the same copper.

GNSS_STDBY_OUT

N/A

Reserved, do not use. Do Not Connect

RYZ014A LTE Category M1 Module Datasheet

R19DS0111EU0102 Rev.1.02 Page 5 of 33

Mar.29.22

Pad#

Pad Name

Direction

Capability

Default Function Description

Alternate Function

Description

(Contact Renesas

Support Team for detail

on persistent AT

Commands availability)

GND

N/A

All GND pads shall be connected to

the same copper.

GNSS_WAKEUP

N/A

Reserved, do not use. Do Not Connect

30 GND N/A All GND pads shall be connected to

the same copper.

GND

N/A

All GND pads shall be connected to

the same copper.

GND

N/A

All GND pads shall be connected to

the same copper.

GND

N/A

All GND pads shall be connected to

the same copper.

GND

N/A

All GND pads shall be connected to

the same copper.

GNSS_STDBYN

N/A

Reserved, do not use. Do Not Connect

or tie to low.

GNSS_GPIO28

N/A

Reserved, do not use. Do Not Connect

GNSS_GPIO1_PPSOUT

N/A

Reserved, do not use. Do Not Connect

GNSS_GPIO0/BLANKING

N/A

Reserved, do not use. Do Not Connect

RFDATA12

I/O

Reserved for future use. Do not

connect.

RFDATA16

I/O

Reserved for future use. Do not

connect.

RFDATA17

I/O

Reserved for future use. Do not

connect.

42 GND N/A All GND pads shall be connected to

the same copper.

GND

N/A

All GND pads shall be connected to

the same copper.

GNSS_ANT1

N/A

Reserved, do not use. Do Not Connect

GND

N/A

All GND pads shall be connected to

the same copper.

46 GND N/A All GND pads shall be connected to

the same copper.

RESETN

Module HW reset signal. This shall be

driven high (1V8).

Active low (check the datasheet for the

minimum duration).

JTAG_TDO

JTAG active

JTAG_TRSTN

Active low. JTAG active

JTAG_TMS

JTAG active

JTAG_TDI

JTAG active

JTAG_TCK

JTAG active

GND

N/A

All GND pads shall be connected to

the same copper.

LTE_ANT

Analog

LTE antenna

GND

N/A

All GND pads shall be connected to

the same copper.

56 RXD2 O UART2/RXD (OUT), if not used should

be connected to a Test Point.

RYZ014A LTE Category M1 Module Datasheet

R19DS0111EU0102 Rev.1.02 Page 6 of 33

Mar.29.22

Pad#

Pad Name

Direction

Capability

Default Function Description

Alternate Function

Description

(Contact Renesas

Support Team for detail

on persistent AT

Commands availability)

ADC

Analog

Analog Digital Converter

TXD2

UART2/TXD (IN), if not used should

be connected to a Test Point.

59 SPI_SDI I/O Reserved for future use. Do not

connect.

SPI_CSN

I/O

Reserved for future use. Do not

connect.

SPI_CLK

I/O

Reserved for future use. Do not

connect.

GND

N/A

All GND pads shall be connected to

the same copper.

GND

N/A

All GND pads shall be connected to

the same copper.

GND

N/A

All GND pads shall be connected to

the same copper.

65 GND N/A All GND pads shall be connected to

the same copper.

GND

N/A

All GND pads shall be connected to

the same copper.

SPI_SDO

I/O

Reserved for future use. Do not

connect.

GND

N/A

All GND pads shall be connected to

the same copper.

GND

N/A

All GND pads shall be connected to

the same copper.

GND

N/A

All GND pads shall be connected to

the same copper.

71 GND N/A All GND pads shall be connected to

the same copper.

GND

N/A

All GND pads shall be connected to

the same copper.

GND

N/A

All GND pads shall be connected to

the same copper.

GND

N/A

All GND pads shall be connected to

the same copper.

RTS0

UART0/RTS (IN).

Active low (wake-up function).

CTS0

UART0/CTS (OUT). It is

recommended to pull-up this pad with

the application host processor supply

as this pad will become high

impedance when module is in low

power mode.

CTS0 is active low.

TXD0

UART0/TXD (IN)

GPIO14/TXD1

I/O

UART1/TXD (IN); If not used should

be connected to a Test Point.

RXD0

UART0/RXD (OUT)

GPIO15/RXD1

I/O

UART1/RXD (OUT); If not used should

be connected to a Test Point.

RYZ014A LTE Category M1 Module Datasheet

R19DS0111EU0102 Rev.1.02 Page 7 of 33

Mar.29.22

Pad#

Pad Name

Direction

Capability

Default Function Description

Alternate Function

Description

(Contact Renesas

Support Team for detail

on persistent AT

Commands availability)

GPIO17/CTS1

I/O

GPIO17: Reserved, no function.

CTS1 active low. No Flow control by

default.

UART1/CTS (OUT)

GPIO38/CLK1

I/O

Reserved for future use. Do not

connect.

GPIO16/RTS1

I/O

GPIO16: Reserved, no function.

RTS1 active low (wake-up function).

No Flow control by default.

UART1/RTS (IN)

GPIO41/DTR0

I/O

Reserved for future use. Do not

connect.

GPIO39/DSR0

I/O

Reserved for future use. Do not

connect.

GND

N/A

All GND pads shall be connected to

the same copper.

GND

N/A

All GND pads shall be connected to

the same copper.

GPIO23/DCD0

I/O

Reserved for future use. Do not

connect.

89 GPIO25/RING0 I/O RING0 (OUT); it is recommended to

pull-up this pin with the application

host processor supply as it will

become high impedance when module

is in Deep Sleep mode.

RING0 is active low (from high to low).

GPIO40/EMGCY_SHDN

I/O

Reserved for future use. Do not

connect.

91 GPIO26/CLK2 I/O Reserved for future use. Do not

connect.

I2C_SDA

I/O

Reserved for future use. Do not

connect.

GPIO24

I/O

Reserved for future use. Do not

connect.

I2C_SCL

I/O

Reserved for future use. Do not

connect.

GPIO21

I/O

Reserved for future use. Do not

connect.

WAKE1

I/O

Reserved, no function.

Not set as a wake-up source by

default. Active high or low level during

100 µs depending on software.

Wake input (WAKE1).

Note: WAKE inputs are

detected on level

(configurable by software

to 0 or 1) that must last at

least 100 µs.

VCC1_PA

I (power)

Power supply for LTE RF front end;

2.9 V to 3.1 V.

VCC2_PA

I (power)

Power supply for LTE RF front end;

2.9 V to 3.1 V.

99 VCC2_PA I (power) Power supply for LTE RF front end;

2.9 V to 3.1 V.

100

GNSS_VCC1

N/A

Reserved, do not use. Do Not Connect

101

GNSS_VCC2

N/A

Reserved, do not use. Do Not Connect

RYZ014A LTE Category M1 Module Datasheet

R19DS0111EU0102 Rev.1.02 Page 8 of 33

Mar.29.22

Pad#

Pad Name

Direction

Capability

Default Function Description

Alternate Function

Description

(Contact Renesas

Support Team for detail

on persistent AT

Commands availability)

102

GNSS_VCC3

N/A

Reserved, do not use. Do Not Connect

103

GPIO29/32KHZ_CLK_OUT

Reserved for future use. Do not

connect.

104 WAKE0 I Reserved, no function.

Not set as a wake-up source by

default. Active high or low level during

100 µs depending on software.

Wake input (WAKE0).

Note: WAKE inputs are

detected on level

(configurable by software

to 0 or 1) that must last at

least 100 µs.

105

GPIO42/SAR_DETECT

I/O

Reserved for future use. Do not

connect.

106 POWER_EN I Reserved, no function. Connect to a 470 kOhm

Pull Down when no used.

107

VBAT1

I (power)

Power supply for Baseband, voltage

level 3.1 V to 5.5 V (operational) or 4.5

V (recommended for performance)

108 VBAT1 I (power) Power supply for Baseband, voltage

level 3.1 V to 5.5 V (operational) or 4.5

V (recommended for performance)

T1-

T30

GND

N/A

T1 to T30 pads are used as both GND

and thermal drops.

T1 to T30 pads are used

as both GND and thermal

drops.

Table 4. Other Pad Properties

Pad#

Pad Name

Power

Group

Pad Type

Drive

(mA)

Max

drive

strength

that will

be used

(mA)

Max

toggling

freq (all

modes)

(MHz)

State

@reset

GND

N/A

GPIO3/STATUS_LED

VBAT1

BIDIR_WAKE

N/A

In, HiZ

1V8

N/A

GNSS_VINB

N/A

RESERVED/FFF_FFH

VBAT1

BIDIR_WAKE

N/A

In, HiZ

GPIO2/PS_STATUS

VBAT1

BIDIR_WAKE

N/A

In, HiZ

GPIO19/CLK0

1V8

BIDIR

6.25

In, PU

GPIO27/CTS2

1V8

BIDIR

6.25

In, PU

3V0

N/A

GPIO28/RTS2

1V8

BIDIR

6.25

In, PU

3V0

N/A

SIM_RESETN

SIM_VC

BIDIR

In, HiZ

DNC

N/A

SIM_CLK

SIM_VC

BIDIR

In, PU

DNC

N/A

SIM_DETECT

VBAT1

BIDIR_WAKE

N/A

In, HiZ

RYZ014A LTE Category M1 Module Datasheet

R19DS0111EU0102 Rev.1.02 Page 9 of 33

Mar.29.22

Pad#

Pad Name

Power

Group

Pad Type

Drive

(mA)

Max

drive

strength

that will

be used

(mA)

Max

toggling

freq (all

modes)

(MHz)

State

@reset

SIM_IO

SIM_VC

BIDIR

In, PU

SIM_VCC

VBAT1

Power

N/A

High-Z, PD

GNSS_TXD3

N/A

GND

N/A

GNSS_RXD3

N/A

GND

N/A

GNSS_BOOT0

N/A

GND

N/A

GNSS_RSTN

N/A

GND

N/A

GNSS_STDBY_OUT

N/A

GND

N/A

GNSS_WAKEUP

N/A

GND

N/A

GND

N/A

GND

N/A

GND

N/A

GND

N/A

GNSS_STDBYN

N/A

GNSS_GPIO28

N/A

GNSS_GPIO1_PPSOUT

N/A

GNSS_GPIO0/BLANKING

N/A

RFDATA12

N/A

RFDATA16

N/A

RFDATA17

N/A

GND

N/A

GND

N/A

GNSS_ANT1

N/A

GND

N/A

GND

N/A

RESETN

VBAT1

IN_PMU

N/A

In, HiZ

JTAG_TDO

1V8

BIDIR

Out

JTAG_TRSTN

1V8

N/A

in, PD

JTAG_TMS

1V8

N/A

In, PU

JTAG_TDI

1V8

N/A

In, PU

JTAG_TCK

1V8

N/A

In, PD

GND

N/A

LTE_ANT

N/A

GND

N/A

RXD2

1V8

BIDIR

6.25

In, PU

ADC

N/A

TXD2

1V8

BIDIR

6.25

In, PU

SPI_SDI

1V8

BIDIR

In, PU

SPI_CSN

1V8

BIDIR

In, PU

SPI_CLK

1V8

BIDIR

In, PU

GND

N/A

RYZ014A LTE Category M1 Module Datasheet

R19DS0111EU0102 Rev.1.02 Page 10 of 33

Mar.29.22

Pad#

Pad Name

Power

Group

Pad Type

Drive

(mA)

Max

drive

strength

that will

be used

(mA)

Max

toggling

freq (all

modes)

(MHz)

State

@reset

GND

N/A

GND

N/A

GND

N/A

GND

N/A

SPI_SDO

1V8

BIDIR

In, PU

GND

N/A

GND

N/A

GND

N/A

GND

N/A

GND

N/A

GND

N/A

GND

N/A

RTS0

VBAT1

BIDIR_WAKE

N/A

In, HiZ

CTS0

1V8

BIDIR

6.25

In, PU

TXD0

1V8

BIDIR

6.25

In, PU

GPIO14/TXD1

1V8

BIDIR

6.25

In, PU

RXD0

1V8

BIDIR

6.25

In, PU

GPIO15/RXD1

1V8

BIDIR

6.25

In, PU

GPIO17/CTS1

1V8

BIDIR

6.25

In, PU

GPIO38/CLK1

1V8

BIDIR

6.25

In, PU

GPIO16/RTS1

VBAT1

BIDIR_WAKE

N/A

In, HiZ

GPIO41/DTR0

VBAT1

BIDIR_WAKE

N/A

In, HiZ

GPIO39/DSR0

VBAT1

BIDIR_WAKE

N/A

In, HiZ

GND

N/A

GND

N/A

GPIO23/DCD0

1V8

BIDIR

In, PU

GPIO25/RING0

VBAT1

BIDIR_WAKE

In, HiZ

GPIO40/EMGCY_SHDN

VBAT1

BIDIR_WAKE

N/A

In, HiZ

GPIO26/CLK2

1V8

BIDIR

6.25

In, PU

I2C_SDA

1V8

BIDIR

6.25

In, PU

GPIO24

1V8

BIDIR

In, PU

I2C_SCL

1V8

BIDIR

6.25

In, PU

GPIO21

1V8

BIDIR

In, PU

WAKE1

VBAT1

BIDIR_WAKE

N/A

In, HiZ

VCC1_PA

N/A

VCC2_PA

N/A

VCC2_PA

N/A

100

GNSS_VCC1

N/A

101

GNSS_VCC2

N/A

102

GNSS_VCC3

N/A

103

GPIO29/32KHZ_CLK_OUT

1V8

BIDIR

0.032

In, HiZ

104

WAKE0

VBAT1

BIDIR_WAKE

N/A

In, HiZ

105

GPIO42/SAR_DETECT

VBAT1

BIDIR_WAKE

N/A

In, HiZ

106

POWER_EN

VBAT1

BIDIR_WAKE

N/A

In, HiZ

107

VBAT1

N/A

108

VBAT1

N/A

T1-T30

GND

N/A

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GEA VARIVENT Bedienungsanleitung

Walther Systemtechnik

Walther Systemtechnik VMS-05 Bedienungsanleitung

Altronix

Altronix LINQ8PD Montageanleitung

Eaton

Eaton Powerware Series Bedienungsanleitung

WAGO

WAGO 750-407/040-000 Bedienungsanleitung

Sony

Sony CCU-590 Bedienungsanleitung

Graco

Graco 25D614 Bedienungsanleitung

Task Force Tips

Task Force Tips YE-RF-900 Programmierhandbuch

Shini

Shini SPV-U Series Bedienungsanleitung