RF-Star RF-TI1352P2 Bedienungsanleitung

RF-TI1352P2 CC1352P7 SimpleLinkTM High-

Performance Sub-1G + 2.4 G Multi-band Module

With Integrated Power Amplifier

Version 1.0

Shenzhen RF-star Technology Co., Ltd.

Oct. 31th, 2023

RF-TI1352P2

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Shenzhen RF-star Technology Co., Ltd. Page 1 of 22

1 Device Overview

1.1 Description

RF-TI1352P2 is an RF module based on TI SoC CC1352P7 with an integrated power amplifier. It integrates a 48 MHz

and a 32.768 kHz crystal, a 256 KB ROM, a 704 KB Flash, and the IPEX connectors and half-hole RF output pins of

different radio frequency to guarantee the external antenna connection. Its ARM® Cortex®-M4F core application

processor optimized for long-range and low-power. It features small size, robust connection distance, and rigid reliability.

The multi-band module supporting multiprotocol for both Sub-1 GHz and 2.4 GHz through a DMM driver for Thread,

Zigbee®, Matter, Bluetooth® 5.3 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), MIOTY®,

proprietary systems, including the TI 15.4-Stack (Sub-1 GHz and 2.4 GHz). 1.27-mm pitch stamp stick package for easy

assembling and cost-effective PCB design.

1.2 Key Features

•TX power:

- Up to +20 dBm (Sub-1 GHz) with temperature

compensation

- Up to +5 dBm (2.4 GHz) with temperature

•RF Section

-Bluetooth 5.2 Low Energy

-ZigBee, Thread, Matter

-IEEE 802.15.4

-IPv6-nabld smart objects (6LoWPAN)

-MIOTY®

-Wireless M-Bus

-Wi-SUN®

-KNX RF

-Amazon Sidewalk

-Proprietary systems

-SimpleLinkTM TI 15.4-Stack (Sub-1 GHz)

-Dynamic Multiprotocol Manager (DDM) driver

compensation

•Excellent receiver sensitivity

- -121 dBm @ Sub-1 GHz (SimpleLink Long-range

Mode)

- -110 dBm @ Sub-1 GHz (50 kbps)

- -104 dBm for Bluetooth 125 kbps (LE coded PHY)

•Wide Operation Range

- 1.8 V to 3.8 V single power supply

- Operating temperature: -40 °C to +85 °C

- Storage temperature: -40 °C to +125 °C

•Microcontroller

- Powerful 48 MHz ARM® Cortex®-M4F

processor

- 2-pin cJTAG and JTAG debugging

- Supports OTA upgrade

•Memory

- 704 KB of in-system programmable flash

- 256 KB of ROM for protocols and library

functions

- 8 KB of Cache SRAM

- 80 KB of ultra-low leakage SRAM

•Ultra-low power sensor controller with 4KB of

SRAM

- Sample, store, and process sensor data

- Operation independent from system CPU

- Fast wake-up for low-power operation

•Rich Peripherals

RF-TI1352P2

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- 24 GPIOs, digital peripherals can be routed

to any GPIOs

- 4× 32-bit or 8× 16-bit general-purpose

timers

- 12-bit ADC, 200 kSamples/s, 8 channels

- 2 × comparators with internal reference DAC

(1 × continuous time, 1 × ultra-low power)

- Programmable current source

- 2 × UART

- 2 × SSI (SPI, MICROWIRE, TI)

- I2C

- I2S

- Real-time clock (RTC)

- Capacitive sensing, up to 8 channels

- Integrated temperature and battery monitor

•Security Enablers

- AES 128-bit and 256-bit Crypto accelerator

- ECC and RSA public key hardware accelerator

- SHA2 accelerator (full suite up to SHA-512)

- True random number generator (TRNG)

•External system

- On-chip buck DC/DC converter

- TCXO support

•Dimension: 26.9 mm × 16.9 mm × 2.1 mm

1.3 Applications

•Building security systems – motion detector,

electronic smart lock, door and window sensor,

garage door system, gateway

•HVAC – thermostat, wireless environmental

sensor, HVAC system controller, gateway

•Fire safety system – smoke and heat detector,

fire alarm control panel (FACP)

•Video surveillance – IP network camera

•Elevators and escalators – elevator main

control panel for elevators and escalators

•Smart meters – water meter, gas meter,

electricity meter, and heat cost allocators

•Grid communications – wireless

communications – Long-range sensor

applications

•Other alternative energy – energy harvesting

•Industrial transport – asset tracking

•Factory automation and control

•Medical

•Electronic point of sale (EPOS) – Electronic

Shelf Label (ESL)

•Wired networking – wireless LAN or Wi-Fi

access points, edge router

•Portable electronics – RF smart remote control

•Home theater & entertainment – smart

speakers, smart display, set-top box

•Connected peripherals – consumer wireless

module, pointing devices, keyboards and

keypads

•Gaming – electronic and robotic toys

•Wearables (non-medical) – smart trackers,

smart clothing

RF-TI1352P2

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1.4 Functional Block Diagram

Figure 1. Functional Block Diagram of RF-TI1352P2

1.5 Part Number Conventions

The part numbers are of the form of RF-TI1352P2 where the fields are defined as follows:

Figure 2. Part Number Conventions of RF-TI1352P2

1352

RF-STAR

Company Name

Chip Manufacturer

Chipset

TI CC1352P7

Module Version

TheSecond PA Version

CC1352P7

GPIOs

Power

Filter

48.0 MHz

32.768 kHz

Reset

Sub-1 GHz

Antenna

Matching

2.4

GHz

Antenna

Matching

IPEX

Connector

Half-hole

Interface

Power Supply

1.8 V ~ 3.8 V

PA (Sub-1

GHz) Antenna

Matching

Switch

IPEX

Connector

Half-hole

Interface

Ant

Switch

Ant

Switch

                RF-TI1352P2 
www.szrfstar.com                                                                         V1.0 - Oct., 2023 
Shenzhen RF-star Technology Co., Ltd.                                                                                                                    Page  4  of  22                        
Table of Contents 
Device Overview............................................................................................................................................................. 1 
1 Description............................................................................................................................................................ 1 
2 Key Features ....................................................................................................................................................... 1 
3 Applications.......................................................................................................................................................... 2 
4 Functional Block Diagram .............................................................................................................................. 3 
5 Part Number Conventions.............................................................................................................................. 3 
Table of Contents................................................................................................................................................................ 4 
Module Configuration and Functions ...................................................................................................................... 6 
1 Module Parameters........................................................................................................................................... 6 
2 Module Pin Diagram ......................................................................................................................................... 7 
3 Pin Functions....................................................................................................................................................... 8 
Specifications .................................................................................................................................................................10 
1 Recommended Operating Conditions .....................................................................................................10 
2 Handling Ratings..............................................................................................................................................10 
3 PA Output Control............................................................................................................................................10 
Application, Implementation, and Layout.............................................................................................................11 
1 Module Photos..................................................................................................................................................11 
2 Recommended PCB Footprint....................................................................................................................11 
3 Schematic Diagram.........................................................................................................................................12 
4 Antenna................................................................................................................................................................12 
4.1 Antenna Design Recommendation ..............................................................................................12 
4.2 Antenna Output Mode Modification..............................................................................................13 
4.3 External Antenna Design Recommendation of the Half-Hole ANT Pin..........................13 
4.4 IPEX Connector Specification........................................................................................................15 
5 Basic Operation of Hardware Design ......................................................................................................15 
6 Trouble Shooting..............................................................................................................................................16 
6.1 Unsatisfactory Transmission Distance........................................................................................16 
6.2 Vulnerable Module..............................................................................................................................17 
6.3 High Bit Error Rate .............................................................................................................................17 
7 Electrostatics Discharge Warnings ...........................................................................................................17 
8 Soldering and Reflow Condition.................................................................................................................17 

RF-TI1352P2

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5 Optional Package Specification ..............................................................................................................................19

6 Revision History ............................................................................................................................................................21

7 Contact Us.......................................................................................................................................................................22

RF-TI1352P2

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2 Module Configuration and Functions

2.1 Module Parameters

Table 1. Parameters of RF-TI1352P2

Chipset

CC1352P7

Supply Power Voltage

1.8 V ~ 3.8 V, 3.3 V is recommended

Frequency

800 MHz ~ 928 MHz, 2402 MHz ~ 2480 MHz

Maximum Transmit Power

+20.0 dBm (Sub-1 GHz)

+5 dBm (2.4 GHz)

Receiving Sensitivity

-121 dBm @ Sub-1 GHz (Long-range Mode)

-110 dBm @ Sub-1 GHz (50 kbps)

-104 dBm @ Sub-1 GHz (100 kbps)

-97 dBm @ Bluetooth 5.0 (1 Mbps)

-92 dBm @ Bluetooth 5.0 (2 Mbps)

-104 dBm @ Bluetooth 5.0 (125 kbps LE Coded PHY)

GPIO

Flash

704 KB

ROM

256 KB

SRAM

88 KB

Power Consumption

RX current: 5.8 mA @3.6 V, 868 MHz

6.9 mA @3.0 V, 2.4 GHz

TX current: 63.0 mA @ +20 dBm, 3.3 V, 915 MHz

85.0 mA @ +20 dBm, 3.0 V, 2.4 GHz

22.0 mA @ +10 dBm, 2.4 GHz

MCU 48 MHz (CoreMark): 2.9 mA (60 μA/MHz)

Sensor Controller: 30.1 μA @ low power mode, 2 MHz, running infinite loop

808 μA @ active mode, 24 MHz, running infinite loop

Standby mode: 0.85 µA

Sleep Mode: 150 nA

Support Protocol

Thread, Zigbee®, Matter, Bluetooth® 5.3 Low Energy, IEEE 802.15.4g, IPv6-

enabled smart objects, (6LoWPAN), MIOTY®, Wireless M-Bus, Wi-SUN®, KNX

RF, Amazon Sidewalk, proprietary systems, SimpleLink™ TI 15.4-Stack (Sub-1

GHz)

RF-TI1352P2

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Crystal

48 MHz, 32.768 kHz

Package

SMT packaging (1.27-mm half-hole pitch stamp stick)

Dimension

26.5 mm × 16.9 mm × 2.1 mm

Type of Antenna

Half-hole ANT interface, IPEX connector

Operating Temperature

-40 ℃ ～ +85 ℃

Storage Temperature

-40 ℃ ～ +125 ℃

2.2 Module Pin Diagram

Figure 3. Pin Diagram of RF-TI1352P2

RF-TI1352P2

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3.3 Pin Functions

Table 2. Pin Functions of RF-TI1352P2

Name

Chip Pin

Function

Description

None connect

-None connect

DIO5

DIO_5

Digital

GPIO, high-drive capability

DIO6

DIO_6

Digital

GPIO, high-drive capability

DIO7

DIO_7

Digital

GPIO, high-drive capability

DIO8

DIO_8

Digital

GPIO

DIO9

DIO_9

Digital

GPIO

DIO10

DIO_10

Digital

GPIO

DIO11

DIO_11

Digital

GPIO

DIO12

DIO_12

Digital

GPIO

DIO13

DIO_13

Digital

GPIO

DIO14

DIO_14

Digital

GPIO

DIO15

DIO_15

Digital

GPIO

VDD

VDDS

VDD

Power Supply: 1.8 V ~ 3.8 V, recommend to 3.3 V

GND

Ground

TMSC

JTAG_TMSC

Digital

JTAG TMSC, high-drive capability

TCKC

JTAG_TCKC

Digital

JTAG TCKC

RES

RESET_N

Digital

Reset, active low. Internal pullup.

DIO16

DIO_16

Digital

GPIO, JTAG_TDO, high-drive capability

DIO17

DIO_17

Digital

GPIO, JTAG_TDI, high-drive capability

DIO18

DIO_18

Digital

GPIO

DIO19

DIO_19

Digital

GPIO

DIO20

DIO_20

Digital

GPIO

DIO21

DIO_21

Digital

GPIO

RF-TI1352P2

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DIO22

DIO_22

Digital

GPIO

DIO23

DIO_23

Digital or Analog

GPIO, analog capability

DIO24

DIO_24

Digital or Analog

GPIO, analog capability

DIO25

DIO_25

Digital or Analog

GPIO, analog capability

DIO26

DIO_26

Digital or Analog

GPIO, analog capability

DIO27

DIO_27

Digital or Analog

GPIO, analog capability

DIO28

DIO_28

Digital or Analog

GPIO, analog capability

None connect

GND

Ground

2G4-OUT

RF Out

2.4 GHz antenna pinout

GND

Antenna Ground

SUB-OUT

RF Out

Sub 1GHz antenna pinout

GND

Ground

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