Samsung SGH-D600 Bedienungsanleitung

GSM TELEPHONE

SGH-D600

GSM TELEPHONE CONTENTS

1. Specification

2. Circuit Description

3. Exploded Views and Parts List

4. Electrical Parts List

5. Block Diagrams

6. PCB Diagrams

7. Flow Chart of Troubleshooting

Samsung Electronics Co.,Ltd. September. 2005

Printed in Korea.

Code No.: GH68-08500A

BASIC.

This Service Manual is a property of Samsung Electronics Co.,Ltd.

Any unauthorized use of Manual can be punished under applicable

International and/or domestic law.

ⓒ

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1. Specification

This Document can not be used without Samsung's authorization

1-1

1-1. GSM General Specification

GSM850

phase1 GSM900

Phase 1 EGSM 900

Phase 2 DCS1800

Phase 1 PCS1900

Freq.

Band[MHz]

Uplink/Downlin

824~849

869~894 890~915

935~960 880~915

925~960 1710~1785

1805~1880 1850~1910

1930~1990

ARFCN range 128~251 1~124 0~124 &

975~1023 512~885 512~810

Tx/Rx spacing 45MHz 45MHz 45MHz 95MHz 80MHz

Mod. Bit rate/

Bit Period 270.833kbps

3.692us 270.833kbps

3.692us

Time Slot

Period/Frame

Period

576.9us

4.615ms 576.9us

4.615ms

Modulation 0.3GMSK 0.3GMSK 0.3GMSK 0.3GMSK 0.3GMSK

MS Power 33dBm~13dBm 33dBm~13dBm 33dBm~5dBm 30dBm~0dBm 30dBm~0dBm

Power Class 5pcl ~ 15pcl 5pcl ~ 15pcl 5pcl ~ 19pcl 0pcl ~ 15pcl 0pcl ~ 15pcl

Sensitivity -102dBm -102dBm -102dBm -100dBm -100dBm

TDMA Mux 8 8 8 8 8

Cell Radius 35Km 35Km 35Km 2Km -

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Specification

1-2

1-2. GSM TX power class

Power

control

level

GSM900

5 33±2 dBm

6 31±2 dBm

7 29±2 dBm

8 27±2 dBm

9 25±2 dBm

10 23±2 dBm

11 21±2 dBm

12 19±2 dBm

13 17±2 dBm

14 15±2 dBm

15 13±2 dBm

16 11±3 dBm

17 9±3dBm

18 7±3 dBm

19 5±3 dBm

Power

control

level

DCS1800

0 30±2 dBm

1 28±3 dBm

2 26±3 dBm

3 24±3 dBm

4 22±3 dBm

5 20±3 dBm

6 18±3 dBm

7 16±3 dBm

8 14±3 dBm

9 12±4 dBm

10 10±4 dBm

11 8±4dBm

12 6±4 dBm

13 4±4 dBm

14 2±5 dBm

15 0±5 dBm

ower

control

level

PCS1900

0 30±2 dBm

1 28±3 dBm

2 26±3 dBm

3 24±3 dBm

4 22±3 dBm

5 20±3 dBm

6 18±3 dBm

7 16±3 dBm

8 14±3 dBm

9 12±4 dBm

10 10±4 dBm

11 8±4dBm

12 6±4 dBm

13 4±4 dBm

14 2±5 dBm

15 0±5 dBm

Power

control

level

GSM850

5 33±3 dBm

6 31±3 dBm

7 29±3 dBm

8 27±3 dBm

9 25±3 dBm

10 23±3 dBm

11 21±3 dBm

12 19±3 dBm

13 17±3 dBm

14 15±3 dBm

15 13±3 dBm

16 11±5 dBm

17 9±5 dBm

18 7±5 dBm

19 5±5 dBm

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2. Circuit Description

This Document can not be used without Samsung's authorization

2-1

2-1. SGH-D600 RF Circuit Description

2-1-1. RX PART

- FEM(F100 SWICHPLEXER)

Switching Tx, Rx path for GSM850, GSM900, DCS1800 and PCS1900 by logic controlling.

- ANTENNA SWITCH Control Logic (F100) →Truth Table

VC_1 VC_2 VC_3

GSM850/900 Rx Mode L L L

DCS Rx Mode L L L

PCS Rx Mode LL H

GSM Tx Mode (GSM850/900) H L L

DCS/PCS Tx Mode L H L

- FILTER

To convert Electromagnetic Field Wave to Acoustic Wave and then pass the specific frequency band.

- GSM850 FILTER (L113,C133,C134,C135) →For filtering the frequency band between 869 ~ 894 MHz.

- GSM900 FILTER (L106,C122,C123,C124) →For filtering the frequency band between 925 ~ 960 MHz.

- DCS FILTER (L108,L109,C129,C130) →For filtering the frequency band 1805 and 1880 MHz.

- PCS FILTER (L110,L111,C131,C132) →For filtering the frequency band 1930 and 1990 MHz.

- VC-TCXO (U102)

To generate the 26MHz reference clock to drive the logic and RF.

After additional process, the reference clock applies to the U100 Rx IQ demodulator and Tx IQ modulator.

The oscillator for RX IQ demodulator and Tx modulator are controlled by serial data to select channel and use fast lock

mode for GPRS high class operation.

- TRANSCEIVER (U100)

This chip fully integrated GSM GPRS quad-band transceiver with transmit baluns, loop filters and most of the passive

component in it.

And also fully integrated fractional N RF synthesizer with AFC control possibility, RF VCO with integrated supply

regulator. semi integrated reference oscillator with integrated supply regulator.

RF Receiver front-end amplifies the GSM850, E-GSM900, DCS1800 and PCS1900 aerial signal, convert the chosen

channel down to a low IF of 100kHz.

In IF section, further amplifies the wanted channel output level to the desired value and rejects DC.

2-1-2. TX PART

The transmitter is fully differential using a direct up conversion architecture. It consists of a signal side band

power up mixer. Gain is controlled by 6 dB via 3-wire serial bus programing. The fully integrated VCO and power

mixer achieve LO suppression, quadrature phase error, quadrature amplitude balance and low noise floor specification.

Output matching/balun components drive a standard 50 ohms single ended load.

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Circuit Description

2-2

2-2. Baseband Circuit description of SGH-D600

2-2-1. PCF50603 (U400)

- Power Management

Eight low-dropout regulators designed specifically for GSM applications power the terminal and help ensure optimal

system performance and long battery life. A programmable boost converter provides support for 1.8V, 3.0V SIMs,

while a self-resetting, electronically fused switch supplies power to external accessories. Ancillary support functions,

such as RTC module and High Voltage Charge pump, Clock generator, aid in reducing both board area and system

complexity.

I2C BUS serial interface provides access to control and configuration registers. This interface gives a microprocessor

full control of the PCF50603 and enables system designers to maximize both standby and talk times.

Supervisory functions. including a reset generator, an input voltage monitor, and a temperature sensor, support reliable

system design. These functions work together to ensure proper system behavior during start-up or in the event of a

fault condition(low microprocessor voltage, insufficient battery energy, or excessive die temperature).

- Clock Generator

The Clock Generator (CG) generates all clocks for internal and external usage. The 32.768 kHz crystal oscillator

provides an accurate low clock frequency for the PCF50603 and other circuitry.

2-2-2. LCD

LCD is consisted of main LCD(color 262K TFT LCD).

Chip select signals in the U301, LCD_MAIN_CS, can enable LCD. BACKLIGHT signal enables white LED of main LCD.

16-bit data lines(LD(0)~LD(15)) transfers data and commands to LCD. Data and commands use "RS" signal. If this signal

is high, Inputs to LCD are commands. If it is low, Inputs to LCD are data. The signal which informs the input or output

state to LCD, is required. But this system is not necessary this signal. So "L_WRB" signal is used to write data or

commands to LCD. Power signals for LCD are "VDD_IO_HIGH".

2-2-3. Key

This is consisted of key interface pins KEY_ROW(0:4) and KEY_COL(0:4) in PCF5212EL1. These signals compose the

matrix. Result of matrix informs the key status to key interface in the PCF5212EL1. Power on/off key is seperated from

the matrix. So power on/off signal is connected with PCF50603 to enable PCF50603. Key LED is consisted of six white

LEDsforsubkeyandtwelvewhiteLEDsformainkey. White LED for sub key use the VBAT voltage.

"SLIDER_KEY_ON" signal enables Transistor for sub key backlight.

Main key LED use the 3.3V LDO for a supply voltage. KEY_LED_ON signal enables eight white LED.

"FLIP" informs the status of slide (open or closed) to the PCF5213EL1. This uses the hall effect IC, EM-1681

A magnet under LCD enables EM-1681.

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Circuit Description

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2-3

2-2-4. EMI ESD Filter

This system uses the EMI ESD filter, U500 to protect noise from IF CONNECTOR part.

2-2-5. IF connetor

It is 18-pin connector. They are designed to use VBAT, V_EXT_CHARGE, USB_D+, +VBUS, USB_D-, TXD1, RXD1,

AUX_ON, EXT1, EXT2, HFK_SPK, HFK_MIC and GND. They connected to power supply IC, microprocessor and signal

processor IC.

2-2-6. Battery Charge Management

A complete constant-current/constant-voltage linear charger for single cell lithium-ion batteries.

If TA connected to phone, "V_EXT_CHARGE" enable charger IC and supply current to battery.

When fault condition caused, "CHG_ON" signal level change low to high and charger IC stop charging process.

2-2-7. Audio

HFR_P and HFR_N from PCF5212El1 are connected to the main speaker via analog switches. MIC_P and MIC_N

are connected to the main MIC as well. EAR1 is the source of External Speaker. AK4642 is 16-bit stereo audio CODEC

with a built-in microphone - Amplifier and Headphone - Amplifier.

I2S signals from CL8522S5 are decoded with audio analog signals. SAPA1D2-24ELP amplify these signals and deliver to

stereo speakers.

2-2-8. Memory

This system uses Samsung's memory, KBH10PD00M-D414. The KBH10PD00M is a Multi Chip Package Memory which

combines 256Mbit Synchronous Burst Multi Bank NOR Flash Memory and two 1Gbit OneNAND Flash and

256Mbit Synchronous Burst UtRAM.

It has 16 bit data line, HD[1~16] which is connected to PCF5212 and CL8522S5, also has 24 bit address lines,

HA[1~24]. There are 3 chip select signals, CS0n_FLASH, CS4n_NAND, and CS1n_RAM.

In the Wrting process, WEn is fallen to low and it enables writing process to operate. During reading process,

OEn is fallen to low and it enables reading process to operate. Each chip select signals in the PCF5212 choose

different memories.

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Circuit Description

2-4

2-2-9. PCF5212EL1

The PCF5212EL1 is mainly composed of embeded DSP and ARM core. The DSP subsystem includes the Saturn

DSP core with embedded RAM and ROM, and a set of peripherals. It has 24kx16 bits PRAM, 104k*16 bits,

32k*16 XYRAM and 63k*16 XYROM in the DSP.

The ARM946E-S consists of an ARM9E-S processor core, 8 kbyte instruction cache and 8 kbyte data cache,

tghtly-coupled ITCM(Instruction Tightly Coupled Memory) and DTCM(Data Tightly Coupled Memory) memories, a

memory protection unit, and an AMBA(Advanced Microcontroller Bus Architecture) AHB(Advanced

High-performance Bus) bus interface with a write buffer.

HD(0:15), data lines and HA(0:23), address lines are connected to KBJ10KB00M (memory), MV319DNQ (image dsp)

and YMU765 (melody IC). It has 64 kbyte SC RAM (0.5 Mbit) and 32 kbyte SC program ROM for bootstrap

loader in the ARM core.

HD(0:15), data lines and HA(0:23), address lines are connected to memory and YMU765 to communicate.

MV319DNQ(Camera DSP Chip) controls the communication between ARM core and DSP core.

OEn, WEn control the access of memory. KROW, and KCOL recognize the key string input status.

It has J-TAG control pins (TDI/TDO/TCK) for ARM and DSP core. J-SEL signal controls different access to ARM

and DSP core.

ADC(Analog to Digital Convertor) receives the condition of temperature, battery type and battery voltage.

2-2-10. TCO-5888T (26MHz)

This system uses the 26MHz TCXO, TCO-5871U, Toyocom. AFC control signal form PCF5212 controls

frequency from 26MHz x-tal. It generates the clock frequency. This clock is connected to PCF5212, YMU765 and

UAA3587.

2-2-11. Multimedia Chip (CL8522S5)

CL8522S5 is the hardware based MPEG4 CODEC is available to capture the video signal of up to CIF Resolution

(352X288, at 30FPS). CL8522S5 directly transmits and previews the RGB Data to the LCD graphic memory by

processing the sensor output data. It can save the raw RGB data up to 1600x1200 into its image buffer and allows the

host processor to download with scalable sized compressed data.

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3. Exploded View and Parts List

3-1

This Document can not be used without Samsung's authorization

3-1. Exploded View

QMW01

QFU01

QKP02

QMO01

QLC01

QAU01

QME02

QCR32

QFL01

QSC11

QHI01

QCR26

QPC01

QFR01

QCR32

QKP01

QMP01

QAN02

QME01

QCA02

QCA01

QVK01

QRE01

QCK01

QVO01

QRF01 QCR31

QIF01

QBA01

QAN05

QSP01

QSP02

QAN06

QCR12

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Exploded view and Part List

3-2

This Document can not be used without Samsung's authorization

3-2. Parts List

Location No Description Sec Code

QAN05 ㅤMEC-INTENNA CONN RUBBER;SGH-D600,EU, GH75-08200A

QAN06 ㅤMEC-INTENNA CONN RUB SM;SGH-D600,EU, GH75-08201A

QAU01 ㅤAUDIO-RECEIVER;32ohm,109dB±2dB,11X6 3009-001125

QBA01 ㅤBATTERY-900MAH,BLK,ENG,M;BST4389BE,S GH43-01939A

QCA01 ㅤUNIT-CAMERA;SGH-D600,IC04001AA,-,EU, GH59-02171A

QCA02 ㅤUNIT-CAMERA KEY;SGH-D600,H/K F.P.C A GH59-02208A

QCK01 ㅤPMO-CAMERA KEY;SGH-D600,PC(K2261),BL GH72-22444A

QCR12 ㅤSCREW-MACHINE;PH,+,M1.4,L2.5,ZPC(BLK 6001-001530

QCR26 ㅤSCREW-MACHINE;CH,+,M1.7,L3,ZPC(BLK), 6001-001850

QCR31 ㅤSCREW-MACHINE;CH,+,M1.7,L3,ZPC(BLK), 6001-001795

QFR01 ㅤMEC-FRONT COVER;SGH-D600,EU,-,-,-,-, GH75-07212A

QFU01 ㅤMEC-SLIDE UPPER;SGH-D600,EU,-,-,-,-, GH75-07334A

QIF01 ㅤPMO-IF COVER;SGH-D600,PC+UREATHANE,B GH72-22629A

QKP01 ㅤMEC-KEYPAD MAIN;SGH-D600,EU,-,-,-,-, GH75-07207A

QKP02 ㅤMEC-KEYPAD SUB;SGH-D600,EU,-,-,-,-,C GH75-07206A

QLC01 ㅤLCD-LCD MODULE;LTS200QV-F03-0,SGH-D6 GH07-00734A

QME01 ㅤUNIT-METAL DOME;SGH-D600,-,-,EU,12V, GH59-02206A

QME02 ㅤUNIT-KEY PAD;SGH-D600,HUW9555-010010 GH59-02094A

QMO01 ㅤMOTOR DC-SGHZ130;DMJBRV83CG,SGH-Z130 GH31-00153B

QMP01 ㅤPBA MAIN-SGHD600;SGH-D600,EU,EU,PBA GH92-02191A

QMW01 ㅤPCT-WINDOW MAIN;SGH-D600,ACRYL,TRP,- GH72-22505A

QPC01 ㅤPCB-FPCB;SGH-D600,POLYIMIDE,3L,-,0.0 GH41-00892A

QRE01 ㅤMEC-REAR COVER;SGH-D600,EU,-,-,-,-,C GH75-07208A

QRF01 ㅤMPR-R/F CAP;SGH-D600,PC SHEET,P5.4XT GH74-15303A

QSC11 ㅤRMO-LOWER SCREW CAP;SGH-D600,CR RUBB GH73-05136A

QVK01 ㅤUNIT-VOLUME KEY;SGH-D600,SGH-D600 V/ GH59-02207A

QVO01 ㅤPMO-VOLUME KEY;SGH-D600,PC(K2261),BL GH72-22445A

QSP02 ㅤUNIT-SPEAKER MODULE;SGH-D600,SS-SGH- GH59-02364A

ㅤQSP01 SPEAKER;0.7W,8.0ohm,87dB±2dB,700Hz, 3001-001788

ㅤQAN02 INTENNA-SGHD600;EWPADG006A,SGH-D600, GH42-00596A

QFL01 ㅤMEC-SLIDE LOWER;SGH-D600,EU,-,-,-,-, GH75-07210A

ㅤQCR32 SCREW-MACHINE;CH,+,M1.4,L2,ZPC(BLK), 6001-001700

ㅤQHI01 MEC-HINGE MODULE;SGH-D600,EU,-,-,-,- GH75-07211A

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