Siemens CX75 Einrichtungshandbuch
Company Confidential s Com
Copyright 2005© Siemens AG
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TI_Repair_L2.5l_CX75_M75_R1.0.pdf Release 1.0
Service Repair Documentation
Level 2.5 light – CX75, M75
Release Date Department Notes to change
1.0 06.06..2005 ICM MP CCQ GRM T New document
Company Confidential s Com
Copyright 2005© Siemens AG
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TI_Repair_L2.5l_CX75_M75_R1.0.pdf Release 1.0
Introduction
This Service Repair Documentation is intended to carry out repairs on Siemens repair level
2.5 light. The described failures shall be repaired in Siemens authorized local workshops
only,
The level 2.5 (former Level 2.5e) partners are obliged to repair level 2 classified boards, up
to their repair level, under consideration of the information given by level 2.5 (former level
2.5e) repair instruction.
All repairs have to be carried out in an ESD protected environment and with ESD protected
equipment/tools. For all activities the international ESD regulations have to be considered.
Assembling/disassembling has to be done according to the latest CX75, M75 Level 2 repair
documentation and special product dissembling instructions. It has to be ensured that every
repaired mobile Phone is checked according to the latest released General Test Instruction
document (both documents are available in the Technical Support section of the C-market).
Check at least weekly C-market for updates and consider all products related Customer
Care Information, and Repair Information who are relevant for CX75 and M75.
CX75 Partnumber on IMEI label: S30880-S7420-#xxx
M75 Partnumber on IMEI label: S30880-S7430-#xxx
, while # may be any letter (A-Z) and xxx may be any number from 100, 101, 102....
Scrap Handling: All Scrap information given in this manual are related to the
SCRAP-Rules and instructions.
Attention: Consider the new "LEAD-FREE" soldering rules
(available in the communication market), avoid excessive heat.
If you have any questions regarding the repair procedures or technical questions spare not
hesitate to contact our technical support team in Kamp-Lintfort, Germany:
Tel.: +49 2842 95 4666
Fax: +49 2842 95 4302
Company Confidential s Com
Copyright 2005© Siemens AG
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TI_Repair_L2.5l_CX75_M75_R1.0.pdf Release 1.0
Table of Content
1CX75, M75 board layout................................................................................................................4
2Connector SIM Card Reader.........................................................................................................5
3Connector IO Jack.........................................................................................................................6
4Connector Board to Board.............................................................................................................8
5Connector Battery .........................................................................................................................9
6Connector MMC ..........................................................................................................................10
7Connector Resister Filter.............................................................................................................11
8Connector Camera......................................................................................................................12
9Connector Display.......................................................................................................................13
10 IRDA.........................................................................................................................................14
11 JOYSTICK................................................................................................................................15
Company Confidential s Com
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TI_Repair_L2.5l_CX75_M75_R1.0.pdf Release 1.0
1 CX75, M75 board layout
Jigs, Tools and Working materials for all described repairs:
-hot air blower
-soldering gun
-tweezers
-flux
-solder
Connector
MMC Joystick
Connector
Display
Connector
Board to
Board
IO Jack
Slim Connector
Antenna
Connector
Battery
Connector
Camera
Resister
Filter
Connector
SIM Card
Reade
r
IRDA
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2 Connector SIM Card Reader
Fault Symptoms
Customer: GRT:
Handset does not accept SIM card SIM Card Problems
Connector SIM Card Reader
Use soldering iron to remove defective component. Avoid excessive heat! Watch surrounding components!
Resolder new component afterwards.
E-commerce order number: L36334-Z97-C337
E-commerce order name: CONNECTOR SIM CARD READER K1
Soldering temperature: ~ 360°C TIP Temp.
IRIS Diagnose Code: 43300 Interface/SIM Cardreader/Mechanical Damage
Surrounded Components
R1614 RESISTOR 4K7 (Type8) L36842-C472-J
C1605 CAPACITOR 2220N (Type3) L36853-C6224-M6
Z1601 FILTER SIM PROTECTION PB FREE L50620-U6029-D670
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TI_Repair_L2.5l_CX75_M75_R1.0.pdf Release 1.0
Connector IO Jack
Fault Symptoms
Customer: GRT:
Charging Problems No connection to GRT
Problems with external loudspeaker or microphone when using a car kit Tbd.
Problems with accessories connected at the IO connector
Connector IO Jack
Use soldering iron to remove defective component. Avoid excessive heat! Watch surrounding components!
Resolder new component afterwards.
E-commerce order number: L36334-Z93-C303
E-commerce order name: IO-JACK SLIM 12-POL
Soldering temperature: ~ 360°C TIP Temp.
IRIS Diagnose Code: 46100 Interface/Charging Connector/Mechanical Damage
47300 Interface/Data Interface/Mechanical Damage
4B100 Interface/Headset Connector/Mechanical Damage
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TI_Repair_L2.5l_CX75_M75_R1.0.pdf Release 1.0
Important additional soldering hints
The MMC Reader is located on the opposite of the SLIM-Lumberg connector.
Therefore the risk to damage the plastic material of this MMC-Reader is
potentially high if excessive heat is used while removal or soldering of the
SLIM-Lumberg connector.
Please follow these instructions:
a) Remove the SLIM-Lumberg connector with a soldering iron and Desolder
Wick
b) Clean the Pads afterwards
c) Solder the new connecter by using soldering iron under consideration of
the max. allowed temperature range.
Samples of critical area:
Lock mechanism damaged Lock mechanism OK
Company Confidential s Com
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TI_Repair_L2.5l_CX75_M75_R1.0.pdf Release 1.0
3 Connector Board to Board
Fault Symptoms
Customer: GRT:
Keyboard malfunction Keyboard malfunction
Keypad illumination does not work Tbd.
Connector Board to Board
Use hot air blower to remove defective component. Avoid excessive heat! Watch surrounding components!
Resolder new component afterwards.
E-commerce order number: L50634-Z97-C346
E-commerce order name: CONNECTOR BOARD TO BOARD 12-POL.
Soldering temperature: ~ 360°C TIP Temp.
IRIS Diagnose Code: 32100 Keys / Main / No Function
32200 Keys / Main / Reduced Functionality
36000 Keys / Illumination
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TI_Repair_L2.5l_CX75_M75_R1.0.pdf Release 1.0
4 Connector Battery
Fault Symptoms
Customer: GRT:
Mobile does not switch on No connection to GRT
Connector BATTERY
Use hot air blower to remove defective component. Avoid excessive heat! Watch surrounding components!
Resolder new component afterwards.
E-commerce order number: L36334-Z97-C213
E-commerce order name: CONNECTOR BATTERY 3-POL
Soldering temperature: ~ 360°C TIP Temp.
IRIS Diagnose Code: 13000 Battery/Mechanical Damage
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TI_Repair_L2.5l_CX75_M75_R1.0.pdf Release 1.0
5 Connector MMC
Fault Symptoms
Customer: GRT:
MMC malfunction Tbd.
Connector MMC
Use soldering iron to remove defective component. Avoid excessive heat! Watch surrounding components!
Resolder new component afterwards.
E-commerce order number: L50634-Z97-C415
E-commerce order name: CONNECTOR RS MMC X75; CONNECTOR RS MMC X75
Soldering temperature: ~ 360°C TIP Temp.
IRIS Diagnose Code: 4E000 Interfaces/ Memory Card Rerader
Attention: Avoid excessive heat in order not to damage the plastic material of the
connector (see problem SLIM-Lumberg connector)
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4
Dieses Handbuch passt für folgende Modelle
1
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