Silicon Laboratories UG532 Bedienungsanleitung

UG532: ZGM230S Dev Kit User's Guide

The ZGM230S Dev Kit is a low-cost, small form factor develop-

ment and evaluation platform for the ZGM230S Z-Wave SiP Mod-

ule (System-in-Package Module).

The board is a small and cost-effective, feature-rich, prototype and development platform

based on the ZGM230S Z-Wave System-in-Package Module. The ZGM230S Dev Kit is

an ideal platform for developing energy-friendly connected IoT devices.

A built-in SEGGER J-Link debugger ensures easy debugging through the USB Type-C

connector.

TARGET DEVICE

• ZGM230S Z-Wave SiP Module

(ZGM230SB27HGN3)

•+14 dBm TX power

• -110.9 dBm RX sensitivity @100 kbps

• 32-bit ARM® Cortex®-M33 with 39 MHz

maximum operating frequency

• 512 kB flash and 64 kB RAM

• Integrated DC-DC converter

KIT FEATURES

• SMA connector for antenna connection

• Power control of on-board peripherals for

ultra-low power operation

•Relative humidity and temperature sensor

• Ambient light sensor

• Hall effect sensor

• 6-axis inertial sensor

• LC sensor for metal detection

• Pressure sensor

• 8 Mbit flash for OTA programming and

data logging

• RGB LED, two single color LEDs, and two

push buttons

• 20-pin 2.54 mm breakout pads

• Qwiic® connector

• SEGGER J-Link on-board debugger

• Virtual COM port

• Packet Trace Interface (PTI)

• Mini Simplicity connector for AEM and

packet trace using external Silicon Labs

debugger

• USB or coin cell battery powered

• External battery connector

SOFTWARE SUPPORT

• Simplicity Studio™

Table of Contents

1. Introduction ................................

1.1 Kit Contents ...............................4

1.2 Getting Started ..............................4

1.3 Hardware Content .............................4

1.4 Kit Hardware Layout ............................5

2. Specifications ...............................6

2.1 Recommended Operating Conditions ......................6

2.2 Current Consumption ............................7

3. Hardware .................................9

3.1 Block Diagram ..............................9

3.2 Power Supply ..............................10

3.3 ZGM230S Reset .............................10

3.4 Peripherals ...............................11

3.4.1 Si7021 Relative Humidity and Temperature Sensor ................12

3.4.2 Si7210 Hall Effect Sensor .........................12

3.4.3 ICM-20689 6-Axis Inertial Sensor ......................13

3.4.4 VEML6035 Ambient Light Sensor ......................14

3.4.5 BMP384 Barometric Pressure Sensor .....................14

3.4.6 External Memory ............................15

3.4.7 Push Buttons, Single-color LEDs and RGB LED .................15

3.4.8 Metal Detector (LC Sensor) ........................16

3.5 On-board Debugger ............................17

3.6 Connectors ...............................18

3.6.1 Breakout Pads ............................19

3.6.2 Qwiic Connector ............................20

3.6.3 Mini Simplicity Connector .........................20

3.6.4 Debug USB Type-C Connector .......................20

4. Debugging ...............................21

4.1 On-board Debugger ............................22

4.2 External Debugger.............................22

4.3 Virtual COM Port .............................22

5. Radio .................................23

5.1 Introduction ...............................23

5.2 EMC Compliance .............................23

5.2.1 Introduction .............................23

5.2.2 EMC Regulation Emission Limits ......................23

5.3 RF Performance .............................24

5.3.1 Conducted Power Measurements ......................24

5.3.2 Radiated Power Measurements .......................26

silabs.com | Building a more connected world. Rev. 1.0 | 2

5.4 EMC Compliance Recommendations ......................29

5.4.1 Recommendations for 868 MHz ETSI ETSI EN 300-200-1 Compliance .........29

5.4.2 Recommendations for 915 MHz FCC 15.247 Compliance ..............30

5.4.3 Recommendations for 921 MHz ARIB STD-T108 Compliance ............30

6. Schematics, Assembly Drawings, and BOM ...................31

7. Kit Revision History and Errata .......................32

7.1 Revision History .............................32

7.2 Errata .................................32

8. Board Revision History and Errata ......................33

8.1 Revision History .............................33

8.2 Errata .................................33

9. Document Revision History .........................34

silabs.com | Building a more connected world. Rev. 1.0 | 3

1. Introduction

The ZGM230S Dev Kit (OPN: ZGM230-DK2603A) has been designed to inspire customers to make battery-operated IoT devices with

the Silicon Labs ZGM230S Z-wave System-in-Package (SiP) Module. The highlights of the board include six different environmental

sensors accessible to the ZGM230S wireless MCU. The peripherals are grouped into power domains that can be turned on and off by

the application code as needed.

Programming the ZGM230S Dev Kit is easily done using a USB Type-C cable and the on-board J-Link debugger. A USB virtual COM

port provides a serial connection to the target application, and the Packet Trace Interface (PTI) offers invaluable debug information

about transmitted and received packets in wireless links. Included on the board is an 8 Mbit serial flash that can be used for Over-The-

Air (OTA) firmware upgrade, or as a general-purpose, non-volatile memory. The ZGM230S Dev Kit is supported in Simplicity Studio™,

and a Board Support Package (BSP) is provided to give application developers a flying start.

Energy profiling and advanced wireless network analysis and debugging tools are available through the provided Mini Simplicity Con-

nector using an external Silicon Labs debugger.

Connecting external hardware to the ZGM230S Dev Kit can be done using the 20 breakout pads, which present peripherals from the

ZGM230S Z-Wave SiP Module such as I2C, SPI, UART, and GPIOs. The breakout pads follow the same pinout as the expansion head-

ers (EXP) on other Silicon Labs Starter Kits. The board also features a Qwiic connector which can be used to connect hardware from

the Qwiic Connect System through I2C.

1.1 Kit Contents

The following items are included in the box:

• 1x ZGM230S Dev Kit board (BRD2603A).

• 1x 868-915 MHz antenna (LPRS ANT-SS900).

1.2 Getting Started

Detailed instructions for how to get started with your new ZGM230S Dev Kit can be found on the Silicon Labs web page:

https://www.silabs.com/dev-tools

1.3 Hardware Content

The following key hardware elements are included on the ZGM230S Dev Kit:

• ZGM230S SiP Module with 39 MHz operating frequency, 512 kB kB flash, and 64 kB RAM

• SMA antenna connector for wireless transmission

• Silicon Labs Si7021 relative humidity and temperature sensor

• Silicon Labs Si7210 Hall effect sensor

• Vishay VEML6035 ambient light sensor

• TDK InvenSense ICM-20689 6-axis inertial sensor

• Bosch Sensortec BMP384 pressure sensor

• Macronix ultra-low power 8 Mbit SPI flash (MX25R8035F)

• LESENSE metal detector LC-sensor

• Two single color LEDs and two push buttons

• RGB LED

• Power enable signals and isolation switches for ultra-low power operation

• On-board SEGGER J-Link debugger for easy programming and debugging, which includes a USB virtual COM port and Packet

Trace Interface (PTI)

• Mini Simplicity connector for access to energy profiling and advanced wireless network debugging

• Qwiic connector for connecting external hardware from the Qwiic Connect System

• Breakout pads for GPIO access and connection to external hardware

• Reset button

• Automatic switchover between USB and battery power

• CR2032 coin cell holder and external battery connector

UG532: ZGM230S Dev Kit User's Guide

Introduction

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1.4 Kit Hardware Layout

ZGM230S Dev Kit layout is shown below.

Top View Bottom View

Push Buttons

35.6 mm

55.9 mm

Reset Button

20-pin EXP-header

Breakout Pads

6-axis

Inertial Sensor

Qwiic Connector

USB Type-C Connector

- Virtual COM port

- Debug access

- Packet trace

Hall Effect

Sensor

LEDs

Humidity and

Temperature Sensor

Mini Simplicity

Connector

Pressure

Sensor

Ambient

Light & UV

Sensor

ZGM230S

Z-Wave 800

SiP Module

SMA Antenna

Connector

On-board USB

J-Link Debugger

External

Battery Connector

CR2032 Coin Cell

Holder

RGB LED

LC Sensor

Figure 1.1. ZGM230S Dev Kit Hardware Layout

UG532: ZGM230S Dev Kit User's Guide

Introduction

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2. Specifications

2.1 Recommended Operating Conditions

The following table is intended to serve as a guideline for correct use of the ZGM230S Dev Kit, indicating typical operating conditions

and some design limits.

Table 2.1. Recommended Operating Conditions

Parameter Symbol Min Typ Max Unit

USB Supply Input Voltage VUSB — 5.0 — V

Battery Supply Input Voltage VVBAT 1.9 3.0 3.6 V

Supply Input Voltage (VMCU supplied externally) VVMCU 1.9 3.3 3.6 V

Operating Temperature TOP — 25 — ˚C

UG532: ZGM230S Dev Kit User's Guide

Specifications

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2.2 Current Consumption

The table below summarizes the data sheet current consumption of the various components on the board. The operating current of the

board greatly depends on the application. The number of enabled sensors, how often they are sampled, and how often the radio is

transmitting or receiving are examples of factors that influence the operating current. In many cases the given conditions differ from the

operating conditions on the ZGM230S Dev Kit, but the table can still be used as an indication of how much each feature contributes to

the total current consumption. More details can be found in the specific data sheet for each device.

Table 2.2. Current Consumption

Parameter Symbol Condition Typ Unit

ZGM230S Current Con-

sumption1

IZGM230S MCU current consumption in EM0 mode with all peripherals

disabled, VREGVDD = IOVDD = 3.3 V, VSCALE1, 39 MHz

crystal, CPU running Prime from flash at 25 ˚C

27 µA/MHz

EM4, BURTC with LFRCO 0.7 µA

Radio system current consumption in receive mode, active

packet reception (VREGVDD = IOVDD = 3.3 V, MCU in EM1

and all MCU peripherals disabled, HCLK = 39 MHz, 100

kbps, 2-GFSK, f = 916 MHz, VSCALE1, EM1P at 25 ˚C)

4.9 mA

Radio system current consumption in transmit mode

(VREGVDD = IOVDD = 3.3 V, MCU in EM1 and all MCU pe-

ripherals disabled, HCLK = 39 MHz, f = 916 MHz, CW, 14

dBm output power, VSCALE1 at 25 ˚C)

30 mA

Ambient Light Sensor Cur-

rent Consumption 2

IVEML6035 Shutdown at 1.8 V 0.5 µA

Operation mode at 1.8 V (ALS only) 170 µA

RH/Temp Sensor Current

Consumption3

ISi7021 Standby, -40 to +85˚C 0.06 µA

RH conversion in progress 150 µA

Temperature conversion in progress 90 µA

Peak IDD during I2C operations 3.5 mA

Hall Effect Magnetic Sensor

Current Consumption 4

IDD Sleep mode at 3.3 V 50 nA

Average current for periodic activation at 3.3 V, sleep timer

enabled, 200 msec sleep time

0.4 µA

Conversion in progress at 3.3 V 5 mA

Pressure Sensor Current

Consumption5

IBMP384 Ultra-low power mode (ODR = 1 Hz) 3.4 µA

Highest resolution (ODR = 1 Hz) 46.4 µA

IMU Current Consumption6IIMU Full-chip sleep mode at 1.8 V supply 6 µA

Gyroscope Only, 100 Hz update rate at 1.8 V supply 1.6 mA

Accelerometer only, 100 Hz update rate at 1.8 V supply 57 µA

Gyroscope + Accelerometer, 100 Hz update rate at 1.8 V

supply

1.9 mA

Serial Flash Memory Cur-

rent Consumption 7

IFlash Deep power-down current in ultra-low power mode at 1.8 V 0.007 µA

Standby current in ultra-low power mode at 1.8 V 5 µA

Write status register current in ultra-low power mode at 1.8 V 3.1 mA

On-board Debugger Sleep

Current Consumption 8

IDBG On-board debugger current consumption when USB cable is

not inserted (EFM32GG12 EM4S mode current consumption)

80 nA

UG532: ZGM230S Dev Kit User's Guide

Specifications

silabs.com | Building a more connected world. Rev. 1.0 | 7

Parameter Symbol Condition Typ Unit

Minimum Board Current

Consumption

IBOARD Minimum total board current consumption for VMCU = 3.3 V

with ZGM230S in EM4S, the USB cable disconnected, and all

peripherals either in sleep mode or disconnected

0.5 µA

Note:

1. From ZGM230S data sheet

2. From VEML6035 data sheet

3. From Si7021-A20 data sheet

4. From Si7210 data sheet

5. From BMP384 data sheet

6. From ICM-20689 data sheet

7. From MX25R8035F data sheet

8. From EFM32GG12 data sheet

UG532: ZGM230S Dev Kit User's Guide

Specifications

silabs.com | Building a more connected world. Rev. 1.0 | 8

3. Hardware

The core of the ZGM230S Dev Kit is the ZGM230S Z-Wave SiP Module (System-in-Package Module). The board also contains several

peripherals connected to the ZGM230S. Refer to section 1.4 Kit Hardware Layout for placement and layout of the hardware compo-

nents.

3.1 Block Diagram

An overview of the ZGM230S Dev Kit is illustrated in the figure below.

Memory

Sensors

Radio

Device Connectivity

Debugging

J-Link

Debugger

USB Type-C

Connector

SMA Antenna

Connector

8 Mbit

MX25R

Buttons and LEDs

ZGM230S

Z-Wave SiP Module

Breakout Pads

(EXP-Header pinout)

Si7021 Si7210

VEML6035

Temperature

& Humidity

Sensor

Ambient

Light

Sensor

Hall Effect

Sensor

ICM-20689

6-axis Inertial

Sensor

BMP384

Pressure

Sensor

User Buttons

& LEDs

Mini-Simplicity

Connector

Serial Flash

Qwiic

Connector

LC SENSE

Metal Detector

Sensor

Figure 3.1. Kit Block Diagram

UG532: ZGM230S Dev Kit User's Guide

Hardware

silabs.com | Building a more connected world. Rev. 1.0 | 9

3.2 Power Supply

The kit can be powered through one of these interfaces:

• USB Type-C

•Battery (CR2032 battery or external battery connected through 2-pin battery header)

• Mini Simplicity connector

The figure below shows the power options available on the kit and illustrates the main system power architecture.

USB Type-C LDO

5V0

IN OUT

Automatic

Switchover

3V3

VMCU

Battery

ZGM230S

SiP Module

Peripherals

Mini Simplicity

Connector

Figure 3.2. ZGM230S Dev Kit Power Architecture

Power is normally applied either through the USB cable or a CR2032 battery. A 2-pin 1.25 mm pitch battery connector for external bat-

teries is also available as an alternative to a CR2032 battery. When the USB cable is connected, VBUS is regulated down to 3.3 V. An

automatic switchover circuit switches the main system power from battery power to USB power when the USB cable is inserted and

protects the battery from reverse current.

Power can also be applied through the Mini Simplicity connector. There must be no other power sources present on the kit as power is

injected directly to the VMCU net. It is important to follow this recommendation to avoid power conflicts and backfeeding the battery.

Powering the ZGM230S Dev Kit through the Mini Simplicity connector allows current measurements using the Advanced Energy Moni-

toring (AEM) as described in section 4.2 External Debugger.

Important: When powering the board through the Mini Simplicity connector, the USB and battery power sources must be removed.

The power supply options are summarized in the table below.

Table 3.1. ZGM230S Dev Kit Power Options

Supply Mode Typical Input Voltage VMCU Source 3V3 5V

USB power 5.0 V On-board regulator On-board regulator USB VBUS

Battery 3.0 V Battery voltage Disconnected No voltage present

Mini Simplicity 3.3 V Debugger dependent Disconnected No voltage present

3.3 ZGM230S Reset

The ZGM230S can be reset by a few different sources:

• A user pressing the RESET button.

•The on-board debugger pulling the #RESET pin low.

• An external debugger pulling the #RESET pin low.

UG532: ZGM230S Dev Kit User's Guide

Hardware

silabs.com | Building a more connected world. Rev. 1.0 | 10

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