Skyworks UG367 Bedienungsanleitung

UG367: Si823Hx/8252x-EVB User's Guide

The Si823Hx/8252x isolated gate drivers are ideal for driving power switches used

in a wide variety of power supplies, inverters, and motor control applications offering

longer service life and dramatically higher reliability compared to opto-coupled gate

drivers. The Si823Hx/8252x isolated gate drivers utilize Skyworks' proprietary silicon

isolation technology that supports up to 5 kVRMS withstand voltage per UL1577. This

technology enables industry-leading, common-mode transient immunity (CMTI), tight

timing specifications, reduced variation with temperature and age, better part-to-part

matching, and extremely high reliability. It also offers unique features, such as separate

pull-up/down outputs, driver shutdown on UVLO fault, and precise dead time programm-

ability. Driver outputs can be grounded to the same or separate grounds or connected

to a positive or negative voltage. TTL level compatible inputs with 800 mV hysteresis

are available in individual control input (Si823H1/2/3/5/6/7 and Si82520) or PWM input

(Si823H4/8) configurations. High integration, low propagation delay, small installed size,

flexibility, and cost-effectiveness make this family ideal for a wide range of isolated

MOSFET/IGBT/SiC/GaN gate drive applications.

The Si823Hx/8252x evaluation board allows designers to evaluate Skyworks' Si823Hx/

8252x family of high CMTI performance ISOdrivers. The board includes screw terminals

for quick evaluation of key device parameters and includes test points on each device's

pins to accommodate direct connection to the designer’s end system. For more ISOdriv-

er information, visit the Skyworks web site at www.skyworksinc.com//products/isolation.

The product data sheet and numerous application notes can be referenced to help

facilitate designs.

KIT CONTENTS

• Si823Hx/8252x-based evaluation board

(Si823Hx/8252x-EVB) populated with one

of the following configurations:

• One Si823H2 WB SOIC-14 ISOdriver

• One Si82520 WB SOIC-14 ISOdriver

• Two Si823H9 SSO-8 ISOdrivers

• One Si823H1 DFN-14 ISOdriver

• One Si823H2 NB SOIC-16 ISOdriver

• Two Si823H9 NB SOIC-8 ISOdrivers

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com

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1. Ordering Guide

Table 1.1. Si823Hx/8252x Evaluation Board Ordering Guide

Ordering Part Number (OPN) Description

Si823H2-KIT Si823Hx WB SOIC-14 Isolated Gate Driver Evaluation Kit

Si82520-KIT Si8252x WB SOIC-14 Isolated Gate Driver Evaluation Kit

Si823H9-KIT Si823H9 SSO-8 Isolated Gate Driver Evaluation Kit

Si823Hx-DFN14-KIT Si823Hx DFN-14 Isolated Gate Driver Evaluation Kit

Si823Hx-NB16-KIT Si823Hx NB SOIC-16 Isolated Gate Driver Evaluation Kit

Si823H9-NB8-KIT Si823H9 NB SOIC-8 Isolated Gate Driver Evaluation Kit

UG367: Si823Hx/8252x-EVB User's Guide • Ordering Guide

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com

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2. Required Equipment

The following equipment is required to demonstrate the evaluation board:

• One signal generator

• One dual dc power supply: 0–5 V and 0–15 V (or two single supplies)

• 1 oscilloscope (at least two channels)

• Assorted cables, leads and probes as necessary to connect equipment to EVB

• Si823Hx evaluation board (board under test)

• Si823Hx evaluation board user’s guide (this document)

2.1 DC Supply Configuration

1. Set one supply to output 5 VDC.

2. Turn OFF the supply and connect the positive lead to VDDI (J1 pin1 or TP1).

3. Connect the negative lead to GNDI (J3 or TP3).

4. Turn ON the dc power supply.

5. Ensure that LED D1 turns on.

6. Ensure that the current draw is less than 25 mA. If it is larger, this indicates that either the board or Si823Hx has been damaged or

the supply is connected backwards.

7. Set the other supply to output 15 VDC.

8. Turn OFF the supply and connect the positive lead to VDDA (J2 or TP2).

9. Connect the negative lead to GNDA (J4 or TP4).

10. Turn ON the supply.

11. Ensure that LED D2 turns on.

12. Ensure that the current draw is less than 100 mA. If it is larger, this indicates that either the board or Si823Hx has been damaged

or the supply is connected backwards.

2.2 Function Generator

1. Turn ON the function generator with the output disabled.

2. Adjust its output to provide a 500 kHz, 0 to 5 V peak square wave (50 percent duty cycle) to its output.

3. Connect the output of the generator to VIA (TP5, ground on TP6).

4. Ensure a shunt is placed on JP3 between Pins 2 and 3 (connects VIB to GND).

5. If the board has an EN pin, ensure that a shunt is placed on JP4 between Pins 1 and 2 to enable the device. If the board has a DIS

pin, ensure that the shunt is placed between Pins 2 and 3 to enable the device.

6. Enable the output of the waveform generator.

UG367: Si823Hx/8252x-EVB User's Guide • Required Equipment

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com

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2.3 Oscilloscope Setup

To set up the oscilloscope, perform the following steps:

1. Set the scope to Trigger on CH1 and adjust the trigger level to approximately 2 V.

2. Set CH1 to 2 V per division and CH2 to 5 V per division

3. Adjust the seconds/division setting to 500 ns/division

4. Connect the scope channel 1 probe to VIA (TP5). Ground the probe to GNDI (TP6)

5. Connect Channel 2 probe to VOA (J5 Pin 4 or TP11). Ground the probe to GNDA (J5 Pin 3 or TP12)

6. Adjust the vertical position of each channel to properly view each channel as shown in the figure below

A 500 kHz square wave should display on Channel 1 of the scope for the input and a 15 V version should display on Channel 2, as

shown in the following figure.

Figure 2.1. 500 kHz Square Wave

2.4 Repeat for Second Channel

1. Disable the function generator output.

2. Turn OFF the 15 V supply.

3. Disconnect 15 V supply from VDDA/GNDA.

4. Connect the 15 V supply to VDDB (J6 or TP20) and GNDB (J7 or TP21).

5. Move the Channel 2 scope probe to VOB (J5 pin 2 or TP17) and GNDB (J5 pin 1 or TP18).

6. Remove the shunt on JP3.

7. Move the function generator to VIB (TP9) and GNDI (TP10).

8. Place shunt on JP1 between Pins 2 and 3 (connects VIA to GNDI).

9. Turn ON the dc supply.

10. Ensure that LED D6 turns on.

11. Ensure that the current draw is less than 100 mA. If it is larger, this indicates that either the board or Si823Hx has been damaged

or the supply is connected backwards.

12. Enable the function generator output.

13. The scope display should show both the input and output waveforms as before.

UG367: Si823Hx/8252x-EVB User's Guide • Required Equipment

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com

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3. Built-In Options

The Si823H2, Si82520, and Si823Hx evaluation boards are populated with dual drivers with high-side/low-side (HS/LS) operation. If

VIA and VIB inputs are driven high, the devices' overlap protection will force VOA and VOB to a low state. However, both versions

of the Si823H9 EVBs are built with two single-channel drivers, which results in no overlap protection. If the customer populates the

half-bridge components, they must ensure that both inputs are never driven high at the same time. Doing so will cause both FETs to

turn on simultaneously and short circuit the bridge supply, damaging the FETs and the Si823H9 devices.

3.1 Device Swap

The six EVBs come installed with the OPNs and package types listed in the table below. These six boards cover all the package

variations of the Si823Hx/8252x products, and the ICs on each panel can easily be swapped for another of the same package type

using soldering tools. Check to ensure that pinout differences, such as EN/DIS pins and NC pins, are accounted for when powering up

the new circuit.

Table 3.1. Evaluation Board Ordering Part Numbers and Package Types

Kit Name Device OPN Device Package Type

Si823H2-KIT Si823H2BD-IS3 WB SOIC-14

Si82520-KIT Si82520BD-IS3 WB SOIC-14

Si823H9-KIT Si823H9BD-IS4 SSO-8

Si823Hx-DFN14-KIT Si823H1BB-IM1 DFN-14

Si823Hx-NB16-KIT Si823H2AB-IS1 NB SOIC-16

Si823H9-NB8-KIT Si823H9AC-IS NB SOIC-8

3.2 Half-Bridge Gate Driver Implementation

The Si823Hx/Si8252x EVBs come from the factory configured to provide VOA, GNDA, VOB, and GNDB signals to the connector

J5. The transistors at U3/U4 and U5/U6 are missing, which allows the evaluation of the Si823Hx drivers on their own. Adding the

transistors and modifying several other components enable the customer to build a half-bridge gate driver and test its application on the

same EVB.

To configure the board for a half-bridge gate driver circuit, the following components must be removed:

• R3

• R9

• R11

Components for the following reference designators must be soldered to the board:

• R7

• U3 or U4

• U5 or U6

The positions for U3 / U4 allow the customer to place a high-side FET of either a TO-220 or D-PAK package. These two components

are wired in parallel and should not be populated at the same time. The same is true for U5 / U6 for a low-side FET.

If this half-bridge gate driver is implemented, the pinout of connector J5 will be as follows:

• Pin 1 (GND) remains connected to GNDB but now also functions as the half-bridge supply ground.

• Pin 2 (Vout) is now the output of the half-bridge gate driver.

• Pin 3 (NC) is now disconnected from the circuit and floating.

• Pin 4 (V+) is now the half-bridge positive supply.

UG367: Si823Hx/8252x-EVB User's Guide • Built-In Options

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com

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3.3 Optimizing FET Gate Drive

Diode and resistor combinations D4 & R4 and D5 & R8 provide an option to optimize turn-on and turn-off currents for the FETs. This

modification would offer improvements to a customer that has implemented the half-bridge gate driver described above.

It should be noted that these diodes do not exist on the Si823H9-EVB and Si823H9-NB8-EVB, which provide separate pull-up and

pull-down output lines.

Furthermore, adding pull-down resistors R6 and R13 can ensure the FETs default to an OFF state should the VOA and VOB outputs fail

to pull the gates low.

3.4 Deadtime Modification

The deadtime resistor R12 can be swapped with another resistor to achieve a different deadtime setting. The data sheet provides the

expected output behavior and the equation for dead time based on the resistor value.

3.5 Bootstrapping

Another option on the evaluation board is the setting of JP2. If Pins 2 and 3 of JP2 are jumped, drivers A and B will be powered with

independent supplies. For a bootstrap option, remove the jumper between Pins 2 and 3 and place the jumper between Pins 1 and 2.

The VDDA pin is now connected to diode D3, and a single power supply will drive both drivers via a bootstrap configuration. In this

configuration, capacitor C3 becomes the bootstrap capacitor.

It may be necessary to modify the value of R6 and C3 to optimize the performance of the bootstrap supply. A 100 kΩ resistor is

recommended for R6 when bootstrapping because C3 can only provide a limited amount of current to drive VOA. Furthermore, for

faster switching applications, we recommend swapping D3 for a US1J diode, which has faster reverse recovery than the existing

US1K diode. For even quicker applications, a SiC diode should be investigated. To help determine the bootstrap circuit components,

Skyworks provides a bootstrap calculator. "AN486 High-Side Bootstrap Design Using ISODrivers in Power Delivery Systems" offers

more detailed information on bootstrap design.

UG367: Si823Hx/8252x-EVB User's Guide • Built-In Options

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com

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4. Evaluation Board Schematics

The 14-pin and 16-pin devices have identical circuits, with the only difference being two additional NC (No Connect) pins on the 16-pin

devices. To reduce the number of schematics included in the user’s guide, a 16-pin and an 8-pin schematic are shown. To see the

schematic, layout, and BOM for each individual EVB, refer to “Schematics and Layouts” on the product webpage.

Figure 4.1. Si823Hx-NB16 Evaluation Board Schematic

UG367: Si823Hx/8252x-EVB User's Guide • Evaluation Board Schematics

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com

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Figure 4.2. Si823H9-NB8 Evaluation Board Schematic

UG367: Si823Hx/8252x-EVB User's Guide • Evaluation Board Schematics

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com

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5. Bill of Materials

This Bill of Materials shows the components that come installed on the board. To reduce the number of BOMs included in the user’s

guide, only the Si823Hx_NB16 BOM is shown. The BOM for each EVB can be found in the “Schematics and Layouts” file on the

product webpage.

Table 5.1. Si823Hx-NB16 Evaluation Board Bill of Materials

Reference Description Manufacturer Manufacturer Part Number

C1 1 µF ±10% 50 V Ceramic Capacitor, X7R,

0805, RoHS Samsung CL21B105KBFNNNE

C2, C7 10 µF ±20% 50 V Ceramic Capacitor, X7R,

1210, RoHS Venkel C1210X7R500-106M

C3, C5 0.1 µF ±20% 100 V Ceramic Capacitor,

X7R, 1206, RoHS Venkel C1206X7R101-104M

C4 200 pF ±10% 50 V Ceramic Capacitor,

X7R, 0805, RoHS Venkel C0805C0G500-201K

C6 0.1 µF ±10% 50 V Ceramic Capacitor, X7R,

0805, RoHS Venkel C0805X7R500-104K

D1, D2, D6 2 V Red 631 nm LED, 0603, RoHS Lite-On Inc. LTST-C190KRKT

D3 800 V 1A US1K Diode, Surface Mount,

RoHS Diodes Inc. US1K-13-F

J1, J2, J6 Red Binding Post Connector, RoHS Cinch Connectivity Solutions

Johnson 111-0702-001

J3, J4, J7 Black Binding Post Connector, RoHS Cinch Connectivity Solutions

Johnson 111-0703-001

J5 4POS Terminal Block Header, Male Pins,

Right Angle Through Hole, RoHS Phoenix Contact 1757268

JP1, JP2, JP3, JP4 3POS Header Connector, RoHS Samtec TSW-103-07-T-S

JP5 4POS Terminal Block Plug,

Female Sockets, Free Hanging, RoHS Phoenix Contact 1757035

JS1, JS2, JS3, JS4 2POS Shunt Connector, RoHS Samtec SNT-100-BK-T

PCB1 Bare Si823Hx_NB16_EVB PCB, RoHS Skyworks Si823Hx_NB16_EVB

R1 820 Ω ±1% 1/16 W Chip Resistor, 0402,

Thick Film, RoHS Venkel CR0402-16W-8200FT

R12 6.04 kΩ ±1% 1/10 W Chip Resistor, 0805,

Thick Film, RoHS Venkel CR0805-10W-6041F

R2, R14 22.6 kΩ ±1% 1/16 W Chip Resistor, 0402,

Thick Film, RoHS Venkel CR0402-16W-2262F

R3, R9, R11 0 Ω ±1% 1/10 W Chip Resistor, 0805,

Thick Film, RoHS Venkel CR0805-10W-000

R5, R10 4.7 Ω ±5% 1/10 W Chip Resistor, 0805,

Thick Film, RoHS Venkel CR0805-10W-4R7JT

TP1 – TP21 Loop Test Point, RoHS Kobiconn 151-201-RC

U1 2.5 kVrms 4 A IsoDriver, NB SOIC-16,

RoHS Skyworks Si823H2AB-IS1

UG367: Si823Hx/8252x-EVB User's Guide • Bill of Materials

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Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including

the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the

customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its

documentation, products, services, specications or product descriptions at any time, without notice. Skyworks makes no commitment to update the

materials or information and shall have no responsibility whatsoever for conicts, incompatibilities, or other difculties arising from any future changes.

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