Softing Data Flow commModule MBP Bedienungsanleitung

commModule MBP

Hardware Manual

Version: EN-022018-1.00

The information contained in these instructions corresponds to the technical status at the time of printing of it and is passed on with the

best of our knowledge. The information in these instructions is in no event a basis for warranty claims or contractual agreements

concerning the described products, and may especially not be deemed as warranty concerning the quality and durability pursuant to Sec.

443German Civil Code. We reserve the right to make any alterations or improvements to these instructions without prior notice. The

actual design of products may deviate from the information contained in the instructions if technical alterations and product

improvements so require.

It may not, in part or in its entirety, be reproduced, copied, or transferred into electronic media.

Disclaimer of liability

Softing Industrial Automation GmbH

Richard-Reitzner-Allee 6

85540 Haar / Germany

http://industrial.softing.com

The latest version of this manual is available in the Softing download area at: http://industrial.softing.com/en/downloads.html

+ 49 89 4 56 56-340

+ 49 89 4 56 56-488

info.idn@softing.com

support.automation@softing.com

Table of Contents

Chapter 1 ...................................................................................... 5

Introduction

............................................................................................................... 51.1 About this document

............................................................................................................... 51.2 Related documentation

............................................................................................................... 51.3 Conventions used

............................................................................................................... 51.4 Document history

Chapter 2 ...................................................................................... 6

commModule MBP

............................................................................................................... 62.1 Diagram

............................................................................................................... 62.2 Intended use

Chapter 3 ...................................................................................... 7

Interface

............................................................................................................... 73.1 Orientation

............................................................................................................... 73.2 Pin number and signal description

............................................................................................................... 93.3 Pullups and pulldowns

............................................................................................................... 93.4 Flash programming and debugging interface

............................................................................................................... 93.5 Fault Disconnect Equipment

............................................................................................................... 93.6 Simulate enable

Chapter 4 ...................................................................................... 10

Electrical specifications

............................................................................................................... 104.1 Protocol select

............................................................................................................... 104.2 Operating conditions

............................................................................................................... 104.3 Port input and output

Chapter 5 ...................................................................................... 12

Environmental specifications

............................................................................................................... 125.1 Temperature

............................................................................................................... 125.2 MTBF calculation

............................................................................................................... 135.3 Certifications

Chapter 6 ...................................................................................... 14

Mechanical specification

............................................................................................................... 146.1 Module dimensions

............................................................................................................... 156.2 Host PCB layout

............................................................................................................... 176.3 Mounting process

............................................................................................................... 176.4 ESD handling precautions

............................................................................................................... 176.5 Packaging and labeling

Chapter 7 ...................................................................................... 18

Special conditions for safe use

............................................................................................................... 187.1 Galvanic isolation

............................................................................................................... 187.2 Safety block diagram

............................................................................................................... 197.3 Installation

............................................................................................................... 197.4 Isolation and creepage distances

Table of Contents

............................................................................................................... 207.5 Label

............................................................................................................... 207.6 Maintenance and spare parts

Chapter 8 ...................................................................................... 21

CE Compliance

............................................................................................................... 228.1 ATEX EC type examination certificate

............................................................................................................... 278.2 IECEx Certificate of Conformity

............................................................................................................... 358.3 Declaration of Conformity

Chapter 1 - Introduction

1Introduction

1.1 About this document

This document is addressed to hardware engineers, giving them a detailed description about the electrical,

mechanical and functional specifics of the single-sided communication module, commModule MBP.

1.2 Related documentation

For further details about the commModule MBP and the configuration workflow of the firmware see the

following document:

commScript PD Customization Guide

1.3 Conventions used

The following conventions are used throughout Softing customer documentation:

CAUTION

This symbol indicates a potentially hazardous situation which, if not avoided, may result in

minor or moderate injury.

Note

This symbol is used to call attention to notable information that should be followed during

installation, use, or servicing of this device.

Hint

This symbol is used when providing you with helpful user hints.

1.4 Document history

Document version

Modifications compared to previous version

1.00 - initial version

none

commModule MBP - Hardware Manual

6© Softing Industrial Automation GmbH

2commModule MBP

The commModule MBP is a surface mountable fieldbus communication module with minimum footprint.

It is typically integrated into an intelligent field device mapping industrial intrinsic safe fieldbus Profibus PA

and Foundation Fieldbus to the field device.

CAUTION

The commModule MBP is certified for the use in hazardous areas when used in accordance

with its specification and operating conditions. See also Operating conditions for use in

hazardous environment .

2.1 Diagram

The block diagram below shows the design of the commModule MBP:

2.2 Intended use

This product has been designed to be integrated as a system component by a qualified hardware engineer.

Chapter 3 - Interface

3Interface

This section describes the signals available on the module via the PCB solder pads on the edge of the PCB.

3.1 Orientation

Top view on commModule

The position of Pin 1 is marked on the label.

3.2 Pin number and signal description

Signal Name

Pin No.

I/O*

Description

TXD9_PB7

TX Interface signal for HART

#RTS9_PB5

Low active RTS signal for HART

RXD9_PB6

RX Interface signal for HART

GPIO_PA4

GPIO

For future use

GPIO_PE6

GPIO, AI

For future use

#CTS9_PB4

Low active CTS signal for HART

3V15

VCC

Do not use. Internal supply voltage

GND

Ground

GPIO_PE2

GPIO

For future use

GPIO_PE5

GPIO, AI

For future use

GPIO_PE7

GPIO, AI

For future use

GPIO_PE1

GPIO

For future use

PROT_SEL_P27 / TCK

Protocol Select: FF/PA, Programming interface

TDO

DBG

Programming interface

GND

Ground

commModule MBP - Hardware Manual

8© Softing Industrial Automation GmbH

RXD7_P92

RX Interface signal for Debug Console (PD 33k)

TXD7_P90

TX Interface signal for Debug Console

DA1

For future use

GND

Ground

3V_OUT

Power Output 3.15V

6V2_OUT

Power Output 6.2V

SIM_EN_P31

DBG

Simulate Enable

GPIO_P23

GPIO

For future use

GPIO_P22

GPIO

For future use

GPIO_P21

GPIO

For future use

GPIO_P20

GPIO

For future use

GPIO_PC6

GPIO

For future use

GPIO_PC7

DBG/GPIO

For future use

GPIO_PC5

GPIO

For future use

GPIO_PC4

GPIO

For future use

EMLE

DBG

Programming Interface

TDI

DBG

Programming interface

GPIO_PD2

GPIO

For future use

#RESET

DBG

Programming interface

FINED

DBG

Programming interface (do not pullup)

GND

Ground

FB_P_NF

Do not use

FIELDBUS_N

Fieldbus

FIELDBUS_P

Fieldbus

FDE_PO

FDE, connect to Pin 41

FDE_PI

FDE, connect to Pin 40

FDE_NO

FDE, connect to Pin 43

FDE_NI

FDE, connect to Pin 42

* AI = Analog Input, AO = Analog Output, DI = CMOS Digital Input, DO = CMOS Digital Output, GPIO = General

Purpose CMOS Digital Input/Output, PO = Power Output, DBG = Programmer Interface, FB = Fieldbus, PD

Pulldown, PU Pullup

Chapter 3 - Interface

3.3 Pullups and pulldowns

Weak pullups are provided on all GPIO pins. Pullups for TDO and TDI are not included on the CommModule

MBP and must be included on the application base board (pullup to Pin 7 of CommModule MBP).

RXD7_P92: internal pulldown 33k

3.4 Flash programming and debugging interface

The following signals of the microcontroller are required for flash programming.

See the commModule MBP Evaluation Kit manual for details. The usage of this interface is detailed in

document "E1/E20 Emulator – additional document for User’s Manual (RX User System Design) from

Renesas".

Signal Name

Description

14-pin Renesas Fine

Interface

TDO

Not required for debugging.

Only used for internal flash programming with

Renesas Flash Programmer

TDI

Not required for debugging.

Only used for internal flash programming with

Renesas Flash Programmer

FINEC

Programming Interface

FINED

Programming Interface

PC7

Programming Interface

#RESET

Programming Interface

GND

Ground

2, 12, 14

3V15

Internal supply voltage

EMLE

Programming Interface

CAUTION

The memory blocks are reserved for the firmware. They must not be modified as this will

invalidate the software license and damage the commModule MBP. Only programming project

files provided by Softing shall be used to reprogram the module.

3.5 Fault Disconnect Equipment

External fault disconnect equipment (FDE) can be optionally added using the assigned FDE pins.

If not in use, connect signal FDE_PO to FDE_PI and signal FDE_NO to FDE_NI.

3.6 Simulate enable

Fieldbus conformance testing requires switching the application to simulation mode.

Simulation mode is enabled by signaling low on pin SIM_EN_P31.

For the registration of the final device by the FieldComm Group this signal must be accessible to the

fieldbus testing personnel.

commModule MBP - Hardware Manual

4Electrical specifications

4.1 Protocol select

This pin is scanned during start-up.

Fieldbus Protocol

PROT_SEL_P27

description

Fieldbus Foundation FF

High

(internal pullup)

Leave open

The commModule MBP is operating in

Foundation Fieldbus (FF) mode.

Profibus PA

Low

connect to GND

The commModule MBP is operating in Profibus

PA mode.

4.2 Operating conditions

Unless otherwise noted, all specifications apply over the specified operating temperature range.

4.3 Port input and output

The communication module has the following port input and port output specification at Vcc = 3.2V± 4%.

Parameter

Symbol

Min

Max

Unit

Test Conditions

DI: input low voltage

VIL

Vcc x 0.2

DI: input high voltage

VIH

Vcc x 0.8

DO: output low voltage

VOL

0.5

IOL = 1mA

DO: output high voltage

VOH

Vcc – 0.5

IOH = -1mA

Analog Input

The commModule MBP incorporates a 12bit-A/D converter with a reference voltage of 3.0V

Power Output:

The power budget to supply a connected system from fieldbus is limited.

It is dependent on the rated current from fieldbus, which is adjustable in software

from IN= 10mA to 26mA.

Available output power:

Pomax = approx. 90mW on 6V2_OUT, with IPO_6V2 = IN– 10mA

or:

Pomax = approx. 70mW on 3V_OUT, with IPO_3V_OUT = (IN – 10mA) / 0.7

When both power outputs are used, the available power budget is between 70 and 90mW. The slew rate

is controlled. The rise time is 1.43ms. The output current is not limited on the commModule MBP.

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