Sony Ericsson K700i Bedienungsanleitung

Working Instruction, Electrical

3/00021-2/FEA 209 544/83 A

Company Internal Sony Ericsson Mobile Communications AB

Approved according to 000 21-LXE 107 42/1

Working Instruction, Electrical

Applicable for K700i/K700c

Contents

1Replacement of parts ......................................................................................................2

1.1 Battery connector...............................................................................................2

1.2 Board to board connector ..................................................................................3

1.3 FPC connectors..................................................................................................4

1.4 Bending shield can fence...................................................................................5

1.5 Replacing shield can fence if damage at repair center ......................................7

2BGA Equipment reflow profiles ....................................................................................8

3Revision History..............................................................................................................9

Working Instruction, Electrical

3/00021-2/FEA 209 544/83 A

Company Internal Sony Ericsson Mobile Communications AB

2(9)

1 Replacement of parts

BGA Equipment, General reflow profile guideline see chapter 2.

1.1 Battery connector

Process tools

• BGA replacement equipment

• Pair of tweezers

• Solder cleaning wiper (Tin wick)

• Solder paste

• Gel flux

Equipment

• ESD-gloves (cotton gloves)

• ESD-wristband

Instruction

• Disassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/83

Step-by-Step Instructions

Replace the component.

Use BGA repair equipment.

No special treatment due to through pins.

• Reassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/83

Working Instruction, Electrical

3/00021-2/FEA 209 544/83 A

Company Internal Sony Ericsson Mobile Communications AB

3(9)

1.2 Board to board connector

Process tools

• BGA replacement equipment

• Pair of tweezers

• Solder cleaning wiper (Tin wick)

• Solder paste

• Gel flux

Equipment

• ESD-gloves (cotton gloves)

• ESD-wristband

Instruction

• Disassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/83

Step-by-Step Instructions

Replace the component.

Use BGA repair equipment.

After soldering check for solder bridges between

solder joints.

• Reassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/83

Working Instruction, Electrical

3/00021-2/FEA 209 544/83 A

Company Internal Sony Ericsson Mobile Communications AB

4(9)

1.3 FPC connectors

Process tools

• Dentist hook

• BGA replacement

• Pair of tweezers

• Solder cleaning wiper (Tin wick)

• Solder paste

• Gel flux

Equipment

• ESD-gloves (cotton gloves)

• ESD-wristband

Instruction

• Disassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/83

Step-by-Step Instructions

Replace the component.

Use BGA repair equipment.

After soldering check for solder bridges between

solder joints.

• Reassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/83

Working Instruction, Electrical

3/00021-2/FEA 209 544/83 A

Company Internal Sony Ericsson Mobile Communications AB

5(9)

1.4 Bending shield can fence

Process tools

• Dentist hook

• Cutting pliers, very sharp edged.

• Shield fence pliers NTZ 112 537

Equipment

• ESD-gloves (cotton gloves)

• ESD-wristband

Instruction

• Disassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/83

Working Instruction, Electrical

3/00021-2/FEA 209 544/83 A

Company Internal Sony Ericsson Mobile Communications AB

6(9)

Step-by-Step Instructions

Remove the shield can lid.

If needed it is allowed to remove the pick up

area with a cutting pliers (1). This pick up area is

only used when machine mounting the can and

there is no need to put it back again.

NOTE!

Assure that the cutting pliers is sharp-edged to

prevent damaging the shield can fence.

Cut the frame according to the red lines in the

picture.

Bend the frame carefully without bending the

shield can fence wall. Use Shield fence pliers

NTZ 112 537.

Replace the component and gently bend back the

frame. Be very cautious with the shield can

fence wall.

Put back a new shield can lid. Press on all sides

of the lid until you hear a “click” sound.

• Reassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/83

Working Instruction, Electrical

3/00021-2/FEA 209 544/83 A

Company Internal Sony Ericsson Mobile Communications AB

7(9)

1.5 Replacing shield can fence if damage at repair center

Process tools

• Dentist hook

• BGA repair equipment

• Hot air soldering station

• Pair of tweezers

• Solder cleaning wiper (Tin wick)

• Solder paste

• Solder wire

• Gel flux

• Cutting pliers

Equipment

• ESD-gloves (cotton gloves)

• ESD-wristband

Instruction

• Disassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/83

Step-by-Step Instructions

NOTE!

Replacing shield can fence is only done at repair

centers when a shield can fence is damaged after

bending the frame.

This operation is very time consuming and must

be performed by very skilled repair operators.

Remove the shield can fence by using hot air (or

preferrably with BGA repair equipment).

Most often it is necessary to remove the shield

can fence in pieces by using cutting pliers.

Assemble a new shield can fence with BGA

repair equipment.

• Reassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/83

Working Instruction, Electrical

3/00021-2/FEA 209 544/83 A

Company Internal Sony Ericsson Mobile Communications AB

8(9)

2 BGA Equipment reflow profiles

These values are strongly depending on the BGA replacement equipment.

Nozzle type will be chosen after the outer size of the actual component. Make sure the nozzle

does not affect any near placed components.

NOTE:

These values are recommendations and may have to be changed depending on the type of

equipment.

General reflow profile sn/pb

* The higher temperature in case the board has extremely high ∆T.

Ramp rate < 3°C/sec

Ramp rate cooling zone < 6°C/sec

Time above liquidus 60-150 sec

Minimum temperature 215°C

Maximum temperature 225°C or 235°C for 10-20 sec

Total time Appr. 4-7 min

100

150

200

250

0 40 80 120 160 200 240 280

Preheat zone

Reflow zone

Cooling zone

Temperature [ºC]

Time [Seconds]

Working Instruction, Electrical

3/00021-2/FEA 209 544/83 A

Company Internal Sony Ericsson Mobile Communications AB

9(9)

3 Revision History

Rev. Date Changes / Comments

A 2004-05-27 Initial release

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