Sony Ericsson K750i Bedienungsanleitung

K750 Working Instructions - electrical

3/00021-2/FEA 209 544/94 C

Company Internal

Sony Ericsson Mobile Communications AB

Working Instructions - electrical

Applicable for K750i / K750c

Contents

1Lead-free soldering................................................................................3

2BGA equipment reflow profiles.............................................................6

2.1 General........................................................................................6

2.2 Temperature measurement.........................................................6

2.3 Reflow profiles.............................................................................7

3Replacement of parts.............................................................................8

3.1 Backup capacitor.........................................................................9

3.2 External antenna switch...............................................................9

3.3 Camera connector BtB 30 pin....................................................10

3.4 LCD connector BtB 20 pin.........................................................11

3.5 Keyboard connector BtB 20 pin.................................................12

3.6 SIM reader.................................................................................13

3.7 Battery connector ......................................................................13

3.8 Memory stick Duo reader...........................................................14

3.9 IrDA ...........................................................................................14

3.10 Joystick switch...........................................................................15

3.11 Side key switch..........................................................................15

3.12 Microphone................................................................................16

3.13 Red LED....................................................................................17

3.14 Diode/ESD protector..................................................................18

3.15 Quartz crystal unit......................................................................19

3.16 Prod adapt circuit/ASIC Tjatte 2 ................................................20

3.17 Prod adapt circuit/ASIC Vincenne .............................................21

3.18 Mini T-top...................................................................................22

4Revision History...................................................................................23

K750 Working Instructions - electrical

3/00021-2/FEA 209 544/94 C

Company Internal

Sony Ericsson Mobile Communications AB 2(23)

K750 Working Instructions - electrical

3/00021-2/FEA 209 544/94 C

Company Internal

Sony Ericsson Mobile Communications AB 3(23)

1 Lead-free soldering

Caution

Keep all contact surfaces clean of dirt and hand grease.

This product is manufactured with lead-free

solder and lead-free components!

During electrical repair, it is critical to make sure

that no lead is introduced.

This symbol indicates that the product is lead-

free.

All lead-free PBA’s will be marked with this

symbol.

A lead-free work area must be set up completely

separated from work areas that are used to make

lead repairs.

The lead-free work area must also be clearly

labeled with the lead free symbol as shown in the

adjacent picture.

The items on this desk must remain lead-free.

They must be adequately labeled to make their

lead-free status clearly and easily recognized.

K750 Working Instructions - electrical

3/00021-2/FEA 209 544/94 C

Company Internal

Sony Ericsson Mobile Communications AB 4(23)

LFS (lead-free solder paste) characteristics:

• High melting point (typically 220°C)

• Low wettability

• High surface tension

• Difficult to spread

• Recommended tip temperature = 370°C

When servicing PBA’s that have been

manufactured with LFS (lead-free solder paste),

LFS must be used.

If not, there is a high risk for unreliable

soldering joints.

Lead-free solder joints are more difficult to

inspect because they do not have shiny surfaces

like leaded solder joints.

Also, lead-free solder does not flow as well as

leaded solder, so some of the solder pad areas

may remain exposed.

Example of lead-free solder joints.

Example of solder joints with lead.

K750 Working Instructions - electrical

3/00021-2/FEA 209 544/94 C

Company Internal

Sony Ericsson Mobile Communications AB 5(23)

Example of lead-free solder joints.

Example of solder joints with lead.

K750 Working Instructions - electrical

3/00021-2/FEA 209 544/94 C

Company Internal

Sony Ericsson Mobile Communications AB 6(23)

2 BGA equipment reflow profiles

2.1 General

This document contains reflow profile recommendations for mobile phones and

similar products.

They are just general recommendations and considerations have to be taken for

every single product.

The solder paste is secondary but could also affect the parameters.

In this document one alloy is specified:

SnAgCu (Lead free) melting point 217°C

2.2 Temperature measurement

At least 4 probes should be used.

They should be placed on components with the highest and lowest thermal mass.

The probes shall be located in the beginning, in the middle and at the end of the

board/panel.

It is recommended that the probes are soldered on the board, but glue and capton

tape could also be used, if necessary.

At least one probe shall be placed in the air or on top of a component.

These values are strongly depending on the BGA replacement equipment.

Nozzle type will be chosen after the outer size of the actual component.

Make sure the nozzle does not affect any nearby placed components.

These values are recommendations and may have to be changed depending on the

type of equipment.

The maximum temperature for any component must not exceed 250°C.

K750 Working Instructions - electrical

3/00021-2/FEA 209 544/94 C

Company Internal

Sony Ericsson Mobile Communications AB 7(23)

2.3 Reflow profiles

Sn/Ag/Cu (lead-free)

Ramp rate < 4°C/sec

Ramp rate cooling zone < 6°C/sec

Time above liquidus 60-150 sec

Minimum temperature 235°C

Maximum temperature 245°C or 260°C* for 10 sec

Bottom heat temperature 125°C-150°C

Total time Appr. 4-7 min

* The higher temperature in case the board has extremely high ∆T.

Preheat zone Reflow zone

100

150

200

250

40 80 120 160 200 240 280

290 260°C

245°C

235°C

Time [Seconds]

Temperature [ºC]

Cooling zone

150°C

125°C

K750 Working Instructions - electrical

3/00021-2/FEA 209 544/94 C

Company Internal

Sony Ericsson Mobile Communications AB 8(23)

3 Replacement of parts

Equipment

• Dentist hook

• ESD-gloves (cotton gloves)

• ESD-wristband

• Soldering tool

• Hot air soldering station

• BGA replacement equipment

• Pair of tweezers

• Solder cleaning wiper (tin wick)

• Solder paste lead-free (SN 96% Ag 3.5% Cu 0.5%)

Use the soldering tip only for lead-free solder paste!

• Flux, RMA no-clean flux

• Cutting pliers

• Shield fence pliers NTZ 112 537

Caution

Keep all contact surfaces clean of dirt and hand-grease

Instruction

For all the following part replacements, disassemble and assemble the phone as

described in Working Instructions 3/200021-1/FEA 209 544/94.

K750 Working Instructions - electrical

3/00021-2/FEA 209 544/94 C

Company Internal

Sony Ericsson Mobile Communications AB 9(23)

3.1 Backup capacitor

Do not use hot air soldering equipment since the

nearby switch is heat sensitive!

Replace the backup capacitor using a soldering

iron.

3.2 External antenna switch

Replace the external antenna switch.

Use hot air soldering equipment to remove the

switch.

Use BGA repair equipment to resolder the new

switch.

K750 Working Instructions - electrical

3/00021-2/FEA 209 544/94 C

Company Internal

Sony Ericsson Mobile Communications AB 10(23)

3.3 Camera connector BtB 30 pin

Replace the camera connector.

Use hot air equipment to remove the connector.

Use a soldering iron to mount the connector.

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