Sunsea AIoT SIMCom SIM7600NA Bedienungsanleitung
SIM7600NA,SIM7600NA miniPCIE_User
Manual
Smart Machine Smart Decision
SIM7600NA_user manual _V1.00 2 2020-1-7
Document Title SIM7600NA,SIM7600NA miniPCIE_user manual
Version 1.00
Date 2020-1-7
Status Released
Document Control ID SIM7600NA,SIM7600NA miniPCIE_user manual _V1.00
General Notes
SIMCom offers this information as a service to its users to support the application and engineering
efforts that use the products designed by SIMCom. The information provided is based on the
requirements specifically from the users. SIMCom has not undertaken any independent search for
additional relevant information, including any information that may be in the user’s possession.
Furthermore, the system validation of the product designed by SIMCom within a larger electronic
system remains the responsibility of the user or the user’s system integrator. All specifications
supplied herein are subject to change without notice.
IC Caution:
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to
the following two conditions:
(1) This device may not cause interference, and
(2) This device must accept any interference, including interference that may cause undesired
operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio
exempts de licence. L'exploitation est autorisée aux deux conditions suivantes:
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le
brouillage est susceptible d'en compromettre le fonctionnement
This equipment complies with ISED radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20cm
between the radiator & your body.
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Ce matériel est complété par une exposition de rayonnements IC pour un environnement
naturel. Ce matériel doit être installé et se faire avec une distance minimale de 20cm entre les
radiateurs et les autresYour body shop.
For a host manufacture’s using a certified modular, if (1) the module’s IC number is not visible
when installed in the host, or (2) if the host is marketed so that end users do not have
straightforward commonly used methods for access to remove the module so that the IC
number of the module is visible; then an additional permanent label referring to the enclosed
module: “Contains Transmitter Module IC: 23761-8PYA007” or “Contains IC:
23761-8PYA007” must be used.
This radio transmitter IC: 23761-8PYA007 has been approved by Imovation,Science and Economic
Development Canada to operate with the antenna types listed below,with the maximm permissible
gain indicated.Antenna types not included in this list that have gain greater than the maximm gain
indicated for any type listed are strictly prohibilted for use with this device.
Antenna List:
Model: MF25D
Antenna Gain: Band 2:1.87dBi,Band 4:3.12dBi, Band 5:0.91dBi, Band 12:0.95dBi, Band
13:2.23dBi, Band 14:2.18dBi, Band 25:1.87dBi,Band 26:1.40dBi, Band 41:3.20dBi, Band
66:3.12dBi, Band 71:-0.48dBi
Single Module
FCC Statement
This device complies with part 15 of the FCC Rules. Operation is subject to the following two
conditions:
(1) This device may not cause harmful interference, and
(2) this device must accept
any interference received, including interference that may cause undesired operation.
Any Changes or modifications not expressly approved by the party responsible for compliance
could void the user's authority to operate the equipment.
The modular can be installed or integrated in mobile or fix devices only. This modular cannot be
installed in any portable device.
FCC Radiation Exposure Statement
This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled
environment. This transmitter must not be co-located or operating in conjunction with any other
Type: Dipole antenna with non-standard SMA connector(50ohm)
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antenna or transmitter. This modular must be installed and operated with a minimum distance of 20
cm between the radiator and user body.
If the FCC identification number is not visible when the module is installed inside another device,
then the outside of the device into which the module is installed must also display a label
referring to the enclosed module. This exterior label can use wording such as the following:
“Contains Transmitter Module FCC ID: 2AJYU-8PYA006 Or Contains FCC ID:
2AJYU-8PYA006”
When the module is installed inside another device, the user manual of the host must contain
below warning statements;
1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions:
(1) This device may not cause harmful interference.
(2) This device must accept any interference received, including interference that may cause
undesired operation.
2. Changes or modifications not expressly approved by the party responsible for compliance
could void the user's authority to operate the equipment.
The devices must be installed and used in strict accordance with the manufacturer's instructions
as described in the user documentation that comes with the product.
Any company of the host device which install this modular with Single modular approval should
perform the test of radiated emissionand spurious emission according to FCC part 15C : 15.247
and 15.209 requirement,Only if the test result comply with FCC part 15C : 15.247 and 15.209
requirement，then the host can be sold legally.
Copyright
This document contains the proprietary technical information which is the property of SIMCom
Limited, copying of this document, giving it to others, the using or communication of the contents
thereof are forbidden without the official authority by SIMCom. Offenders are liable to the
payment of the damages. All rights are reserved in the event of grant of a patent or the registration
of a utility model or design. All specifications supplied herein are subject to change without notice
Copyright © SIMCom Wireless Solutions Co., Ltd. 2020
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Contents
Contents ............................................................................................................................................. 5
Revision History ................................................................................................................................ 7
1Introduction ................................................................................................................................ 8
1.1Product Outline ..................................................................................................................... 8
1.2Hardware Interface Overview ............................................................................................... 8
1.3Hardware Block Diagram.................................................................................................... 10
1.4Functional Overview ........................................................................................................... 11
2Package Information ............................................................................................................... 13
2.1Pin Assignment Overview ................................................................................................... 13
2.2Pin Description .................................................................................................................... 16
2.3Mechanical Information ...................................................................................................... 21
2.4Footprint Recommendation ................................................................................................. 22
3Interface Application ............................................................................................................... 23
3.1Power Supply ...................................................................................................................... 23
3.1.1Power Supply Design Guide ........................................................................................ 24
3.1.2Recommended Power Supply Circuit .......................................................................... 25
3.1.3Voltage Monitor ............................................................................................................ 25
3.2Power on/Power off/Reset Function .................................................................................... 26
3.2.1Power on ....................................................................................................................... 26
3.2.2Power off ...................................................................................................................... 27
3.2.3Reset Function .............................................................................................................. 28
3.3UART Interface ................................................................................................................... 29
3.3.1UART Design Guide .................................................................................................... 29
3.3.2RI and DTR Behavior ................................................................................................... 31
3.4USB Interface ...................................................................................................................... 32
3.5HSIC interface ..................................................................................................................... 33
3.7SGMII Interface .................................................................................................................. 33
3.7.1Reference schematic with AR8033 .............................................................................. 34
3.7.2Reference schematic with BCM89820 ......................................................................... 35
3.8USIM Interface.................................................................................................................... 36
3.8.1USIM Application Guide .............................................................................................. 36
3.9PCM Interface ..................................................................................................................... 40
3.9.1PCM timing .................................................................................................................. 40
3.9.2PCM Application Guide ............................................................................................... 41
3.10SD Interface ..................................................................................................................... 42
3.11I2C Interface .................................................................................................................... 44
3.12SDIO Interface ................................................................................................................. 44
3.13SPI Interface .................................................................................................................... 45
3.14Network status ................................................................................................................. 45
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3.15Flight Mode Control ........................................................................................................ 46
3.16Other interface ................................................................................................................. 46
3.16.1Sink Current Source .................................................................................................. 46
3.16.2ADC .......................................................................................................................... 4 7
3.16.3LDO .......................................................................................................................... 4 7
4RF Specifications ...................................................................................................................... 49
4.7GSM/UMTS/LTE RF Specifications .................................................................................. 49
4.8GSM /UMTS/LTE Antenna Design Guide .......................................................................... 50
4.9GNSS .................................................................................................................................. 52
4.9.1GNSS Technical specification ...................................................................................... 52
4.9.2GNSS Application Guide ............................................................................................. 52
5Electrical Specifications ........................................................................................................... 54
5.7Absolute maximum ratings ................................................................................................. 54
5.8Operating conditions ........................................................................................................... 54
5.9Operating Mode .................................................................................................................. 55
5.9.1Operating Mode Definition .......................................................................................... 55
5.9.2Sleep mode ................................................................................................................... 5 6
5.9.3Minimum functionality mode and Flight mode ............................................................ 56
5.10Current Consumption ....................................................................................................... 57
5.11ESD Notes ....................................................................................................................... 57
6SMT Production Guide ........................................................................................................... 59
6.7Top and Bottom View of MODULE ................................................................................... 59
6.8Label Information ................................................................................................................ 60
6.9Typical SMT Reflow Profile ............................................................................................... 60
6.10Moisture Sensitivity Level (MSL) ................................................................................... 61
6.11Stencil Foil Design Recommendation ............................................................................. 62
7Packaging .................................................................................................................................. 63
Appendix .......................................................................................................................................... 65
Ⅰ. Coding Schemes and Maximum Net Data Rates over Air Interface ....................................... 65
Ⅱ. Related Documents .................................................................................................................. 65
Ⅲ. Terms and Abbreviations ........................................................................................................ 68
Ⅳ. Safety Caution ......................................................................................................................... 70
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Revision History
Data Version Description of change Author
2020-1-7 1.00 Original Xutao.Jiang
Qiang.Zhang
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1 Introduction
This document describes the electronic specifications, RF specifications, interfaces, mechanical
characteristics and testing results of the SIMCom MODULE. With the help of this document and
other software application notes/user guides, users can understand and use MODULE to design and
develop applications quickly.
1.1 Product Outline
Aimed at the North American market, the MODULE support GSM, WCDMA, LTE-TDD and
LTE-FDD. Users can choose the MODULE according to the wireless network configuration. The
supported radio frequency bands are described in the following table.
Table 1: Module frequency bands
Standar
d Frequency SIM7600NA SIM7600NA-H
FDD B2 √ √
FDD B4 √ √
FDD B5 √ √
FDD B12 √ √
FDD B13 √ √
FDD B14 √ √
FDD B25 √ √
FDD B26 √ √
FDD B71 √ √
FDD B66 √ √
TDD B41 √ √
Category CAT1 CAT4
With a small physical dimension of 30*30*2.9 mm and with the functions integrated, the
MODULE can meet almost any space requirement in users’ applications, such as smart phone,
PDA, industrial handheld, machine-to-machine and vehicle application, etc.
1.2 Hardware Interface Overview
The interfaces are described in detail in the next chapters include:
● Power Supply
● USB2.0 Interface
● UART Interface
● MMC/SD Interface
● SDIO Interface
● USIM Interface
● SPI Interface
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● GPIO
● ADC
● LDO Power Output
● Current Sink Source
● PCM Interface
● SPI Interface
● I2C Interface
● HSIC Interface
● SGMII Interface
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1.3 Hardware Block Diagram
The block diagram of the MODULE is shown in the figure below.
Figure 1: MODULE block diagram
Dieses Handbuch passt für folgende Modelle
1
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