TDK AN-000300 Installationshandbuch

AN-000300

InvenSense, Inc. reserves the right to change

specifications and information herein without

notice unless the product is in mass production

and the application note has been designated by

InvenSense in writing as subject to a specified

Product / Process Change Notification Method

regulation.

InvenSense, a TDK Group Company

1745 Technology Drive, San Jose, CA 95110 U.S.A

+1(408) 988–7339

invensense.tdk.com

Document Number: AN-000300

Revision: 1.1

Date: 12/12/2022

SmartMotion Platform Ver. G

Hardware User Guide

AN-000300

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Revision: 1.1

TABLE OF CONTENTS

Overview................................................................................................................................................................3

Introduction...........................................................................................................................................................4

2.1. Features Overview............................................................................................................................................4

2.2. Platform Overview............................................................................................................................................4

2.3. Hardware User Guide .......................................................................................................................................4

Sensors and Development Kits ..............................................................................................................................5

3.1. TDK Sensor to SAMG55 MCU Connection ........................................................................................................5

3.2. Magnetic Sensors Connection ..........................................................................................................................9

The Smartmotion System Design.........................................................................................................................10

4.1. System Block Diagram ....................................................................................................................................10

4.2. Main MCU SAMG55 Resource Allocation.......................................................................................................10

4.3. Connectors .....................................................................................................................................................11

4.4. Jumper Settings ..............................................................................................................................................11

Schematics and Board PCB ..................................................................................................................................12

5.1. Schematics......................................................................................................................................................12

5.2. Board PCB.......................................................................................................................................................15

Revision History ...................................................................................................................................................16

Declaration Disclaimer.........................................................................................................................................17

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OVERVIEW

The TDK SmartMotion Platform Ver. G is a comprehensive development system for TDK InvenSense Motion Sensor

devices. The platform designed around the Microchip SAMG55 MCU can be used by customers for rapid evaluation

and development of InvenSense sensor-based solutions. The platform integrates an on-board Embedded Debugger

so external tools are not required to program or debug with the SAMG55 MCU. Each InvenSense motion sensor

has its own unique development kit. Their DK numbers are listed in this document.

The SmartMotion platform comes with the necessary software including InvenSense Motion Link, a GUI based

development tool and embedded Motion Drivers (eMD) for InvenSense motion sensors.

Embedded Motion Drivers (eMD) consist of a set of APIs to configure various aspects of the platform including

motion sensor parameters such as full-scale range (FSR), output data rate (ODR), low-power or low-noise mode,

and sensor interface to host (I2C, SPI). eMDs will also provide the following enhanced motion functions that run on

the MCU:

•Sensor Fusion

•Accelerometer and Gyroscope Calibration

•Android Functions: Game Rotation Vector, Gravity, Linear Acceleration

Motion Link is a GUI based development tool included with the platform. It can be used to capture and visualize

the sensor data from the motion sensor.

The platform supports Atmel Studio and is compatible with Microchip Xplained Pro Extension boards. Xplained Pro

extension series evaluation kits offer additional peripherals to extend the features of the board and ease the

development of customer designs.

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INTRODUCTION

2.1. FEATURES OVERVIEW

•Integrated TDK InvenSense motion sensor

•Support for a magnetic sensor with plug in daughter boards (DB)

•Microchip SAMG55 microcontroller with 512 KB Flash

•On-board Embedded debugger (EDBG) for programming and debugging

•Built in FTDI USB to UART interface for fast motion sensor data transfer

•USB Connectors for host interface to software debug and data logging

•Board Power Supply through USB

2.2. PLATFORM OVERVIEW

The TDK SmartMotion Platform Ver. G is a hardware unit for TDK sensor product evaluation and algorithm

software development. The platform offers support for many different application developments. The board

shown below is the DK-20670 board (with TDK sensor in slot U2).

Figure 1. The SmartMotion Platform Overview

2.3. HARDWARE USER GUIDE

The TDK SmartMotion Platform Ver. G is compatible with Microchip’s SAM G55 Xplained Pro for updating and

flashing the firmware. The link to the Atmel Xplained Pro user guide is here:

http://www.atmel.com/Images/Atmel-42389-SAM-G55-Xplained-Pro_User-Guide.pdfTo set up board, click on

Device Programming (Ctrl + Shift + P) and select EDBG as the Tool.

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SENSORS AND DEVELOPMENT KITS

3.1. TDK SENSOR TO SAMG55 MCU CONNECTION

The TDK SmartMotion Platform Ver. G supports multiple types of TDK IMUs and pressure sensors. Table 1 lists the

TDK Sensor Development Kit (DK) ordering information.

SUPPORTED SENSOR

DK PART NUMBER

SENSOR U# SLOT

ICP-20100

DK-20100

IIM-20670

DK-20670

ICM-40627

DK-40627

IIM-42351

DK-42351

IIM-42352

DK-42352

IIM-42652

DK-42652

IIM-42653

DK_IIM-42653

ICM-42670-P

DK-42670-P

ICM-42686-P

DK-42686-P

ICM-42688-P

DK-42688-P

ICM-42688-V

DK-42688-V

No Sensor

DK-UNIVERSAL-G

N/A

Table 1. Sensors and DKs

DK-20100

The DK-20100 is the development kit for TDK pressure sensor ICM-20100.

The ICP-20100 pressure sensor provides a high-accuracy, low power barometric pressure and temperature sensor

solution that integrates a capacitive pressure sensor for monitoring pressure changes in the range of 30 to 110 kPa.

Please refer to the datasheet for the sensor details.

The ICP-20100 is connected to SAMG55 MCU I2C or SPI. The software will select the interface type.

The sensor I2C slave address is 0x63, and its SPI /CS = NPCS0.

The VDDIO voltage level can be set by J3 to 1.8V or 3.3V.

DK-20670

The DK-20670 is the development kit for TDK IMU IIM-20670.

The IIM-20670 is an Industrial grade 6-axis MotionTracking™device that combines a 3-axis gyroscope and a 3-axis

accelerometer in a small 4.5x4.5x1.1 mm (24-pin DQFN). There are two built-in temperature sensors. It uses an SPI

digital interfaceSPI.

Please refer to the datasheet for the sensor details.

The IIM-20670 is connected to SAMG55 MCU SPI with NPCS0.

The digital interface voltage level is 3.3V on the DK-20670. J3 for VDDIO selection must be set to pins 1-2 for 3.3V.

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DK-40627

The DK-40627 is the development kit for TDK IMU ICM-40627.

The ICM-40627 SmartMotion™sensor is a 6-axis MEMS MotionTracking device that combines a 3-axis gyroscope

and a 3-axis accelerometer. This device is targeted at gesture-based handheld devices such as a mouse. It comes

bundled with TDK’s Air Motion Library, which enables precise mouse pointing, swipe, roll, and other motion

gestures. ICM-40627 has a configurable host interface that supports I2C and SPI serial communication, features a 2

KB FIFO and 2 programmable interrupts with ultra-low power wake-on-motion support to minimize system power

consumption.

Please refer to the datasheet for the sensor details.

The ICM-40627 is connected to SAMG55 MCU I2C and SPI on the DK-40627. The software will select the interface

type.

The sensor I2C slave address is 0x68, and its SPI /CS = NPCS0.

The VDDIO voltage level can be set by J3 to 1.8V or 3.3V.

DK-42351

The DK-42351 is the development kit for TDK 3x Accel IIM-42351.

The IIM-42351 is a 3-axis accelerometer packaged in a small 2.5 mm x 3 mm x 0.91 mm (14-pin LGA) package. It

has an output data rate up to 8 kHz. The IIM-42351 includes multiple capabilities to enable easy, robust, and

accurate inertial and inclination measurements in Industrial applications. It has a 2 KB FIFO that can lower the

traffic on the serial bus interface and reduce power consumption by allowing the system processor to burst read

sensor data and then go into a low-power mode. Its operation temperature range is -40°C to 105°C.

Please refer to the datasheet for the sensor details.

The IIM-42351 is connected to SAMG55 MCU I2C and SPI on the DK-42351. The software will select the interface

type.

The sensor I2C slave address is 0x68, and its SPI /CS = NPCS0.

The VDDIO level can be set by J3 to 1.8V or 3.3V.

DK-42352

The DK-42352 is the development kit for TDK 3x Accel IIM-42352.

The IIM-42352 is a 3-axis accelerometer packaged in a small 2.5 mm x 3 mm x 0.91 mm (14-pin LGA) package. It

has a wide and flat frequency response range from dc to 4 kHz (±3 dB point) with an output data rate up to 32 kHz.

The IIM-42352 includes multiple capabilities to enable easy, robust, and accurate inertial and vibration

measurements in Industrial applications. It has a 2 KB FIFO that can lower the traffic on the serial bus interface and

reduce power consumption by allowing the system processor to burst read sensor data and then go into a low-

power mode. Its operation temperature range is -40°C to 105°C.

Please refer to the datasheet for the sensor details.

The IIM-42352 is connected to SAMG55 MCU I2C and SPI on the DK-42352. The software will select the interface

type.

The sensor I2C slave address is 0x68, and its SPI /CS = NPCS0.

The VDDIO level can be set by J3 to 1.8V or 3.3V.

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DK-42652

The DK-42652 is the development kit for TDK IMU IIM-42652.

The IIM-42652 is a 6-axis SmartIndustrial™MotionTracking device that supports an extended operating

temperature range. The IIM-42652 combines a 3-axis gyroscope and a 3-axis accelerometer in a small 2.5 mm x 3

mm x 0.91 mm (14-pin LGA) package. It also features a 2 KB FIFO that can lower the traffic on the serial bus

interface and reduce power consumption by allowing the system processor to burst read sensor data and then go

into a low-power mode. Its operation temperature range is -40°C to 105°C.

Please refer to the datasheet for the sensor details.

The IIM-42652 is connected to SAMG55 MCU I2C and SPI on the DK-42652. The software will select the interface

type.

The sensor I2C slave address is 0x68, and its SPI /CS = NPCS0.

The VDDIO level can be set by J3 to 1.8V or 3.3V.

DK_IIM-42653

The DK_IIM-42653 is the development kit for TDK IMU IIM-42653.

The IIM-42653 is a 6-axis SmartIndustrial™MotionTracking device that supports an extended operating

temperature range. The IIM-42652 combines a 3-axis gyroscope and a 3-axis accelerometer in a small 2.5 mm x 3

mm x 0.91 mm (14-pin LGA) package. It also features a 2 KB FIFO that can lower the traffic on the serial bus

interface and reduce power consumption by allowing the system processor to burst read sensor data and then go

into a low-power mode. Its operation temperature range is -40°C to 105°C.

Please refer to the datasheet for the sensor details.

The IIM-42653 is connected to SAMG55 MCU I2C and SPI on the DK_IIM-42653. The software will select the

interface type.

The sensor I2C slave address is 0x68, and its SPI /CS = NPCS0.

The VDDIO level can be set by J3 to 1.8V or 3.3V.

DK-42670-P

The DK-42670-P is the development kit for TDK IMU ICM-42670-P.

The ICM-42670-P is a high performance 6-axis MEMS MotionTracking device that combines a 3-axis gyroscope and

a 3-axis accelerometer. It has a configurable host interface that supports I3CSM, I2C, and SPI serial communication,

features up to 2.25 KB FIFO and 2 programmable interrupts with ultra-lowpower wake-on-motion support to

minimize system power consumption.

Please refer to the datasheet for the sensor details.

The ICM-42670-P is connected to SAMG55 MCU I2C and SPI on the DK-42670-P. The software will select the

interface type.

The sensor I2C slave address is 0x68, and its SPI /CS = NPCS0.

The VDDIO voltage level can be set by J3 to 1.8V or 3.3V.

DK-42686-P

The DK-42686-P is the development kit for TDK IMU ICM-42686-P.

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The ICM-42686-P is a 6-axis MEMS MotionTracking device that combines a 3-axis gyroscope and a 3-axis

accelerometer. It has a configurable host interface that supports I3CSM, I2C, and SPI serial communication, features a 2

kB FIFO and 2 programmable interrupts with ultra low-power wake-on-motion support to minimize system power

consumption.

The ICM-42686-P has an extended full-scale range (FSR) of ±4000 dps for gyroscope and ±32g for accelerometer to

support precise motion analysis for today’s wearable and sports solutions, including game controllers, golf or tennis

swing analyzers, intelligent soccer balls, or basketballs that track the player’s performance.

Please refer to the datasheet for the sensor details.

The ICM-42686-P is connected to SAMG55 MCU I2C and SPI on the DK-42686-P. The software will select the

interface type.

The sensor I2C slave address is 0x68, and its SPI /CS = NPCS0.

The VDDIO voltage level can be set by J3 to 1.8V or 3.3V.

DK-42688-P

The DK-42688-P is the development kit for TDK IMU ICM-42688-P.

The ICM-42688-P is a 6-axis MEMS MotionTracking device that combines a 3-axis gyroscope and a 3-axis

accelerometer. It has a configurable host interface that supports I3CSM, I2C, and SPI serial communication, features

a 2 KB FIFO and 2 programmable interrupts with ultra low-power wake-on-motion support to minimize system

power consumption.

Please refer to the datasheet for the sensor details.

The ICM-42688-P is connected to SAMG55 MCU I2C and SPI on the DK-42688-P. The software will select the

interface type.

The sensor I2C slave address is 0x68, and its SPI /CS = NPCS0.

The VDDIO voltage level can be set by J3 to 1.8V or 3.3V.

DK-42688-V

The DK-42688-V is the development kit for TDK IMU ICM-42688-V.

The ICM-42688-V is a 6-axis MEMS MotionTracking device that combines a 3-axis gyroscope and a 3-axis

accelerometer. It has a configurable host interface that supports I3CSM, I2C, and SPI serial communication, features

a 2 KB FIFO and 2 programmable interrupts with ultra low-power wake-on-motion support to minimize system

power consumption. It is bundled with 3DoF algorithm software.

Please refer to the datasheet for the sensor details.

The ICM-42688-V is connected to SAMG55 MCU I2C and SPI on the DK-42688-V. The software will select the

interface type.

The sensor I2C slave address is 0x68, and its SPI /CS = NPCS0.

The VDDIO voltage level can be set by J3 to 1.8V or 3.3V.

DK-UNIVERSAL-G

The DK-UNIVERSAL-G is the development kit for DB (sensor daughter board) and EVB (sensor evaluation board).

There is no sensor mounted on the DK-UNIVERSAL-G board. CN1 for EVB and CN4/CN5 for DB are mounted on

board for people to evaluate sensors which are not listed in this document.

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3.2. MAGNETIC SENSORS CONNECTION

Third party magnetic sensors can be connected to the same SAMG55 MCU I2C bus with TDK sensor through DB,

assuming it has a different slave address.

CN2/3 are designed for the magnetic sensor DB plug in. It only supports I2C.

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THE SMARTMOTION SYSTEM DESIGN

This section is a system design overview and addresses MCU SAMG55 resource allocation.

4.1. SYSTEM BLOCK DIAGRAM

On board EDBG MCU AT32UC3A4256HHB-C1UR allows user to do main MCU SAMG55 debug, trace, and

programming without using external tools. Figure 2 shows the system block diagram.

Figure 2. System Block Diagram

4.2. MAIN MCU SAMG55 RESOURCE ALLOCATION

SAMG55 RESOURCE

USAGE

UART 0

(PA9/10/25/26)

The UART0 is connected to FTDI input by default. In the use case of Extension-1

on J200, the UART0 to FTDI connection can be disconnected through jumper J3.

TW6 (I2C)

(PB8/9)

TDK sensor is connected to this master I2C. On board sensor slave address =

0x69. Sensors on DB and EVB have slave address = 0x68.

SPI5

(PA11/12/13/14)

The SPI5 master is connected to TDK IMU sensor.

On board IMU sensor /CS = PNCS0

GPIO (INTs)

PA17/18/20/30 and PB15

The GPIOs are used for sensor interrupt inputs and other intelligent functions.

Refer to the table in Figure 2.

TW4 (I2C)

The master I2C communicates with EDBG MCU slave I2C.

UART6

The UART6 is used for EDBG DGI-UART interface.

UART7

The UART7 is used for EDBG CDC-UART interface.

Table 2. SAMG55 Resource Allocation

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