TELink BLE 1x6 Test System 3.2 Kurzanleitung
Application Note：
Assembly And Maintenance
Manual for Telink BLE 1x6
Test System 3.2
AN-18071200-E1
Ver 1.0.0
2018/7/12
TELINK SEMICONDUCTOR
Brief：
This document is the assembly and maintenance guide
for Telink BLE 1x6 Test System 3.2, and presents DUT
examples with flash or OTP.
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Assembly And Maintenance Manual for Telink BLE 1x6 Test System 3.2
AN-18071200-E1 1 Ver 1.0.0
Published by
Telink Semiconductor
Bldg 3, 1500 Zuchongzhi Rd,
Zhangjiang Hi-Tech Park, Shanghai, China
© Telink Semiconductor
All Right Reserved
Legal Disclaimer
Telink Semiconductor reserves the right to make changes without further notice to
any products herein to improve reliability, function or design. Telink Semiconductor
disclaims any and all liability for any errors, inaccuracies or incompleteness contained
herein or in any other disclosure relating to any product.
Telink Semiconductor does not assume any liability arising out of the application or
use of any product or circuit described herein; neither does it convey any license
under its patent rights, nor the rights of others
The products shown herein are not designed for use in medical, life-saving, or
life-sustaining applications. Customers using or selling Telink Semiconductor products
not expressly indicated for use in such applications do so entirely at their own risk
and agree to fully indemnify Telink Semiconductor for any damages arising or
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Assembly And Maintenance Manual for Telink BLE 1x6 Test System 3.2
AN-18071200-E1 2 Ver 1.0.0
Revision History
Version
Major Changes
Date
Author
1.0.0
Initial release
2018/7
LWH, LX, Cynthia
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Assembly And Maintenance Manual for Telink BLE 1x6 Test System 3.2
AN-18071200-E1 3 Ver 1.0.0
Table of contents
1Overall Architecture Of 1x6 Test System 3.2..........................................................5
2Hardware Platform Building .................................................................................10
2.1 Check External Antenna.................................................................................10
2.2 Hardware assembly .......................................................................................11
2.3 Cable connection ...........................................................................................13
2.3.1 Test sites on Main board ........................................................................13
2.3.2 Test sites on Display board .....................................................................14
2.3.3 Cable connection between Main board and DUT thimble .....................15
2.3.4 Cable connection between Buzzer board and Thimble board ...............16
2.3.5 Cable connection between Main board and Display board ...................16
2.3.6 Cable connection between Main board and PCB antenna board ..........16
2.3.7 Other cable connection ..........................................................................17
2.4 Check Jig debugging.......................................................................................20
3Firmware Burning For EVK Daughter Boards .......................................................22
3.1 Folder structure for Test Bench Firmware.....................................................22
3.2 Firmware burning for EVK daughter boards..................................................25
4Observe Test Result Via PC Software EvkMonitor ...............................................28
5Update PCBA (DUT) Firmware..............................................................................31
Appendix 1 Test Item List On PC Software “EvkMonitor”......................................34
Appendix 2：Hardware List.........................................................................................40
Appendix 3：Pins on test site of Main board..............................................................41
Appendix 4：Dimension chart of Main board, Thimble board, Display board, EVK
daughter board and Buzzer board...............................................................................43
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Assembly And Maintenance Manual for Telink BLE 1x6 Test System 3.2
AN-18071200-E1 4 Ver 1.0.0
Table of figures
Figure 1 Top view of Main board.........................................................................5
Figure 2 EVK daughter board...............................................................................6
Figure 3 Power board ..........................................................................................6
Figure 4 Display board .........................................................................................7
Figure 5 Thimble board .......................................................................................7
Figure 6 PCB antenna board and RF cable ..........................................................7
Figure 7 Buzzer module.......................................................................................8
Figure 8 System connection chart .......................................................................9
Figure 9 Telink PCB antenna board....................................................................10
Figure 10 Sliding block to fix PCB antenna.......................................................10
Figure 11 Telink PCB antenna dimensions .......................................................10
Figure 12 Top view of Main board ...................................................................11
Figure 13 Assembly chart on the bottom side of Main board.........................12
Figure 14 Top silk-screen sketch of Main board ..............................................13
Figure 15 Bottom silk-screen of Display board ................................................14
Figure 16 Connection points on test site of Display board..............................14
Figure 17 Cable connection chart ....................................................................17
Figure 18 1x6 Test system 3.2 ..........................................................................18
Figure 19 Cable connection sketch of Main board ..........................................18
Figure 20 Cable connection of Display, Antenna, Thimble board and DUT
thimble.........................................................................................................19
Figure 21 Connection chart between EVK daughter board and PC.................25
Figure 22 Firmware burning interface 1 for EVK daughter board....................26
Figure 23 Firmware burning interface 2 for EVK daughter board....................26
Figure 24 EvkMonitor tool interface ................................................................28
Figure 25 Pins on test site of Main board ........................................................41
Figure 26 Dimension chart of Main board.......................................................43
Figure 27 Dimension chart of Thimble board ..................................................43
Figure 28 Dimension chart of Display board....................................................44
Figure 29 Dimension chart of EVK daughter board .........................................44
Figure 30 Dimension chart of Buzzer board ....................................................45
Table of tables
Table 1 Cable connection between thimble board and DUT with flash ..........15
Table 1 Cable connection between thimble board and DUT with OTP ...........15
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Assembly And Maintenance Manual for Telink BLE 1x6 Test System 3.2
AN-18071200-E1 5 Ver 1.0.0
1Overall Architecture Of 1x6 Test System 3.2
Telink BLE 1x6 Test System 3.2 consists of test bench and mechanical structure.
The test bench includes hardware platform and firmware folder, and it’s provided by
Telink; while customer needs to make the mechanical structure suitable for DUT
(Device Under Test), and connect cables according to the guide in this document.
A set of Test Bench mainly contains the following hardware resources.
1) A Main Board provided by Telink. Figure 1 shows the correct direction to place
the Main board.
Figure 1 Top view of Main board
2) Six EVK daughter boards provided by Telink. Each should be burned with the EVK
firmware for test bench.
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Assembly And Maintenance Manual for Telink BLE 1x6 Test System 3.2
AN-18071200-E1 6 Ver 1.0.0
Figure 2 EVK daughter board
3) A Power board provided by Telink. It's pin-to-pin compatible with EVK daughter
board and serves to supply power for test system.
Figure 3 Power board
4) A Display board provided by Telink. Its top side contains six groups of LEDs and
six independent start buttons, while the bottom side contains six connectors.
a) Top view
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Assembly And Maintenance Manual for Telink BLE 1x6 Test System 3.2
AN-18071200-E1 7 Ver 1.0.0
b) Bottom view
Figure 4 Display board
5) Six Thimble boards. Each contains a HDMI connector and soldering points, so
that each test site of Main board can be connected with a DUT via a thimble
board. Figure 5 shows an example of thimble board.
Figure 5 Thimble board
6) Six PCB Antenna boards and six RF cables provided by Telink, as shown in Figure
6.
Figure 6 PCB antenna board and RF cable
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Assembly And Maintenance Manual for Telink BLE 1x6 Test System 3.2
AN-18071200-E1 8 Ver 1.0.0
7) A USB hub and six customized USB cables: The USB hub is used to connect six
EVK daughter boards and PC.
8) A PC. On PC side, the EvkMonitor tool can be used to burn firmware for EVK
daughter boards (refer to Section 3), and user can also observe test result via the
EvkMonitor (refer to Section 4).
9) Six buzzer modules (Dimension: 50.2x16mm): Each is connected with a thimble
board via a rainbow cable, thus it’s connected to corresponding GPIO and Power
of an EVK daughter board via HDMI interface of thimble board. The buzzer
modules are used for Amic test.
Each buzzer board should be placed as close to corresponding Amic as possible.
Do not contact buzzer board with Amic directly, and there should be no obstacle
between them.
Note: Buzzer boards are only supplied for DUT with MIC and not contained in the
hardware resources by default.
Figure 7 Buzzer module
Six EVK daughter boards and Power board are directly connected with
corresponding connectors on the bottom side of the Main board (refer to Section
2.2).
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Assembly And Maintenance Manual for Telink BLE 1x6 Test System 3.2
AN-18071200-E1 9 Ver 1.0.0
Figure below shows the system connection chart.
Figure 8 System connection chart
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