Telit Wireless Solutions LE940B6-NA AUTO Installationshandbuch

LE940B6

Hardware User Guide

1VV0301331 Rev. 1.8 - 2017-03-15

LE940B6 Hardware User Guide

1VV0301331 Rev. 1.8 - 2017-03-15

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This d cumentati n applies t the f ll wing pr ducts:

Table 1: Applicability Table

Module ame Description

LE940B6-NA AUTO N rth America regi nal variant (AT&T and T-M bile)

LE940B6-NV AUTO N rth America regi n variant (Veriz n, AT&T and T-M bile)

LE940B6-RW AUTO Rest f W rld variant (Eur pe, APAC, Latin America and m re)

LE940B6-CN AUTO China variant

N te: NV variant - t be devel ped

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SPECIFICATIO S SUBJECT TO CHA GE WITHOUT OTICE

otice

While reas nable eff rts have been made t assure the accuracy f this d cument, Telit assumes

n liability resulting fr m any inaccuracies r missi ns in this d cument, r fr m use f the

inf rmati n btained herein. The inf rmati n in this d cument has been carefully checked and is

believed t be entirely reliable. H wever, n resp nsibility is assumed f r inaccuracies r missi ns.

Telit reserves the right t make changes t any pr ducts described herein and reserves the right t

revise this d cument and t make changes fr m time t time in the c ntent here f with n

bligati n t n tify any pers n f revisi ns r changes. Telit d es n t assume any liability arising

ut f the applicati n r use f any pr duct, s ftware, r circuit described herein; neither d es it

c nvey any license under its patent rights r the rights f thers.

It is p ssible that this publicati n may c ntain references t , r inf rmati n ab ut Telit pr ducts

(machines and pr grams), pr gramming, r services that are n t ann unced in y ur c untry. Such

references r inf rmati n must n t be c nstrued t mean that Telit intends t ann unce such Telit

pr ducts, pr gramming, r services in y ur c untry.

Copyrights

This instructi n manual and the Telit pr ducts described in this instructi n manual may be, include,

r describe c pyrighted Telit material, such as c mputer pr grams st red in semic nduct r

mem ries r ther media. Laws in Italy and ther c untries preserve f r Telit and its licens rs

certain exclusive rights f r c pyrighted material, including the exclusive right t c py, repr duce in

any f rm, distribute, and make derivative w rks f the c pyrighted material. Acc rdingly, any

c pyrighted material f Telit and its licens rs c ntained herein r in the Telit pr ducts described in

this instructi n manual may n t be c pied, repr duced, distributed, merged, r m dified in any

manner with ut the express written permissi n f Telit. Furtherm re, the purchase f Telit

pr ducts shall n t be deemed t grant either directly r by implicati n, est ppel, r therwise, any

license under the c pyrights, patents r patent applicati ns f Telit, as arises by perati n f law

in the sale f a pr duct.

Computer Software Copyrights

Telit and third-party s ftware (SW) pr ducts described in this instructi n manual may include

c pyrighted Telit and ther third-party c mputer pr grams st red in semic nduct r mem ries r

ther media. Laws in Italy and ther c untries preserve f r Telit and ther third-party SW certain

exclusive rights f r c pyrighted c mputer pr grams, including the exclusive right t c py r

repr duce in any f rm the c pyrighted c mputer pr gram. Acc rdingly, any c pyrighted Telit r

ther third-party SW c mputer pr grams c ntained in the Telit pr ducts described in this

instructi n manual may n t be c pied (reverse engineered) r repr duced in any manner with ut

the express written permissi n f Telit r the third-party SW supplier. Furtherm re, the purchase

f Telit pr ducts shall n t be deemed t grant either directly r by implicati n, est ppel, r

therwise, any license under the c pyrights, patents r patent applicati ns f Telit r ther third-

party SW, except f r the n rmal n n-exclusive, r yalty free license t use that arises by perati n

f law in the sale f a pr duct.

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Usage and Disclosure Restrictions

License Agreements

The s ftware described in this d cument is the pr perty f Telit and its licens rs. It is furnished by

an express license agreement nly and may be used nly in acc rdance with the terms f such an

agreement.

Copyrighted Materials

S ftware and d cumentati n are c pyrighted materials. Making unauth rized c pies is pr hibited

by law. N part f the s ftware r d cumentati n may be repr duced, transmitted, transcribed,

st red in a retrieval system, r translated int any language r c mputer language, in any f rm r

by any means, with ut pri r written permissi n f Telit.

High Risk Materials

C mp nents, units, r third-party pr ducts used in the pr duct described herein are NOT fault-

t lerant and are NOT designed, manufactured, r intended f r use as n-line c ntr l equipment in

the f ll wing hazard us envir nments requiring fail-safe c ntr ls: the perati n f nuclear

facilities, aircraft navigati n r aircraft c mmunicati n systems, air traffic c ntr l, life supp rt, r

weap ns systems (“high risk activities"). Telit and its supplier(s) specifically disclaim any expressed

r implied warranty f fitness f r such high risk activities.

Trademarks

TELIT and the stylized T l g are trademarks and/ r registered trademarks f Telit C mmunicati ns

S.p.A. in the Unites States and/ r ther c untries. All ther pr duct r service names are the

pr perty f their respective wners.

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Contents

Introduction ..................................................................................................... 12

1.1.

Sc pe ................................................................................................................ 12

1.2.

Audience .......................................................................................................... 12

1.3.

C ntact Inf rmati n, Supp rt .......................................................................... 12

1.4.

Text C nventi ns ............................................................................................. 13

1.5.

Related D cuments .......................................................................................... 14

1.6.

Abbreviati ns ................................................................................................... 14

1.7.

D cument Organizati n ................................................................................... 15

General Product Description ............................................................................ 17

2.1.

Overview .......................................................................................................... 17

2.2.

Applicati ns ..................................................................................................... 17

2.3.

General Functi nality and Main Features ....................................................... 18

2.4.

Envir nmental Requirements .......................................................................... 19

2.4.1.

Temperature Range .............................................................................. 19

2.4.2.

R HS C mpliance.................................................................................. 19

2.5.

Operating Frequency Bands............................................................................. 20

2.5.1.

RF Bands per Regi nal Variant ............................................................. 20

2.5.2.

Reference Table f RF Bands Characteristics ....................................... 21

2.6.

Sensitivity ......................................................................................................... 24

2.7.

LE940B6 Mechanical Specificati ns ................................................................. 25

2.7.1.

Dimensi ns ........................................................................................... 25

2.7.2.

Weight .................................................................................................. 25

LE940B6 Module Connections .......................................................................... 26

3.1.

Pin- ut .............................................................................................................. 26

3.2.

LE940B6 Signals That Must Be C nnected ...................................................... 36

3.3.

LGA Pads Lay ut ............................................................................................... 38

Electrical Specifications .................................................................................... 39

4.1.

Abs lute Maximum Ratings – N t Operati nal ............................................... 39

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4.2.

Rec mmended Operating C nditi ns ............................................................. 39

4.3.

L gic Level Specificati ns ................................................................................. 40

4.3.1.

1.8V Standard GPIOs ............................................................................ 40

4.3.2.

1.8V I2C Pads ........................................................................................ 41

4.3.3.

1.2V EMIC Pads ..................................................................................... 41

4.3.4.

1.8V/2.9V SIM Pads .............................................................................. 42

4.3.5.

USB........................................................................................................ 42

4.3.6.

2.5V/3.3V EMAC Interface f r RMII and RGMII ................................... 43

Hardware Commands ....................................................................................... 44

5.1.

Turning n the LE940B6 M dule ..................................................................... 44

5.2.

Initializati n and Activati n State .................................................................... 44

5.3.

Turning ff the LE940B6 M dule ..................................................................... 48

5.3.1.

Shutd wn by S ftware C mmand ....................................................... 48

5.3.2.

Hardware Shutd wn ............................................................................. 50

5.3.3.

Unc nditi nal Hardware Reset (RESET_N)........................................... 51

5.3.4.

Unc nditi nal Hardware Shutd wn ..................................................... 52

Power Supply ................................................................................................... 54

6.1.

P wer Supply Requirements............................................................................ 54

6.2.

General Design Rules ....................................................................................... 57

6.2.1.

Electrical Design Guidelines .................................................................. 57

6.2.1.1.

+ 5V Input S urce P wer Supply – Design Guidelines ......... 57

6.2.1.2.

+ 12V Input S urce P wer Supply – Design Guidelines ....... 58

6.2.1.3.

Battery S urce P wer Supply – Design Guidelines .............. 60

6.2.2.

Thermal Design Guidelines ................................................................... 61

6.2.3.

P wer Supply PCB Lay ut Guidelines ................................................... 61

Antenna(s) ....................................................................................................... 63

7.1.

GSM/WCDMA/TD-SCDMA/LTE Antenna Requirements ................................. 63

7.2.

GSM/WCDMA/TD-SCDMA/LTE Antenna – PCB Line Guidelines ..................... 63

7.3.

GSM/WCDMA/TD-SCDMA/LTE Antenna – Installati n Guidelines ................. 65

7.4.

Sec ndary Antenna Requirements .................................................................. 65

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7.5.

PCB Guidelines in case f FCC certificati n ..................................................... 65

7.5.1.

Transmissi n line design....................................................................... 65

7.5.2.

Transmissi n line measurements ......................................................... 66

Hardware Interfaces......................................................................................... 69

8.1.

USB P rt ........................................................................................................... 70

8.2.

Serial P rts ....................................................................................................... 71

8.2.1.

M dem Serial P rt 1 ............................................................................. 72

8.2.2.

M dem Serial P rt 2 ............................................................................. 73

8.2.3.

M dem Serial P rt 3 ............................................................................. 73

8.2.4.

RS232 Level Translati n ........................................................................ 74

8.3.

Peripheral P rts ............................................................................................... 76

8.3.1.

SPI – Serial Peripheral Interface ........................................................... 76

8.3.2.

I2C - Inter-integrated Circuit ................................................................ 77

8.4.

Ethernet Interface ............................................................................................ 77

8.5.

Audi Interface ................................................................................................ 78

8.5.1.

Anal g Audi ........................................................................................ 78

8.5.2.

Digital Audi ......................................................................................... 79

8.6.

General Purp se I/O ........................................................................................ 79

8.6.1.

Using a GPIO Pad as Input .................................................................... 80

8.6.2.

Using a GPIO Pad as Output ................................................................. 80

Miscellaneous Functions .................................................................................. 82

9.1.

Indicati n f Netw rk Service Availability ....................................................... 82

9.2.

RTC – Real Time Cl ck ...................................................................................... 83

9.3.

VAUX P wer Output ........................................................................................ 83

9.4.

ADC C nverter ................................................................................................. 83

9.4.1.

Descripti n............................................................................................ 83

9.4.2.

Using the ADC C nverter ...................................................................... 83

9.5.

Using the Temperature M nit r Functi n ...................................................... 84

9.6.

Fuel Gauge (TBD) ............................................................................................. 84

9.7.

eFuse ................................................................................................................ 84

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10.

Mounting the Module on your Board ............................................................... 85

10.1.

General ............................................................................................................. 85

10.2.

Finishing & Dimensi ns .................................................................................... 85

10.3.

Rec mmended F tprint f r the Applicati n ................................................. 86

10.4.

Stencil ............................................................................................................... 87

10.5.

PCB Pad Design ................................................................................................ 87

10.6.

Rec mmendati ns f r PCB Pad Dimensi ns (mm) .......................................... 88

10.7.

S lder Paste ..................................................................................................... 89

10.7.1.

S lder Refl w ........................................................................................ 89

11.

Application Guide ............................................................................................ 91

11.1.

Debug f the LE940B6 M dule in Pr ducti n ................................................. 91

11.2.

Bypass Capacit r n P wer Supplies ............................................................... 92

11.3.

SIM Interface .................................................................................................... 93

11.3.1.

SIM Schematic Example ........................................................................ 93

11.4.

EMC Rec mmendati ns ................................................................................... 94

11.5.

D wnl ad and Debug P rt ............................................................................... 94

11.6.

Antenna Detecti n ........................................................................................... 95

12.

Packing System ................................................................................................ 96

12.1.

Tray Drawing .................................................................................................... 98

12.2.

M isture Sensitivity ......................................................................................... 98

13.

Conformity Assessment Issues ......................................................................... 99

13.1.

FCC/IC Regulat ry N tices ............................................................................... 99

14.

Safety Recommendations ................................................................................ 101

15.

Document History ........................................................................................... 102

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List of Tables

Table 1: Applicability Table ................................................................................................................. 2

Table 2: Related D cuments ............................................................................................................ 14

Table 3: D cument Structure ........................................................................................................... 15

Table 4: RF Bands per Regi nal Variant ............................................................................................ 20

Table 5: RF Bands Characteristics ..................................................................................................... 21

Table 6: LE940B6 Pin- ut .................................................................................................................. 26

Table 7: Mandat ry Signals .............................................................................................................. 36

Table 8: Abs lute Maximum Ratings – N t Operati nal .................................................................. 39

Table 9: Rec mmended Operating C nditi ns ................................................................................ 39

Table 10: Abs lute Maximum Ratings – N t Functi nal .................................................................. 40

Table 11: Operating Range – Interface Levels (1.8V CMOS) ............................................................ 40

Table 12: Operating Range – 1.8V I2C Pads ..................................................................................... 41

Table 13: Operating Range – 1.2V EMIC Pads .................................................................................. 41

Table 14: Operating Range – 1.8V SIM Pads .................................................................................... 42

Table 15: Operating Range – 2.9V SIM Pads .................................................................................... 42

Table 16: Operating Range – USB_D+, USB_D- Pads ........................................................................ 42

Table 17: Abs lute Maximum Ratings – 3.3V EMAC Interface......................................................... 43

Table 18: Operating Range – 2.5V EMAC Interface .......................................................................... 43

Table 19: Operating Range – 3.3V EMAC Interface .......................................................................... 43

Table 20: P wer Supply Requirements ............................................................................................ 54

Table 21: LE940B6 Current C nsumpti n ........................................................................................ 54

Table 22: Primary Antenna Requirements ...................................................................................... 63

Table 23: Antenna Line n PCB Requirements ................................................................................. 64

Table 24: LE940B6 Hardware Interfaces .......................................................................................... 69

Table 25: USB Interface Signals ........................................................................................................ 70

Table 26: M dem Serial P rt 1 Signals ............................................................................................. 72

Table 27: M dem Serial P rt 2 Signals ............................................................................................. 73

Table 28: M dem Serial P rt 3 Signals ............................................................................................. 73

Table 29: SPI Signals ......................................................................................................................... 76

Table 30: Ethernet Interface ............................................................................................................. 77

Table 31: Anal g Audi Signals ......................................................................................................... 78

Table 32: Digital Audi Interface (DVI) Signals ................................................................................. 79

Table 33: GPIOs ................................................................................................................................ 79

Table 34: Netw rk Service Availability Indicati n ............................................................................ 82

Table 35: Operating Range – VAUX P wer Supply ........................................................................... 83

Table 36: ADC Parameters ................................................................................................................ 83

Table 37: Rec mmendati ns f r PCB Pad Surfaces ......................................................................... 88

Table 38: S lder Pr file Characteristics ............................................................................................ 90

Table 39: SIM Interface – C1 Range .................................................................................................. 93

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Table 40: EMC Rec mmendati ns ................................................................................................... 94

Table 41: Tray Packing ...................................................................................................................... 96

Table 42: Packing Quantities ............................................................................................................ 96

Table 43: D cument Revisi n Hist ry ............................................................................................ 102

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