Texas Instruments SimpleLink CC2652RB Bedienungsanleitung

CC2652RB SimpleLink™ Crystal-less BAW Multiprotocol 2.4 GHz Wireless MCU

1 Features

• Microcontroller

– Powerful 48-MHz Arm® Cortex®-M4F processor

– EEMBC CoreMark® score: 148

– 352KB of in-system programmable flash

– 256KB of ROM for protocols and library

functions

– 8KB of cache SRAM (alternatively available as

general-purpose RAM)

– 80KB of ultra-low leakage SRAM. The SRAM is

protected by parity to ensure high reliability of

operation.

– 2-pin cJTAG and JTAG debugging

– Supports over-the-air (OTA) update

• Ultra-low power sensor controller with 4KB of

SRAM

– Sample, store, and process sensor data

– Operation independent from system CPU

– Fast wake-up for low-power operation

• TI-RTOS, drivers, bootloader, Bluetooth® 5.2 low

energy controller, and IEEE 802.15.4 MAC in ROM

for optimized application size

• RoHS-compliant package

– 7-mm × 7-mm RGZ VQFN48 (31 GPIOs)

• Peripherals

– Digital peripherals can be routed to any GPIO

– 4× 32-bit or 8× 16-bit general-purpose timers

– 12-bit ADC, 200 kSamples/s, 8 channels

– 2× comparators with internal reference DAC

(1× continuous time, 1× ultra-low power)

– Programmable current source

– 2× UART

– 2× SSI (SPI, MICROWIRE, TI)

– I2C and I2S

– Real-time clock (RTC)

– AES 128- and 256-bit cryptographic accelerator

– ECC and RSA public key hardware accelerator

– SHA2 accelerator (full suite up to SHA-512)

– True random number generator (TRNG)

– Capacitive sensing, up to 8 channels

– Integrated temperature and battery monitor

• External system

– Integrated bulk acoustic wave (BAW) resonator

generating accurate clock with fast startup time

of 80 µs for system and RF

– On-chip buck DC/DC converter

• Low power

– Wide supply voltage range

• Normal operation: 1.8 to 3.8 V

• External regulator mode: 1.7 to 1.95 V

– Active mode RX: 7.3 mA

– Active mode TX 0 dBm: 7.9 mA

– Active mode TX 5 dBm: 10.2 mA

– Active mode MCU 48 MHz (CoreMark):

3.4 mA (71 μA/MHz)

– Sensor controller, low power-mode, 2 MHz,

running infinite loop: 30.8 μA

– Sensor controller, active mode, 24 MHz,

running infinite loop: 808 μA

– Standby: 0.94 µA (RTC on, 80KB RAM and

CPU retention)

• Radio section

– 2.4 GHz RF transceiver compatible with

Bluetooth 5.2 Low Energy and earlier LE

specifications and IEEE 802.15.4 PHY and

MAC

– 3-wire, 2-wire, 1-wire PTA coexistence

mechanisms

– Excellent receiver sensitivity:

-100 dBm for 802.15.4 (2.4 GHz),

-102 dBm for Bluetooth 5 Low Energy Coded

– Programmable output power up to +5 dBm

– Suitable for systems targeting compliance with

worldwide radio frequency regulations

• EN 300 328, (Europe)

• EN 300 440 Category 2

• FCC CFR47 Part 15

• ARIB STD-T66 (Japan)

• Wireless protocols

–Thread, Zigbee®, Bluetooth® 5.2 Low Energy,

IEEE 802.15.4, IPv6-enabled smart objects

(6LoWPAN), proprietary systems, SimpleLink™

TI 15.4 stack (2.4 GHz), and dynamic

multiprotocol manager (DMM) driver.

• Development Tools and Software

–CC2652RB LaunchPad™ Development Kit

–SimpleLink™ CC13x2 and CC26x2 Software

Development Kit

–SmartRF™ Studio for simple radio configuration

–Sensor Controller Studio for building low-power

sensing applications

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

2 Applications

• 2400 to 2480 MHz ISM and SRD systems 1

with down to 4 kHz of receive bandwidth

•Building automation

– Building security systems – motion detector,

electronic smart lock, door and window sensor,

garage door system, gateway

– HVAC – thermostat, wireless environmental

sensor, HVAC system controller, gateway

– Fire safety system – smoke and heat detector,

fire alarm control panel (FACP)

– Video surveillance – IP network camera

– Elevators and escalators – elevator main

control panel for elevators and escalators

•Grid infrastructure

– Smart meters – water meter, gas meter,

electricity meter, and heat cost allocators

– Grid communications – wireless

communications – Long-range sensor

applications

– Other alternative energy – energy harvesting

•Industrial transport – asset tracking

•Factory automation and control

•Medical

•Electronic point of sale (EPOS) – Electronic Shelf

Label (ESL)

•Personal electronics

–Wired networking – wireless LAN or Wi-Fi

access points, edge router, small business

router

–Portable electronics – RF smart remote control

–Home theater & entertainment – smart

speakers, smart display, set-top box, streaming

media player

–Connected peripherals – consumer wireless

module, wireless data access card

–Gaming – electronic and robotic toys

–Wearables (non-medical) – smart trackers

3 Description

The SimpleLink™ CC2652RB device is the industry’s first multiprotocol 2.4 GHz wireless crystal-less

microcontroller (MCU) with integrated TI Bulk Acoustic Wave (BAW) resonator technology supporting Thread,

Zigbee®, Bluetooth® 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary

systems, including the TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol operation through the Dynamic

Multiprotocol Manager (DMM) software driver. Integrated BAW resonator technology eliminates the need for

external crystals without compromising latency or frequency stability. The device is optimized for low-power

wireless communication and advanced sensing in building security systems, HVAC, medical, power tool, wired

networking, portable electronics, home theater & entertainment, and connected peripherals markets.

The highlighted features of TI Bulk Acoustic Wave (BAW) resonator technology include:

• Unparalleled RF performance with high-performance frequency stability (±40 PPM) across temperature

(-40°C to 85°C) and full operating voltage (1.8 V to 3.8 V), ultra-low jitter and phase noise to meet various

wireless communication standards clock requirements.

• Efficient development and production cycles by eliminating crystal oscillator sourcing and reducing costly

board re-designs and re-certification due to external crystal layout and assembly issues.

• Optimized Bill of Material (BOM) and PCB area savings (12% average).

• Superior long-term clock stability and aging performance (10 years) in comparison with most standard quartz

crystal (longest 5 years aging) enables longer product lifecycles.

• Robust vibration and mechanical shock resistance (3× lower PPM variance versus external crystal) reduces

product replacement costs from external crystal failure and allows for operation in harsh environments, such

as in motors or heavy machinery.

• Mitigation of potential timing related side channel attacks from external clock tampering.

1See RF Core for additional details on supported protocol standards, modulation formats, and data rates.

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The highlighted features of the SimpleLink™ MCU platform include:

• Wide flexibility of protocol stack support in the SimpleLink™ CC13x2 and CC26x2 Software Development Kit

(SDK).

• Longer battery life wireless applications with low standby current of 0.84 µA and full RAM retention.

• Industrial temperature ready with lowest standby current of 5.6 µA at 85°C.

• Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-

up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1 µA system current.

• Low SER (Soft Error Rate) FIT (Failure-in-time) for long operation lifetime with no disruption for industrial

markets with always-on SRAM parity against corruption due to potential radiation events.

• Dedicated software-defined radio controller (Arm® Cortex®-M0) providing flexible low-power RF transceiver

capability to support multiple physical layers and RF standards.

The CC2652RB device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth Low

Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development

environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the

SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing

100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU

platform.

Device Information

PART NUMBER(1) PACKAGE BODY SIZE (NOM)

CC2652RB1FRGZ VQFN (48) 7.00 mm × 7.00 mm

(1) For the most current part, package, and ordering information for all available devices, see the Package Option Addendum in Section

12, or see the TI website.

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4 Functional Block Diagram

CC2652RB

General Hardware Peripherals and Modules

Main CPU

Up to

352KB

Flash

with 8KB

Cache

Sensor Interface

cJTAG

Up to

80KB

SRAM

256KB

ROM

Arm®

Cortex®-M4F

Processor

BAW, LDO, Clocks, and References

Optional DC/DC Converter

RF Core

Arm®

Cortex®-M0

Processor

DSP Modem

16KB

SRAM

ROM

ULP Sensor Controller

Low-Power Comparator

12-bit ADC, 200 ks/s

Constant Current Source

SPI-I2C Digital Sensor IF

4KB SRAM

Time-to-Digital Converter

4× 32-bit Timers

2× SSI (SPI)

Watchdog Timer

Temperature and

Battery Monitor

RTC

I2C and I2S

2× UART

32 ch. µDMA

31 GPIOs

AES-256, SHA2-512

ECC, RSA

ADC

Digital PLL

48 MHz

69 µA/MHz

2.4 GHz

TRNG

Figure 4-1. CC2652RB Block Diagram

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Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 2

3 Description.......................................................................2

4 Functional Block Diagram.............................................. 4

5 Revision History.............................................................. 6

6 Device Comparison......................................................... 7

7 Terminal Configuration and Functions..........................8

7.1 Pin Diagram – RGZ Package (Top View)....................8

7.2 Signal Descriptions – RGZ Package...........................9

7.3 Connections for Unused Pins and Modules..............10

8 Specifications................................................................ 11

8.1 Absolute Maximum Ratings ..................................... 11

8.2 ESD Ratings .............................................................11

8.3 Recommended Operating Conditions ...................... 11

8.4 Power Supply and Modules ..................................... 12

8.5 Power Consumption - Power Modes........................ 12

8.6 Power Consumption - Radio Modes......................... 13

8.7 Nonvolatile (Flash) Memory Characteristics ............ 13

8.8 Thermal Resistance Characteristics ........................ 13

8.9 RF Frequency Bands ............................................... 14

8.10 Bluetooth Low Energy - Receive (RX).................... 14

8.11 Bluetooth Low Energy - Transmit (TX).................... 17

8.12 Zigbee and Thread - IEEE 802.15.4-2006 2.4

GHz (OQPSK DSSS1:8, 250 kbps) - TX.....................18

8.13 Zigbee and Thread - IEEE 802.15.4-2006 2.4

GHz (OQPSK DSSS1:8, 250 kbps) - RX.................... 19

8.14 Timing and Switching Characteristics..................... 19

8.15 Peripheral Characteristics.......................................25

8.16 Typical Characteristics............................................ 33

9 Detailed Description......................................................49

9.1 Overview................................................................... 49

9.2 System CPU............................................................. 49

9.3 Radio (RF Core)........................................................50

9.4 Memory..................................................................... 50

9.5 Sensor Controller...................................................... 51

9.6 Cryptography............................................................ 52

9.7 Timers....................................................................... 53

9.8 Serial Peripherals and I/O.........................................54

9.9 Battery and Temperature Monitor............................. 54

9.10 µDMA......................................................................54

9.11 Debug......................................................................54

9.12 Power Management................................................55

9.13 Clock Systems........................................................ 56

9.14 Network Processor..................................................56

10 Application, Implementation, and Layout................. 57

10.1 Reference Designs................................................. 57

11 Device and Documentation Support..........................58

11.1 Tools and Software..................................................58

11.2 Documentation Support.......................................... 60

11.3 Support Resources................................................. 61

11.4 Trademarks............................................................. 61

11.5 Electrostatic Discharge Caution.............................. 61

11.6 Glossary.................................................................. 61

12 Mechanical, Packaging, and Orderable

Information.................................................................... 62

12.1 Packaging Information............................................ 62

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5 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from August 12, 2020 to February 12, 2021 (from Revision C (August 2020) to

Revision D (February 2021)) Page

• Updated the numbering format for tables, figures, and cross-references throughout the document..................1

• Updated to Bluetooth 5.2 throughout the document........................................................................................... 1

• Added 3-wire, 2-wire, and 1-wire PTA coexistence mechanisms to the "Radio Section" list in Section 1

Features .............................................................................................................................................................1

• Added Wireless protocols to Section 1 .............................................................................................................. 1

• Changed the frequency of the input tone for 14-bit and 15-bit mode in Section 8.15.1.1 ................................25

• Added PTA description in Section 9.3, Radio (RF Core) ................................................................................. 50

• Added the paragraph that begins "Integrated matched filter-balun devices can be used…" in Section 10.1,

Reference Designs .......................................................................................................................................... 57

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6 Device Comparison

Table 6-1. Device Family Overview

DEVICE RADIO SUPPORT FLASH

(KB)

RAM

(KB) GPIO PACKAGE SIZE

CC1312R Sub-1 GHz 352 80 30 RGZ (7-mm × 7-mm VQFN48)

CC1352P

Multiprotocol

Sub-1 GHz

Bluetooth 5.2 Low Energy

Zigbee

Thread

2.4 GHz proprietary FSK-based formats

+20-dBm high-power amplifier

352 80 26 RGZ (7-mm × 7-mm VQFN48)

CC1352R

Multiprotocol

Sub-1 GHz

Bluetooth 5.2 Low Energy

Zigbee

Thread

2.4 GHz proprietary FSK-based formats

352 80 28 RGZ (7-mm × 7-mm VQFN48)

CC2642R Bluetooth 5.2 Low Energy

2.4 GHz proprietary FSK-based formats 352 80 31 RGZ (7-mm × 7-mm VQFN48)

CC2642R-Q1 Bluetooth 5.2 Low Energy 352 80 31 RTC (7-mm × 7-mm VQFN48)

CC2652R

Multiprotocol

Bluetooth 5.2 Low Energy

Zigbee

Thread

2.4 GHz proprietary FSK-based formats

352 80 31 RGZ (7-mm × 7-mm VQFN48)

CC2652RB

Multiprotocol

Bluetooth 5.2 Low Energy

Zigbee

Thread

2.4 GHz proprietary FSK-based formats

352 80 31 RGZ (7-mm × 7-mm VQFN48)

CC2652P

Multiprotocol

Bluetooth 5.2 Low Energy

Zigbee

Thread

2.4 GHz proprietary FSK-based formats

+19.5-dBm high-power amplifier

352 80 26 RGZ (7-mm × 7-mm VQFN48)

CC1310 Sub-1 GHz 32–128 16–20 10–31

RGZ (7-mm × 7-mm VQFN48)

RHB (5-mm × 5-mm VQFN32)

RSM (4-mm × 4-mm VQFN32)

CC1350 Sub-1 GHz

Bluetooth 4.2 Low Energy 128 20 10–31

RGZ (7-mm × 7-mm VQFN48)

RHB (5-mm × 5-mm VQFN32)

RSM (4-mm × 4-mm VQFN32)

CC2640R2F Bluetooth 5.1 Low Energy

2.4 GHz proprietary FSK-based formats 128 20 10–31

RGZ (7-mm × 7-mm VQFN48)

RHB (5-mm × 5-mm VQFN32)

RSM (4-mm × 4-mm VQFN32)

YFV (2.7-mm × 2.7-mm DSBGA34)

CC2640R2F-Q1 Bluetooth 5.1 Low Energy

2.4 GHz proprietary FSK-based formats 128 20 31 RGZ (7-mm × 7-mm VQFN48)

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7 Terminal Configuration and Functions

7.1 Pin Diagram – RGZ Package (Top View)

DCDC_SW33

DIO_18

RESET_N35

DIO_2336

X32K_Q2 4

X32K_Q1 3

RF_N 2

RF_P 1

DIO_2232

DIO_2131

DIO_2030

DIO_1929

DIO_0 5

DIO_1 6

DIO_2 7

JTAG_TCKC25

DIO_15

DIO_14

DIO_17

DIO_16

VDDS_DCDC

DIO_12

DIO_13

VDDS2

DIO_11

DIO_10

DIO_5

DIO_6

DIO_7

DIO_3

DIO_4

DIO_8

DIO_9

VDDS3

DCOUPL

JTAG_TMSC

DIO_25

DIO_24

VDDR

VDDR_RF

DIO_26

X48M_P

X48M_N

DIO_28

DIO_29

DIO_30

DIO_27

VDDS

Figure 7-1. RGZ (7-mm × 7-mm) Pinout, 0.5-mm Pitch (Top View)

The following I/O pins marked in Figure 7-1 in bold have high-drive capabilities:

• Pin 10, DIO_5

• Pin 11, DIO_6

• Pin 12, DIO_7

• Pin 24, JTAG_TMSC

• Pin 26, DIO_16

• Pin 27, DIO_17

The following I/O pins marked in Figure 7-1 in italics have analog capabilities:

• Pin 36, DIO_23

• Pin 37, DIO_24

• Pin 38, DIO_25

• Pin 39, DIO_26

• Pin 40, DIO_27

• Pin 41, DIO_28

• Pin 42, DIO_29

• Pin 43, DIO_30

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7.2 Signal Descriptions – RGZ Package

Table 7-1. Signal Descriptions – RGZ Package

PIN I/O TYPE DESCRIPTION

NAME NO.

DCDC_SW 33 — Power Output from internal DC/DC converter. Tie to ground for external

regulator mode (1.7-V to 1.95-V operation). (1)

DCOUPL 23 — Power For decoupling of internal 1.27 V regulated digital-supply (2)

DIO_0 5 I/O Digital GPIO

DIO_1 6 I/O Digital GPIO

DIO_2 7 I/O Digital GPIO

DIO_3 8 I/O Digital GPIO

DIO_4 9 I/O Digital GPIO

DIO_5 10 I/O Digital GPIO, high-drive capability

DIO_6 11 I/O Digital GPIO, high-drive capability

DIO_7 12 I/O Digital GPIO, high-drive capability

DIO_8 14 I/O Digital GPIO

DIO_9 15 I/O Digital GPIO

DIO_10 16 I/O Digital GPIO

DIO_11 17 I/O Digital GPIO

DIO_12 18 I/O Digital GPIO

DIO_13 19 I/O Digital GPIO

DIO_14 20 I/O Digital GPIO

DIO_15 21 I/O Digital GPIO

DIO_16 26 I/O Digital GPIO, JTAG_TDO, high-drive capability

DIO_17 27 I/O Digital GPIO, JTAG_TDI, high-drive capability

DIO_18 28 I/O Digital GPIO

DIO_19 29 I/O Digital GPIO

DIO_20 30 I/O Digital GPIO

DIO_21 31 I/O Digital GPIO

DIO_22 32 I/O Digital GPIO

DIO_23 36 I/O Digital or Analog GPIO, analog capability

DIO_24 37 I/O Digital or Analog GPIO, analog capability

DIO_25 38 I/O Digital or Analog GPIO, analog capability

DIO_26 39 I/O Digital or Analog GPIO, analog capability

DIO_27 40 I/O Digital or Analog GPIO, analog capability

DIO_28 41 I/O Digital or Analog GPIO, analog capability

DIO_29 42 I/O Digital or Analog GPIO, analog capability

DIO_30 43 I/O Digital or Analog GPIO, analog capability

EGP — — GND Ground – exposed ground pad(3)

JTAG_TMSC 24 I/O Digital JTAG TMSC, high-drive capability

JTAG_TCKC 25 I Digital JTAG TCKC

RESET_N 35 I Digital Reset, active low. No internal pullup resistor

RF_P 1 — RF Positive RF input signal to LNA during RX

Positive RF output signal from PA during TX

RF_N 2 — RF Negative RF input signal to LNA during RX

Negative RF output signal from PA during TX

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Table 7-1. Signal Descriptions – RGZ Package (continued)

PIN I/O TYPE DESCRIPTION

NAME NO.

VDDR 45 — Power

Internal supply, must be powered from the internal DC/DC

converter or the internal LDO. For external regulator mode (1.7-V to

1.95-V operation), connect to external regulator and internal DC-

DC cannot be used. (2) (4) (6)

VDDR_RF 48 — Power Internal supply, must be powered from the internal DC/DC

converter or the internal LDO(2) (5) (6)

VDDS 44 — Power

1.8-V to 3.8-V main chip supply. For external regulator mode (1.7-V

to 1.95-V operation), connect to external regulator and internal DC-

DC cannot be used. (1)

VDDS2 13 — Power 1.8-V to 3.8-V DIO supply(1)

VDDS3 22 — Power 1.8-V to 3.8-V DIO supply(1)

VDDS_DCDC 34 — Power 1.8-V to 3.8-V DC/DC converter supply. Tie to ground for external

regulator mode (1.7-V to 1.95-V operation).

X48M_N 46 — Analog 48-MHz crystal oscillator pin 1. Do not connect if not in use.

(Optional)(7)

X48M_P 47 — Analog 48-MHz crystal oscillator pin 2. Do not connect if not in use.

(Optional)(7)

X32K_Q1 3 — Analog 32-kHz crystal oscillator pin 1

X32K_Q2 4 — Analog 32-kHz crystal oscillator pin 2

(1) For more details, see technical reference manual listed in Section 11.2.

(2) Do not supply external circuitry from this pin.

(3) EGP is the only ground connection for the device. Good electrical connection to device ground on printed circuit board (PCB) is

imperative for proper device operation.

(4) If internal DC/DC converter is not used, this pin is supplied internally from the main LDO.

(5) If internal DC/DC converter is not used, this pin must be connected to VDDR for supply from the main LDO.

(6) Output from internal DC/DC and LDO is trimmed to 1.68 V.

(7) The X48M_N and X48M_P pins can be used to connect an external 48-MHz crystal. This clock can be used instead of the internal

BAW clock. However, it is not required for the device standard operation.

7.3 Connections for Unused Pins and Modules

Table 7-2. Connections for Unused Pins

FUNCTION SIGNAL NAME PIN NUMBER ACCEPTABLE PRACTICE(1) PREFERRED

PRACTICE(1)

GPIO DIO_n

5–12

14–21

26–32

36–43

NC or GND NC

32.768-kHz crystal X32K_Q1 3 NC or GND NC

X32K_Q2 4

DC/DC converter(2) DCDC_SW 33 NC NC

VDDS_DCDC 34 VDDS (GND)(3) VDDS (GND)(3)

48-MHz crystal X48M_N 46 NC NC

X48M_P 47 NC NC

(1) NC = No connect

(2) When the DC/DC converter is not used, the inductor between DCDC_SW and VDDR can be removed. VDDR and VDDR_RF must still

be connected and the 22 uF DCDC capacitor must be kept on the VDDR net.

(3) When operating in external regulator mode.

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