Texas Instruments TPD2S701-Q1 Bedienungsanleitung

SLVUAU3–January 2017

TPD2S701-Q1 Evaluation Module

User's Guide

SLVUAU3–January 2017

TPD2S701-Q1 Evaluation Module

This user's guide describes the characteristics, operation, and use of the TPD2S701-Q1 USB 2.0 Data

Line Overvoltage Protection Evaluation Module (EVM). The TPD2S701-Q1 is a 2-Channel Data Line

Short-to-Battery, Short-to-VBUS, and IEC61000-4-2 ESD protection device for automotive high-speed

interfaces like USB2.0. This EVM contains multiple TPD2S701-Q1 devices in various configurations to

allow the user to test the operation of the TPD2S701-Q1 overvoltage protection and ESD protection in

their own system. This user's guide includes setup instructions, schematic diagrams, a bill of materials,

and printed circuit board layout drawings for the EVM.

Contents

1 Introduction ................................................................................................................... 2

2 Board Setup .................................................................................................................. 2

2.1 Device Information.................................................................................................. 2

2.2 Passthrough Evaluation............................................................................................ 3

2.3 Bandwidth Evaluation .............................................................................................. 4

2.4 IEC ESD Evaluation................................................................................................ 4

3 Schematics ................................................................................................................... 6

4 Layout ......................................................................................................................... 7

5 Bill of Materials............................................................................................................... 8

List of Figures

1 TPD2S701-Q1 EVM......................................................................................................... 2

2 Passthrough Evaluation Configuration.................................................................................... 3

3 Bandwidth Evaluation Configuration ...................................................................................... 4

4 ESD Evaluation Configuration ............................................................................................. 5

5 Schematic Page 1 ........................................................................................................... 6

6 Schematic Page 2 ........................................................................................................... 6

7 Schematic Page 3 ........................................................................................................... 6

8 TPD2S701-Q1 Top Layer .................................................................................................. 7

9 TPD2S701-Q1 Bottom Layer............................................................................................... 7

List of Tables

1 Bill of Materials............................................................................................................... 8

Introduction

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1 Introduction

Texas Instrument’s TPD2S701-Q1 evaluation module helps designers evaluate the operation and

performance of the TPD2S701-Q1 device. The TPD2S701-Q1 contains two data line nFET switches which

ensure safe data communication while protecting the internal system circuits from any over-voltage

conditions at the VD+ and VD– pins. See Figure 1. On these pins, this device can handle over-voltage

protection up to 18-V DC. This provides sufficient protection for shorting the data lines to the car battery

as well as the USB VBUS rail. This EVM allows the user to evaluate the operation of this device in a pass-

through application, as well as to measure the ESD response and bandwidth of the device. In addition,

this EVM offer, contains the device in both the DSK and DGS package offering, so that the device can be

evaluated regardless of the preferred package option.

Figure 1. TPD2S701-Q1 EVM

2 Board Setup

The TPD2S701-Q1 EVM consists of 5 devices allowing for three different test setups.

2.1 Device Information

To power the EVM, apply 5 V to the pin labeled '+5V' on the EVM. If the user is testing a device in Mode

0, they will need to apply an additional voltage to the pin labeled 'Vref', but if testing is done in Mode 1

then the 'Vref' pin can be left unused. The functional devices modes are discussed in greater depth later,

but for detailed information see the device data sheet.

Each TPD2S701-Q1 in this EVM contains headers for enabling the device and a mode switch to enable

each mode of operation. Before using any of the devices, ensure that the particular device has a header

between the center pin and the pin labeled 'On' for the corresponding set of pins. It is recommended that

any devices not currently in use be disabled by moving the header between the center pin and the 'Off'

pin.

In addition, the EVM allows testing of each device in either functional mode 0 or functional mode 1 by

moving the switch corresponding to the device. The functional mode changes how the overvoltage set

point of the TPD2S701-Q1 is determined. In order to operate properly, the device must be power-cycled

when changing functional modes. We recommend only changing device modes while there is no power

applied to the '+5V' board power to ensure that the device works properly.

In functional mode 0 the overvoltage set point is determined by an external voltage applied to the 'Vref' pin

on the EVM. The correlation between the Vref voltage and the overvoltage set point is determined by a

formula that can be found in the device datasheet. The voltage applied to the 'Vref' pin applies to all

TPD2S701-Q1 devices on the EVM that are currently enabled and in mode 0.

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Board Setup

SLVUAU3–January 2017

TPD2S701-Q1 Evaluation Module

If the switch is placed in position 1, the overvoltage set point is determined instead by external resistors

and an internal voltage reference. In this mode, the device can operate with no external voltage applied to

the 'Vref' pin. The EVM is designed with external resistors to always have a 3.6 V overvoltage set point in

mode 1.

Each device also contains a yellow test point that allows the user to measure the corresponding devices

FLT output. Measure the voltage on this pin to record when the device goes into an undervoltage,

overvoltage, or thermal shutdown state to ensure that the device operates as expected.

2.2 Passthrough Evaluation

Devices U1 and U2 are in a configured to allow for USB 2.0 pass-through testing. The two devices are in

a DSK and DGS package respectively, but otherwise are functionality identical. Each has a male and

female USB port that can be plugged into any system with a USB 2.0 port to ensure that the device can

protect existing systems. Plug J9 or J13 into a USB port and then plug a peripheral into J10 or J14 to

ensure that during typical operation the TPD2S701-Q1 has no effect on standard USB operations. While

plugged in, use a probe to apply a voltage above the overvoltage setpoint to one of the data lines and

observe that the TPD2S701-Q1 isolates the system, preventing any data pass-through. After the voltage is

removed, the TPD2S701-Q1 must remove the isolation and quickly re-allow data communications. See

Figure 2.

By taking advantage of this pass-through evaluation, the user can quickly determine whether the

TPD2S701-Q1 is optimal for their existing system without requiring any board changes or non-optimal test

setups. There is an additional USB 2.0 pass-through setup at the bottom of the board that is designed for

calibration. The board and trace add some parasitics and bandwidth loss that do not reflect how the

TPD2S701-Q1 operates when designed into a system. This additional pass-through allows for calibration

to account for those and get a more accurate picture of the TPD2S701-Q1.

Figure 2. Passthrough Evaluation Configuration

Board Setup

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2.3 Bandwidth Evaluation

Devices U3 and U4 are configured to allow for precise bandwidth measurements. The two devices are in a

DSK and DGS package respectively, but otherwise are functionally identical. Each device has SMA

connectors on both the connector and system side of the USB 2.0 Data line pins that offer a low

attenuation way to connect a network analyzer and ensure that during typical operation the TPD2S701-Q1

capacitance and inductance do not impede signal speed past where the maximum line signal speed is. In

addition, when U3 and U4 are placed into a fault state the bandwidth can be measured to ensure that the

DC fault voltage is significantly attenuated. See Figure 3.

There is an additional bandwidth setup that is designed for calibration. The board and trace add some

parasitics and bandwidth loss that do not reflect how the TPD2S701-Q1 operates when designed into a

system. This additional pass-through allows for calibration to account for those and get a more accurate

picture of the bandwidth of the TPD2S701-Q1.

Figure 3. Bandwidth Evaluation Configuration

2.4 IEC ESD Evaluation

Device U5 is configured to be an optimal place to test the TPD2S701-Q1 IEC ESD strike response. This

configuration contains the TPD2S701-Q1 in only the DSK package as there is no difference in the

performance between the DSK and DGS packages. Test points VD+ and VD– offer strike points that can

targeted with an external ESD simulator on the protected data lines. By measuring with attenuated scope

probes on the SMB connecters labeled D+ and D– during an ESD strike, the user can capture a waveform

of what the protected system is exposed to during an ESD strike. Resistors R7 and R9 are 150-Ωresistors

in series with the ESD pulse to provide a 4x attenuation with the 50-Ωoscilloscope probe impedance. In

addition to this, to ensure that the oscilloscope is not harmed a 10x attenuation probe must be used. See

Figure 4.

For more information about Texas Instruments recommended ESD test setup, see the application report,

IEC 61000-4-x Tests for TI’s Protection Devices.

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Board Setup

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TPD2S701-Q1 Evaluation Module

Figure 4. ESD Evaluation Configuration

Schematics

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3 Schematics

Figure 5. Schematic Page 1

Figure 6. Schematic Page 2

Figure 7. Schematic Page 3

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Layout

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TPD2S701-Q1 Evaluation Module

4 Layout

The TPD2S701-Q1 EVM is a 4 layer board of FR4 with measurements of 7.92 inches by 1.9 inches with a

thickness of 62 mil. Only the top and bottom layers are shown below, as the middle two layers are both

ground planes.

Figure 8. TPD2S701-Q1 Top Layer

Figure 9. TPD2S701-Q1 Bottom Layer

Bill of Materials

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5 Bill of Materials

(1) Unless otherwise noted in the Alternate PartNumber and/or Alternate Manufacturer columns, all parts may be substituted with equivalents.

Table 1. Bill of Materials

Designator Quantity Value Description Package

Reference Part

Number Manufacturer Alternate

PartNumber(1) Alternate

Manufacturer

PCB 1 Printed Circuit Board HVL147 Any — —

C1, C8,

C13 3 1 uF CAP, CERM, 1 µF, 100 V, ±10%, X7R,

AEC-Q200 Grade 1, 1206_190 1206_190 GCM31CR72A105K

A03 MuRata

C2, C3,

C4, C5,

C6, C7,

C9, C10,

C11, C12

10 1 uF CAP, CERM, 1 µF, 10 V,±10%, X7S,

AEC-Q200 Grade 1, 0402 0402 GCM155C71A105KE

38D MuRata

J1 1 Standard Banana Jack, Uninsulated, 5.5

mm Keystone_575-4 575-4 Keystone

J2, J5, J6,

J7, J8 5 Header, 100 mil, 3×1, Tin, TH Header, 3 PIN,

100 mil, Tin PEC03SAAN Sullins Connector

Solutions

J3, J4 2 Connector, SMB,Vertical RCP 0-4 GHz,

50 Ω, TH 236×293×236mil 131-3701-261 Emerson Network Power

J9, J11,

J13 3 Connector, USB Type A, 4POS R/A,

SMD USB Type A right

angle 0480371000 Molex

J10, J12,

J14 3 Connector, Receptacle, USB TYPE A,

4POS SMD USB TYPE A

CONNECTOR

RECEPTACLE

4POS SMD

896-43-004-00-

000000 Mill-Max

J15, J16,

J17, J18,

J19, J20,

J21, J22,

J23, J24,

J25, J26

12 SMA Straight PCB Socket Die Cast, 50

Ω, TH SMA Straight

PCB Socket Die

Cast, TH

5-1814832-1 TE Connectivity

L1, L2, L3,

L4, L5, L6,

L7, L8

8 10 nH Inductor, Multilayer, Air Core, 10 nH,

0.3A, 0.26 Ω, SMD 0402 polarized LQG15HS10NJ02D MuRata

LBL1 1 Thermal Transfer Printable Labels,

1.250" W × 0.250" H - 10,000 per roll PCB Label 1.25

× 0.250 inch THT-13-457-10 Brady

R1, R8,

R11, R17,

R19

5 0 RES, 0, 5%, 0.063 W, 0402 0402 RC0402JR-070RL Yageo America

R2, R10,

R12, R18,

R20

5 10k RES, 10 k, 5%, 0.063 W, 0402 0402 CRCW040210K0JN

ED Vishay-Dale

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Bill of Materials

SLVUAU3–January 2017

TPD2S701-Q1 Evaluation Module

Table 1. Bill of Materials (continued)

Designator Quantity Value Description Package

Reference Part

Number Manufacturer Alternate

PartNumber(1) Alternate

Manufacturer

R3, R13,

R14, R21,

R22

5 140k RES, 140 k, 1%, 0.1 W, AEC-Q200

Grade 0, 0402 0402 ERJ-2RKF1403X Panasonic

R4, R15,

R16, R23,

R24

5 24.9k RES, 24.9 k, 1%, 0.063 W, 0402 0402 CRCW040224K9FK

ED Vishay-Dale

R5, R6 2 45.3 RES, 45.3, 1%, 0.1 W, 0603 0603 CRCW060345R3FK

EA Vishay-Dale

R7, R9 2 150 RES, 150, 1%, 0.1 W, 0603 0603 RC0603FR-07150RL Yageo America

S1, S2, S3,

S4, S5 5 SLIDE SWITCH DPDT .1A, SMT SWITCH,

5.4×2.5×3.9 mm CAS-220TA Copal Electronics

SH-J2, SH-

J5, SH-J6,

SH-J7, SH-

5 Shunt, 2.54 mm, Gold, Black Shunt, 2.54 mm,

Black 60900213421 Wurth Elektronik

T1, T2, T3,

T4 4 SMT Common Mode Choke mcf12102g900 Taiyo Yuden None None

TP1, TP4,

TP5, TP6,

TP7

5 Test Point, Compact, Yellow, TH Yellow Compact

Testpoint 5009 Keystone

TP2 1 Test Point, Compact, Red, TH Red Compact

Testpoint 5005 Keystone

TP3 1 Orange Test Point, Compact, Orange, TH Orange Compact

Testpoint 5008 Keystone

U1, U3, U5 3 Automotive USB 2-Ch Date Line Short-

to-Battery, Short-to-VBUS, and IEC

ESD pritection, DSK0010A

DSK0010A TPD2S701QDSKRQ

1Texas Instruments Texas Instruments

U2, U4 2 Automotive USB 2-Ch Date Line Short-

to-Battery, Short-to-VBUS, and IEC

ESD pritection, DGS0010A

DGS0010A TPD2S701QDGSRQ

1Texas Instruments Texas Instruments

FID1, FID2,

FID3 0 Fiducial mark. There is nothing to buy or

mount Fiducial N/A N/A

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