Toshiba DVR80KF Bedienungsanleitung

SERVICE MANUAL

TOSHIBA CORPORATION 2010

VCR DVD

The above model is classified as a green product (*1), as indicated by the underlined serial

number. This Service Manual describes replacement parts for the green product. When

repairing this green product, use the part(s) described in this manual and lead-free solder (*2).

For (*1) and (*2), see the next page.

FILE NO. 810-2009135GR

DVD/

Video

Cassette

Recorder

DVR80KF

Published in Japan, Feb. 2010 GREEN

(*1) GREEN PRODUCT PROCUREMENT

The EC is actively promoting the WEEE & RoHS Directives that define standards for recycling

and reuse of Waste Electrical and Electronic Equipment and for the Restriction of the use of

certain Hazardous Substances. From July 1, 2006, the RoHS Directive will prohibit any

marketing of new products containing the restricted substances.

Increasing attention is given to issues related to the global environmental. Toshiba Corporation

recognizes environmental protection as a key management tasks, and is doing its utmost to

enhance and improve the quality and scope of its environmental activities. In line with this,

Toshiba proactively promotes Green Procurement, and seeks to purchase and use products,

parts and materials that have low environmental impacts.

Green procurement of parts is not only confined to manufacture. The same green parts used in

manufacture must also be used as replacement parts.

(*2) LEAD-FREE SOLDER

This product is manufactured using lead-free solder as a part of a movement within the consumer

products industry at large to be environmentally responsible. Lead-free solder must be used in the

servicing and repair of this product.

WARNING

This product is manufactured using lead free solder.

DO NOT USE LEAD BASED SOLDER TO REPAIR THIS PRODUCT !

The melting temperature of lead-free solder is higher than that of leaded solder by 86°F to 104°F

(30°C to 40°C). Use of a soldering iron designed for lead-based solders to repair product made

with lead-free solder may result in damage to the component and or BOARD being soldered.

Great care should be made to ensure high-quality soldering when servicing this product —

especially when soldering large components, through-hole pins, and on BOARDs — as the level

of heat required to melt lead-free solder is high.

MAIN SECTION

DVD / VIDEO CASSETTE RECORDER

DVR80KF

TABLE OF CONTENTS

Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1-1

Laser Beam Safety Precautions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2-1

Important Safety Precautions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3-1

Standard Notes for Servicing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4-1

Preparation for Servicing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5-1

Cabinet Disassembly Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6-1

Electrical Adjustment Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7-1

How to Initialize the DVD Recorder & VCR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8-1

Firmware Renewal Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-9-1

Remote Control Key Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10-1

Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11-1

Function Indicator Symbols . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12-1

Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-13-1

Schematic Diagrams / BOARD and Test Points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14-1

Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-15-1

Wiring Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16-1

System Control Timing Charts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-17-1

IC Pin Function Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-18-1

Lead Identifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-19-1

Exploded Views . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-20-1

Mechanical Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-21-1

Electrical Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-22-1

Main Section

ISpecifications

IPreparation for Servicing

IAdjustment Procedures

ISchematic Diagrams

IBOARD

IExploded Views

IParts List

Manufactured under license from Dolby Laboratories.

Dolby and the double-D symbol are trademarks of Dolby Laboratories.

1-1-1 E9TK5SP

SPECIFICATIONS

1-2-1 DRVHDP_LBSP

LASER BEAM SAFETY PRECAUTIONS

This DVD player uses a pickup that emits a laser beam.

The laser beam is emitted from the location shown in the figure. When checking the laser diode, be sure to keep

your eyes at least 30 cm away from the pickup lens when the diode is turned on. Do not look directly at the laser

beam.

CAUTION: Use of controls and adjustments, or doing procedures other than those specified herein, may result in

hazardous radiation exposure.

Location: Inside Top of DVD mechanism.

Do not look directly at the laser beam coming

from the pickup or allow it to strike against your

skin.

Drive Mechanism Assembly

Laser Beam Radiation

Laser Pickup

Turntable

1-3-1 DVDP_ISP

IMPORTANT SAFETY PRECAUTIONS

Product Safety Notice

Some electrical and mechanical parts have special

safety-related characteristics which are often not

evident from visual inspection, nor can the protection

they give necessarily be obtained by replacing them

with components rated for higher voltage, wattage,

etc. Parts that have special safety characteristics are

identified by a !on schematics and in parts lists. Use

of a substitute replacement that does not have the

same safety characteristics as the recommended

replacement part might create shock, fire, and/or other

hazards. The Product’s Safety is under review

continuously and new instructions are issued

whenever appropriate. Prior to shipment from the

factory, our products are carefully inspected to confirm

with the recognized product safety and electrical

codes of the countries in which they are to be sold.

However, in order to maintain such compliance, it is

equally important to implement the following

precautions when a set is being serviced.

Precautions during Servicing

A. Parts identified by the !symbol are critical for

safety. Replace only with part number specified.

B. In addition to safety, other parts and assemblies

are specified for conformance with regulations

applying to spurious radiation. These must also be

replaced only with specified replacements.

Examples: RF converters, RF cables, noise

blocking capacitors, and noise blocking filters, etc.

C. Use specified internal wiring. Note especially:

1) Wires covered with PVC tubing

2) Double insulated wires

3) High voltage leads

D. Use specified insulating materials for hazardous

live parts. Note especially:

1) Insulation tape

2) PVC tubing

3) Spacers

4) Insulators for transistors

E. When replacing AC primary side components

(transformers, power cord, etc.), wrap ends of

wires securely about the terminals before

soldering.

F. Observe that the wires do not contact heat

producing parts (heatsinks, oxide metal film

resistors, fusible resistors, etc.).

G. Check that replaced wires do not contact sharp

edges or pointed parts.

H. When a power cord has been replaced, check that

5 - 6 kg of force in any direction will not loosen it.

I. Also check areas surrounding repaired locations.

J. Be careful that foreign objects (screws, solder

droplets, etc.) do not remain inside the set.

K. When connecting or disconnecting the internal

connectors, first, disconnect the AC plug from the

AC outlet.

L. Be sure to confirm the FAN motor has completely

stopped when disconnecting the AC cord for

termination processing is activated during inner P-

on immediately after turning Power off.

1-3-2 DVDP_ISP

Safety Check after Servicing

Examine the area surrounding the repaired location for

damage or deterioration. Observe that screws, parts,

and wires have been returned to their original positions.

Afterwards, do the following tests and confirm the

specified values to verify compliance with safety

standards.

1. Clearance Distance

When replacing primary circuit components, confirm

specified clearance distance (d) and (d’) between

soldered terminals, and between terminals and

surrounding metallic parts. (See Fig. 1)

Table 1 : Ratings for selected area

Note: This table is unofficial and for reference only.

Be sure to confirm the precise values.

2. Leakage Current Test

Confirm the specified (or lower) leakage current

between B (earth ground, power cord plug prongs) and

externally exposed accessible parts (RF terminals,

antenna terminals, video and audio input and output

terminals, microphone jacks, earphone jacks, etc.) is

lower than or equal to the specified value in the table

below.

Measuring Method (Power ON) :

Insert load Z between B (earth ground, power cord plug

prongs) and exposed accessible parts. Use an AC

voltmeter to measure across the terminals of load Z.

See Fig. 2 and the following table.

AC Line Voltage Clearance Distance (d), (d’)

230 V ≥3.2 mm(d)

≥6.0 mm(d’)

Chassis or Secondary Conductor

Primary Circuit

Fig. 1

d' d

AC Voltmeter

(High Impedance)

Exposed Accessible Part

BOne side of

Power Cord Plug Prongs

Fig. 2

Table 2: Leakage current ratings for selected areas

Note: This table is unofficial and for reference only. Be sure to confirm the precise values.

AC Line Voltage Load Z Leakage Current (i) One side of power cord plug

prongs (B) to:

230 V

2kΩ RES.

Connected in

parallel

i≤0.7mA AC Peak

i≤2mA DC

RF or

Antenna terminals

50kΩRES.

Connected in

parallel

i≤0.7mA AC Peak

i≤2mA DC A/V Input, Output

1-4-1 DVDP_SN

STANDARD NOTES FOR SERVICING

Circuit Board Indications

1. The output pin of the 3 pin Regulator ICs is

indicated as shown.

2. For other ICs, pin 1 and every fifth pin are

indicated as shown.

3. The 1st pin of every male connector is indicated as

shown.

Instructions for Connectors

1. When you connect or disconnect the FFC (Flexible

Foil Connector) cable, be sure to first disconnect

the AC cord.

2. FFC (Flexible Foil Connector) cable should be

inserted parallel into the connector, not at an

angle.

Pb (Lead) Free Solder

When soldering, be sure to use the Pb free solder.

How to Remove / Install Flat Pack-IC

1. Removal

With Hot-Air Flat Pack-IC Desoldering Machine:

1. Prepare the hot-air flat pack-IC desoldering

machine, then apply hot air to the Flat Pack-IC

(about 5 to 6 seconds). (Fig. S-1-1)

2. Remove the flat pack-IC with tweezers while

applying the hot air.

3. Bottom of the flat pack-IC is fixed with glue to the

BOARD; when removing entire flat pack-IC, first

apply soldering iron to center of the flat pack-IC

and heat up. Then remove (glue will be melted).

(Fig. S-1-6)

4. Release the flat pack-IC from the BOARD using

tweezers. (Fig. S-1-6)

CAUTION:

1. The Flat Pack-IC shape may differ by models. Use

an appropriate hot-air flat pack-IC desoldering

machine, whose shape matches that of the Flat

Pack-IC.

2. Do not supply hot air to the chip parts around the

flat pack-IC for over 6 seconds because damage

to the chip parts may occur. Put masking tape

around the flat pack-IC to protect other parts from

damage. (Fig. S-1-2)

NOTE: BOARD MEANS PRINTED CIRCUIT BOARD.

To p V i ew

Out In

Bottom View

Input

Pin 1

FFC Cable

Connector

BOARD

* Be careful to avoid a short circuit.

Fig. S-1-1

1-4-2 DVDP_SN

3. The flat pack-IC on the BOARD is affixed with

glue, so be careful not to break or damage the foil

of each pin or the solder lands under the IC when

removing it.

With Soldering Iron:

1. Using desoldering braid, remove the solder from

all pins of the flat pack-IC. When you use solder

flux which is applied to all pins of the flat pack-IC,

you can remove it easily. (Fig. S-1-3)

2. Lift each lead of the flat pack-IC upward one by

one, using a sharp pin or wire to which solder will

not adhere (iron wire). When heating the pins, use

a fine tip soldering iron or a hot air desoldering

machine. (Fig. S-1-4)

3. Bottom of the flat pack-IC is fixed with glue to the

BOARD; when removing entire flat pack-IC, first

apply soldering iron to center of the flat pack-IC

and heat up. Then remove (glue will be melted).

(Fig. S-1-6)

4. Release the flat pack-IC from the BOARD using

tweezers. (Fig. S-1-6)

Hot-air

Flat Pack-IC

Desoldering

Machine

BOARD

Flat Pack-IC

Tweezers

Masking

Ta p e

Fig. S-1-2

Flat Pack-IC Desoldering Braid

Soldering Iron

Fig. S-1-3

Fine Tip

Soldering Iron

Sharp

Fig. S-1-4

1-4-3 DVDP_SN

With Iron Wire:

1. Using desoldering braid, remove the solder from

all pins of the flat pack-IC. When you use solder

flux which is applied to all pins of the flat pack-IC,

you can remove it easily. (Fig. S-1-3)

2. Affix the wire to a workbench or solid mounting

point, as shown in Fig. S-1-5.

3. While heating the pins using a fine tip soldering

iron or hot air blower, pull up the wire as the solder

melts so as to lift the IC leads from the BOARD

contact pads as shown in Fig. S-1-5.

4. Bottom of the flat pack-IC is fixed with glue to the

BOARD; when removing entire flat pack-IC, first

apply soldering iron to center of the flat pack-IC

and heat up. Then remove (glue will be melted).

(Fig. S-1-6)

5. Release the flat pack-IC from the BOARD using

tweezers. (Fig. S-1-6)

Note: When using a soldering iron, care must be

taken to ensure that the flat pack-IC is not

being held by glue. When the flat pack-IC is

removed from the BOARD, handle it gently

because it may be damaged if force is applied.

2. Installation

1. Using desoldering braid, remove the solder from

the foil of each pin of the flat pack-IC on the

BOARD so you can install a replacement flat pack-

IC more easily.

2. The “ I ” mark on the flat pack-IC indicates pin 1.

(See Fig. S-1-7.) Be sure this mark matches the

pin 1 on the BOARD when positioning for

installation. Then presolder the four corners of the

flat pack-IC. (See Fig. S-1-8.)

3. Solder all pins of the flat pack-IC. Be sure that

none of the pins have solder bridges.

To Solid

Mounting Point

Soldering Iron

Iron Wire

Hot Air Blower

Fig. S-1-5

Fine Tip

Soldering Iron

BOARD

Flat Pack-IC

Tweezers

Fig. S-1-6

Example :

Pin 1 of the Flat Pack-IC

is indicated by a " " mark. Fig. S-1-7

Presolder

BOARD

Flat Pack-IC

Fig. S-1-8

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