Toshiba 50XP37C Bedienungsanleitung
SERVICE MANUAL
Plasma Display
50XP37C
50XP37E
50XP37F
50XP37H
FILE NO. 010-200328
Mar. 2004 (YC)
– 2 –
1 Applicable signals 3
2 Safety Precautions 4
2.1. General Guidelines 4
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 5
4 About lead free solder (PbF) 6
5 PCB Structure sheet of GPH D2 chassis 7
Service Hint 8
7 Location of Lead Wiring 9
8 Adjustment Procedure 10
8.1. Driver Set-up 10
8.2. Initialization Pulse Adjust 11
8.3. P.C.B. (Printed Circuit Board) exchange 12
8.4. Adjustment Volume Location 13
8.5. Test Point Location 13
9 Service mode 13
9.1. CAT (computer Aided Test) mode 13
9.2. IIC mode structure (following items value is sample data.)
15
10 Alignment 16
10.1. 625i/625p panel white balance 16
10.2. PC/RGB panel white balance 18
10.3. HD panel white balance 19
11 Trouble shooting guide 20
11.1. Self Check 20
11.2. No Power (Power shut down) 20
11.3. No Picture 21
11.4. Local screen failure 22
12 Conductor Views 23
12.1. PF-Board 23
12.2. P-Board 25
12.3. HX-Board 28
12.4. HV-Board 29
12.5. HZ-Board 30
12.6. HT-Board 31
12.7. J-Board 32
12.8. D-Board 34
12.9. C1-Board 37
12.10. C2-Board 38
12.11. C3-Board 39
12.12. C4-Board 40
12.13. C5-Board 41
12.14. C6-Board 42
12.15. SC-Board 43
12.16. SU-Board 45
12.17. SD-Board 47
12.18. SS, SS2 and SS3-Board 48
12.19. Z-Board 50
12.20. V1, S1 and H3-Board 51
CONTENTS
Page Page
50XP37
13 Replacementpanelhandlingprecautionsandreplacement
procedure 55
14 PartsLocation 57
15Chassis and Cabinet Replacement Parts List 59
16Specifications END
Appendix
Block and Schematic Diagrams
–3–
1 Applicable signals
50XP37
–4–
2.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1MWand 5.2MW.
When the exposed metal does not have a return path to
the chassis, the reading must be .
Figure 1
2.1.2. Leakage Current Hot Check (See
Figure 1.)
1. Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2. Connect a 1.5kW, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the
voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
2 Safety Precautions
2.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
50XP37
–5–
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
50XP37
–6–
4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol stamped on the back of PCB.
Caution
·
Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
·
Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
·
After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
50XP37
–7–
5 PCB Structure sheet of GPH D2 chassis
Board Name Function Remarks
DDigital Signal Processor 1
JSlot Interface & SYNC processor 1
ZAudio out, DC-DC converter
SS Sustain Out 1
SC Scan out 1
SU Scan connection (Upper) 1
SD Scan connection (Lower) 1
C1 Data Drive (Upper Right)
C2 Data Drive (Upper Center)
C3 Data Drive (Upper Left)
C4 Data Drive (Lower Left)
C5 Data Drive (Lower Center)
C6 Data Drive (Lower Right)
H3 Speaker terminal
S1 Power switch
SS2 Sustain connection (Upper)
SS3 Sustain connection (Lower)
V1 Front SW. & Remote receiver
PF Line filter 1
PPower supply 1
HX PC_type_Input terminal
HZ (RTB033) RCA Component Video terminal
HV (RTB031) RCA Composite Video terminal
HT (RTB032) 21 Pin Scart terminal
Remarks
1. Recommend PCB´s for initial service for GPH6D2 chassis.
50XP37
–8–
Service Hint
SS3
50XP37
–9–
7 Location of Lead Wiring
50XP37
–10–
8.1. Driver Set-up
8.1.1. Item / Preparation
1. Input an APL 100 % white signal.
2. Set the picture controls: -
Picture mode: Normal
White balance: Cool
Aspect: 16:9
8.1.2. Adjustments
Adjust driver section voltages referring the panel data on the
panel data label.
Name Test Point Voltage Volume Remarks
Vsus TPVSUS
(SS) Vsus* ± 2V R641 (P) GND =
chassis
Vbk TPVBK (SC) 140V ± 1V R6670 (SC) GND =
chassis
Vad TPVAD (SC) -85V ± 1V R6477 (SC) GND =
chassis
Ve TPVE (SS) Ve* ± 1V R6770 (SS) GND =
chassis
Vda TPVDA (SS) 75V ± 1V R665 (P) GND =
chassis
Vlow anode of
D540 (P) 78V ± 0.1V R661 (P) GND =
chassis
PFC PR401 395V ± 0.5V R443(P) Hot=PR401,
Cold= W14
(wire)
*See the Panel label.
8 Adjustment Procedure
50XP37
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3
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