Toshiba 50XP37C Bedienungsanleitung

SERVICE MANUAL

Plasma Display

50XP37C

50XP37E

50XP37F

50XP37H

FILE NO. 010-200328

Mar. 2004 (YC)

– 2 –

1 Applicable signals 3

2 Safety Precautions 4

2.1. General Guidelines 4

3 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices 5

4 About lead free solder (PbF) 6

5 PCB Structure sheet of GPH D2 chassis 7

Service Hint 8

7 Location of Lead Wiring 9

8 Adjustment Procedure 10

8.1. Driver Set-up 10

8.2. Initialization Pulse Adjust 11

8.3. P.C.B. (Printed Circuit Board) exchange 12

8.4. Adjustment Volume Location 13

8.5. Test Point Location 13

9 Service mode 13

9.1. CAT (computer Aided Test) mode 13

9.2. IIC mode structure (following items value is sample data.)

10 Alignment 16

10.1. 625i/625p panel white balance 16

10.2. PC/RGB panel white balance 18

10.3. HD panel white balance 19

11 Trouble shooting guide 20

11.1. Self Check 20

11.2. No Power (Power shut down) 20

11.3. No Picture 21

11.4. Local screen failure 22

12 Conductor Views 23

12.1. PF-Board 23

12.2. P-Board 25

12.3. HX-Board 28

12.4. HV-Board 29

12.5. HZ-Board 30

12.6. HT-Board 31

12.7. J-Board 32

12.8. D-Board 34

12.9. C1-Board 37

12.10. C2-Board 38

12.11. C3-Board 39

12.12. C4-Board 40

12.13. C5-Board 41

12.14. C6-Board 42

12.15. SC-Board 43

12.16. SU-Board 45

12.17. SD-Board 47

12.18. SS, SS2 and SS3-Board 48

12.19. Z-Board 50

12.20. V1, S1 and H3-Board 51

CONTENTS

Page Page

50XP37

13 Replacementpanelhandlingprecautionsandreplacement

procedure 55

14 PartsLocation 57

15Chassis and Cabinet Replacement Parts List 59

16Specifications END

Appendix

Block and Schematic Diagrams

–3–

1 Applicable signals

50XP37

–4–

2.1.1. Leakage Current Cold Check

1. Unplug the AC cord and connect a jumper between the two

prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between

the jumpered AC plug and each exposed metallic cabinet

part on the equipment such as screwheads, connectors,

control shafts, etc. When the exposed metallic part has a

return path to the chassis, the reading should be between

1MWand 5.2MW.

When the exposed metal does not have a return path to

the chassis, the reading must be .

Figure 1

2.1.2. Leakage Current Hot Check (See

Figure 1.)

1. Plug the AC cord directly into the AC outlet. Do not use an

isolation transformer for this check.

2. Connect a 1.5kW, 10 watts resistor, in parallel with a 0.15µF

capacitors, between each exposed metallic part on the set

and a good earth ground such as a water pipe, as shown in

Figure 1.

3. Use an AC voltmeter, with 1000 ohms/volt or more

sensitivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the

voltage at each point.

5. Reverse the AC plug in the AC outlet and repeat each of the

above measurements.

6. The potential at any point should not exceed 0.75 volts

RMS. A leakage current tester (Simpson Model 229 or

equivalent) may be used to make the hot checks, leakage

current must not exceed 1/2 milliamp. In case a

measurement is outside of the limits specified, there is a

possibility of a shock hazard, and the equipment should be

repaired and rechecked before it is returned to the

customer.

2 Safety Precautions

2.1. General Guidelines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

50XP37

–5–

3 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called

Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and

semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage

caused by electro static discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,

which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum

foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can

generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable

conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing

together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to

damage an ES device).

50XP37

–6–

4 About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements.

In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.

The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).

That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d

suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol stamped on the back of PCB.

Caution

Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.

Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb

solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto

the opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.

However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

50XP37

–7–

5 PCB Structure sheet of GPH D2 chassis

Board Name Function Remarks

DDigital Signal Processor 1

JSlot Interface & SYNC processor 1

ZAudio out, DC-DC converter

SS Sustain Out 1

SC Scan out 1

SU Scan connection (Upper) 1

SD Scan connection (Lower) 1

C1 Data Drive (Upper Right)

C2 Data Drive (Upper Center)

C3 Data Drive (Upper Left)

C4 Data Drive (Lower Left)

C5 Data Drive (Lower Center)

C6 Data Drive (Lower Right)

H3 Speaker terminal

S1 Power switch

SS2 Sustain connection (Upper)

SS3 Sustain connection (Lower)

V1 Front SW. & Remote receiver

PF Line filter 1

PPower supply 1

HX PC_type_Input terminal

HZ (RTB033) RCA Component Video terminal

HV (RTB031) RCA Composite Video terminal

HT (RTB032) 21 Pin Scart terminal

Remarks

1. Recommend PCB´s for initial service for GPH6D2 chassis.

50XP37

–8–

Service Hint

SS3

50XP37

–9–

7 Location of Lead Wiring

50XP37

–10–

8.1. Driver Set-up

8.1.1. Item / Preparation

1. Input an APL 100 % white signal.

2. Set the picture controls: -

Picture mode: Normal

White balance: Cool

Aspect: 16:9

8.1.2. Adjustments

Adjust driver section voltages referring the panel data on the

panel data label.

Name Test Point Voltage Volume Remarks

Vsus TPVSUS

(SS) Vsus* ± 2V R641 (P) GND =

chassis

Vbk TPVBK (SC) 140V ± 1V R6670 (SC) GND =

chassis

Vad TPVAD (SC) -85V ± 1V R6477 (SC) GND =

chassis

Ve TPVE (SS) Ve* ± 1V R6770 (SS) GND =

chassis

Vda TPVDA (SS) 75V ± 1V R665 (P) GND =

chassis

Vlow anode of

D540 (P) 78V ± 0.1V R661 (P) GND =

chassis

PFC PR401 395V ± 0.5V R443(P) Hot=PR401,

Cold= W14

(wire)

*See the Panel label.

8 Adjustment Procedure

50XP37

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