Toshiba TDP-ST20E Bedienungsanleitung

SERVICE MANUAL

FILE NO. 330-200712GR

DLP PROJECTOR

The above models are classified as green product (s) (*1), as indicated by the underlined serial number (s).

This Service Manual describes replacement parts for green product (s). When repairing any green product (s), use

the parts described in this manual and lead-free solder (*2).

For (*1) and (*2) , see the next page.

Published in Japan, August 2007 GREEN© TOSHIBA CORPORATION

TDP-ST20E,TDP-ST20B

Rev.01

(*1) GREEN PRODUCT PROCUREMENT

The EC is actively promoting the WEEE & RoHS Directives that define standards for recycling

and reuse of Waste Electrical and Electronic Equipment and for the Restriction of the use of

certain Hazardous Substances. From July 1, 2006, the RoHS Directive will prohibit any

marketing of new products containing the restricted substances.

Increasing attention is given to issues related to the global environmental. Toshiba Corporation

recognizes environmental protection as a key management tasks, and is doing its utmost to

enhance and improve the quality and scope of its environmental activities. In line with this,

Toshiba proactively promotes Green Procurement, and seeks to purchase and use products,

parts and materials that have low environmental impacts.

Green procurement of parts is not only confined to manufacture. The same green parts used in

manufacture must also be used as replacement parts.

(*2) LEAD-FREE SOLDER

This product is manufactured using lead-free solder as a part of a movement within the consumer

products industry at large to be environmentally responsible. Lead-free solder must be used in

the servicing and repair of this product.

WARNING

This product is manufactured using lead free solder.

DO NOT USE LEAD BASED SOLDER TO REPAIR THIS PRODUCT !

The melting temperature of lead-free solder is higher than that of leaded solder by 86°F to 104°F

(30°C to 40°C). Use of a soldering iron designed for lead-based solders to repair product made

with lead-free solder may result in damage to the component and or PCB being soldered. Great

care should be made to ensure high-quality soldering when servicing this product ⎯especially

when soldering large components, through-hole pins, and on PCBs ⎯as the level of heat

required to melt lead-free solder is high.

Table of Contents

Chapter 1 1-1

Specifications 1-1

Using the Menus 1-3

Names of the Terminals on the Rear Panel 1-4

Name of each part on the main unit 1-5

Name of each part on the control panel and remote control 1-6

List of Supported Signals 1-7

Chapter 2 2-1

Replaceable Part Hierarchy 2-1

Required Tools 2-2

Parts Replacement 2-3

Chapter 3 3-1

SINGOWS 2000 3-1

Chapter 4 4-1

Firmware Upgrade 4-1

Chapter 5 5-1

Wiring Diagram 5-1

Block Diagram 5-2

Chapter 6 6-1

LED Display 6-1

Troubleshooting 6-2

Operation of Power Supply 6-9

Chapter 7 7-1

Electrical adjustment 7- 1

Chapter 8 8-1

Functional Test 8-1

Chapter 9 9-1

Exploded view 9-1

Otherparts 9-3

Spare Parts List 9-4

ontents

1-1

Chapter 1

Specifications

Chapter 1

1-2

Specifications (Continued)

Chapter 1

Cha

ter 1

1-3

Using the Menus

Cha

ter 1

1-4

Names of the Terminals on the Rear Panel

Cha

ter 1

1-5

Names of each part on the main unit

1-6

Cha

ter 1

Names of each part on the control panel and remote control

1-7

Cha

ter 1

List of Supported Signals

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