TQ MB-COME6-4 Bedienungsanleitung

MB-COME6-4

User's Manual

MB-COME6-4 UM 0100

15.03.2022

TABLE OF CONTENTS

1. ABOUT THIS MANUAL.................................................................................................................................................................1

1.1 Copyright and Licence Expenses.............................................................................................................................................1

1.2 Registered Trademarks...............................................................................................................................................................1

1.3 Disclaimer .......................................................................................................................................................................................1

1.4 Imprint .............................................................................................................................................................................................1

1.5 Service and Support ....................................................................................................................................................................1

1.6 Tips on Safety.................................................................................................................................................................................2

1.7 Symbols and Typographic Conventions ...............................................................................................................................2

1.8 Handling and ESD Tips................................................................................................................................................................2

1.9 Naming of Signals ........................................................................................................................................................................3

1.10 Further Applicable Documents / Presumed Knowledge .................................................................................................3

2. INTRODUCTION.............................................................................................................................................................................4

2.1 Functional Overview ...................................................................................................................................................................4

2.2 Specification Compliance ..........................................................................................................................................................5

2.3 Carrier Board Standard Configurations .................................................................................................................................5

2.4 Accessories .....................................................................................................................................................................................5

3. FUNCTION.......................................................................................................................................................................................6

3.1 Block Diagram ...............................................................................................................................................................................6

3.2 Electrical Specification................................................................................................................................................................7

3.2.1 Supply Voltage Characteristics.................................................................................................................................................7

3.2.2 Power Consumption Specification .........................................................................................................................................7

3.3 Environmental Specification.....................................................................................................................................................7

3.4 System Components...................................................................................................................................................................7

3.4.1 Gigabit Ethernet Controller.......................................................................................................................................................7

3.4.2 HD-Audio Controller....................................................................................................................................................................7

3.5 Connectors and Interfaces.........................................................................................................................................................8

3.5.1 Power Supply.............................................................................................................................................................................. 10

3.5.2 DisplayPort .................................................................................................................................................................................. 10

3.5.3 USB Host Interfaces................................................................................................................................................................... 11

3.5.4 Gigabit Ethernet......................................................................................................................................................................... 11

3.5.5 Serial Interface (RS-232)........................................................................................................................................................... 12

3.5.6 Embedded Display Port........................................................................................................................................................... 13

3.5.7 LVDS .............................................................................................................................................................................................. 14

3.5.8 M.2 socket with M Key (for PCIe SSD devices) .................................................................................................................. 15

3.5.9 M.2 socket with M Key (for PCIe SSD devices) .................................................................................................................. 15

3.5.10 M.2 socket with B Key (for WWAN modules or SATA SSD devices)............................................................................ 15

3.5.11 M.2 socket with E Key (for I/O devices)............................................................................................................................... 15

3.5.12 SATA Interfaces .......................................................................................................................................................................... 16

3.5.13 Audio............................................................................................................................................................................................. 16

3.5.14 Fan Connector............................................................................................................................................................................ 16

3.5.15 PCI Express Connector............................................................................................................................................................. 16

3.5.16 Feature Connector .................................................................................................................................................................... 17

3.5.17 Debug LEDs................................................................................................................................................................................. 18

3.5.18 SPI Flash Socket.......................................................................................................................................................................... 18

3.5.19 COM Express™ Connector....................................................................................................................................................... 18

3.6 Buttons ......................................................................................................................................................................................... 18

3.6.1 Reset Button................................................................................................................................................................................ 18

3.6.2 Power Button.............................................................................................................................................................................. 18

4. MECHANICS................................................................................................................................................................................. 19

4.1 Dimensions.................................................................................................................................................................................. 19

4.2 Protection Against External Effects...................................................................................................................................... 19

4.3 Labeling........................................................................................................................................................................................ 20

5. SOFTWARE................................................................................................................................................................................... 21

5.1 System Resources...................................................................................................................................................................... 21

5.1.1 I2C Bus ........................................................................................................................................................................................... 21

5.1.2 SMBus............................................................................................................................................................................................ 21

5.2 Driver Download........................................................................................................................................................................ 21

6. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS .......................................................................................... 22

6.1 EMC................................................................................................................................................................................................ 22

6.2 ESD................................................................................................................................................................................................. 22

6.3 Operational Safety and Personal Security ......................................................................................................................... 22

6.4 Reliability and Service Life ...................................................................................................................................................... 22

6.4.1 RoHS .............................................................................................................................................................................................. 22

6.5 WEEE®............................................................................................................................................................................................ 22

6.6 REACH®......................................................................................................................................................................................... 22

6.7 EuP ................................................................................................................................................................................................. 22

6.8 Battery........................................................................................................................................................................................... 22

6.9 Packaging .................................................................................................................................................................................... 22

6.10 Other Entries ............................................................................................................................................................................... 23

7. APPENDIX..................................................................................................................................................................................... 24

7.1 Acronyms and Definitions ...................................................................................................................................................... 24

7.2 References ................................................................................................................................................................................... 26

TABLE DIRECTORY

Table 1: Terms and Conventions .............................................................................................................................................................2

Table 2: Power-In Connector.................................................................................................................................................................. 10

Table 3: USB 2.0 Host Extension Connectors .................................................................................................................................... 11

Table 4: Ethernet LEDs ............................................................................................................................................................................. 11

Table 5: Serial Port COM Express™ Port Mapping............................................................................................................................ 12

Table 6: Serial Port RS-232 pinout via cable to 9-pin D-Sub......................................................................................................... 12

Table 7: eDP Connector ........................................................................................................................................................................... 13

Table 8: LVDS Connector......................................................................................................................................................................... 14

Table 9: Backlight Connector................................................................................................................................................................. 15

Table 10: Fan Connector............................................................................................................................................................................ 16

Table 11: GPIO and COME Signal Connector X20 .............................................................................................................................. 17

Table 12: I2C and COME Signal Connector X21................................................................................................................................... 17

Table 13: Debug LEDs................................................................................................................................................................................. 18

Table 14: Labels on MB-COME6-4 ........................................................................................................................................................... 20

Table 15: I2C Address Mapping................................................................................................................................................................ 21

Table 16: Acronyms..................................................................................................................................................................................... 24

Table 17: Further Applicable Documents and Links ......................................................................................................................... 26

FIGURE DIRECTORY

Figure 1: MB-COME6-4 Block Diagram ....................................................................................................................................................6

Figure 2:MB-COME6-4 Top view...............................................................................................................................................................8

Figure 3:MB-COME6-4 Bottom view.......................................................................................................................................................9

Figure 4:RJ45 Connectors ........................................................................................................................................................................ 11

Figure 5:10-pin RS232 Connector ......................................................................................................................................................... 12

Figure 6:eDP Connector ........................................................................................................................................................................... 13

Figure 7:Config Switch: eDP / LVDS...................................................................................................................................................... 13

Figure 8:LVDS Connector......................................................................................................................................................................... 14

Figure 9: Backlight Connector................................................................................................................................................................. 15

Figure 10:Audio Connectors X12, X13, X14 .......................................................................................................................................... 16

Figure 11:Fan Connector............................................................................................................................................................................ 16

Figure 12:Feature Connectors .................................................................................................................................................................. 17

Figure 13:SPI socket and BIOS_DIS1# Jumper..................................................................................................................................... 18

Figure 14:MB-COME6-4 Dimensions....................................................................................................................................................... 19

Figure 15: Position of labels........................................................................................................................................................................ 20

REVISION HISTORY

Rev. Date Name Pos. Modification

0100 15.03.2022 Probst First edition

ABOUT THIS MANUAL

1.1

This User's Manual may not be copied, reproduced, translated, changed or distributed, completely or partially

in electronic, machine readable, or in any other form without the written consent of TQ-Systems GmbH.

The drivers and utilities for the components used as well as the BIOS are subject to the copyrights of the respective

manufacturers. The licence conditions of the respective manufacturer are to be adhered to.

BIOS-licence expenses are paid by TQ-Systems GmbH and are included in the price.

Licence expenses for the operating system and applications are not taken into consideration and must be calculated / declared

separately.

1.2

Registered Trademarks

TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original

or license-free graphics and texts.

All brand names and trademarks mentioned in this User's Manual, including those protected by a third party, unless specified

otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the present

registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by a third

party.

1.3

Disclaimer

TQ-Systems GmbH does not guarantee that the information in this User's Manual is up-to-date, correct, complete or of good

quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQ-Systems

GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information given in this

User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven intentional

or negligent fault of TQ-Systems GmbH.

TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this User's Manual or parts of it without

special notification.

1.4

Imprint

TQ-Systems GmbH

Gut Delling, Mühlstraße 2

D-82229 Seefeld

Tel: +49 8153 9308–0

Fax: +49 8153 9308–4223

E-Mail: Info@TQ-Group

Web: TQ-Group

1.5

Service and Support

Please visit our website www.tq-group.com for latest product documentation, drivers, utilities and technical support.

You can register on our website www.tq-group.com to have access to restricted information and automatic update services.

For direct technical support you can contact our FAE team by email: support@tq-group.com.

Our FAE team can also support you with additional information like 3D-STEP files and confidential information, which is not

provided on our public website.

For service/RMA, please contact our service team by email (service@tq-group.com) or your sales team at TQ.

1.6

Tips on Safety

Improper or incorrect handling of the product can substantially reduce its life span.

1.7

Symbols and Typographic Conventions

Table 1: Terms and Conventions

Symbol Meaning

This symbol represents the handling of electrostatic-sensitive modules and / or components. These

components are often damaged / destroyed by the transmission of a voltage higher than about 50 V.

A human body usually only experiences electrostatic discharges above approximately 3,000 V.

This symbol indicates the possible use of voltages higher than 24 V.

Please note the relevant statutory regulations in this regard.

Non-compliance with these regulations can lead to serious damage to your health and also cause

damage / destruction of the component.

This symbol indicates a possible source of danger. Acting against the procedure described can lead to

possible damage to your health and / or cause damage / destruction of the material used.

This symbol represents important details or aspects for working with TQ-products.

Command

A font with fixed width denotes commands, contents, file names, or menu items.

1.8

Handling and ESD Tips

General handling of your TQ-products

The TQ-product may only be used and serviced by certified personnel who have taken note of the

information, the safety regulations in this document and all related rules and regulations.

A general rule is: do not touch the TQ-product during operation. This is especially important when

switching on, changing jumper settings or connecting other devices without ensuring beforehand

that the power supply of the system has been switched off.

Violation of this guideline may result in damage / destruction of the MB-COME6-4 module and be

dangerous to your health.

Improper handling of your TQ-product would render the guarantee invalid.

Proper ESD handling

The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).

Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-

product in an ESD-safe environment. Especially when you switch modules on, change jumper settings,

or connect other devices.

1.9

Naming of Signals

A hash mark (#) at the end of the signal name indicates a low-active signal.

Example: RESET#

If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with

a hash mark and shown at the end.

Example: C / D#

If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring.

The identification of the individual functions follows the above conventions.

Example: WE2# / OE#

1.10

Further Applicable Documents / Presumed Knowledge

•

Specifications and manual of the modules used:

These documents describe the service, functionality and special characteristics of the module used.

•

Specifications of the components used:

The manufacturer's specifications of the components used, for example CompactFlash cards, are to be taken note of.

They contain, if applicable, additional information that must be taken note of for safe and reliable operation.

These documents are stored at TQ-Systems GmbH.

•

Chip errata:

It is the user's responsibility to make sure all errata published by the manufacturer of each component are taken note of.

The manufacturer’s advice should be followed.

•

Software behaviour:

No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.

•

General expertise:

Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.

Implementation information for the carrier board design is provided in the COM Express™ Design Guide (2) maintained by the

PICMG®. This Carrier Design Guide includes a very good guideline to design a COM Express™ carrier board.

It includes detailed information with schematics and detailed layout guidelines.

Please refer to the official PICMG®documentation for additional information (1), (2).

INTRODUCTION

The COM Express™ mainboard MB-COME6-4 is a carrier board for COM Express™ modules with Type 6 pinout.

It can be used for panel PCs, embedded computers or as an evaluation platform for COM Express™ modules.

In combination with a standard COM Express™ module it forms a very compact hardware kit that can be used for a freely scalable

embedded PC platform. Because of this – with uniform interfaces and dimensions – the PC system can be easily adapted to suit

the requirements of the application. The wide range of extension options and storage media, which can be added, offer a high

level of flexibility and allow functionalities and performance to be extended easily, quickly and inexpensively.

Typical usage is in embedded server applications, PC systems for automation, visualisation and monitoring and all applications

that place high demands on quality, durability and long-term availability.

2.1

Functional Overview

The following key functions are implemented on the MB-COME6-4:

Supported Modules:

•COM Express™ Compact / Basic Modules with Type 6 pinout (COM.0 R3.0)

External Interfaces:

•2 x 2.5 Gigabit Ethernet

•2 x USB 3.2 Gen 2 Type A connector with USB 3.0 compatibility

•1 x USB 3.2 Gen 2 Type C connector with USB 3.0 compatibility

•3 x DisplayPort (DP++) connectors

•3 x Audio (headphone out, microphone in and line in)

•Power Button / Reset

Internal Interfaces:

•1 x LVDS and eDP connector

•1 x Backlight power connector

•3 x USB 2.0 on board header

•1 x M.2 socket with B Key USB 2.0 and SATA (with micro SIM Card support e.g. for WWAN/LTE or SATA SSDs)

•1 x M.2 socket with E Key USB 2.0 and PCIe x1 ( for WLAN / Bluetooth cards)

•1 x M.2 socket with M Key PCIe x4 (for SSDs)

•1 x M.2 socket with M Key PCIe x2 (for SSDs)

•1 x SATA connector

•2 x Serial ports with RS-232 transceivers

•1 x PEG Port to support standard PCIe add in cards with up to 16 lanes

•2 x GPIO / I2C / MISC connectors

Power supply:

•Voltage: 12 V DC ±5 %

Environment:

•Extended temperature: –20 °C to +85 °C

Form factor / dimensions:

•170 mm × 170 mm (Mini ITX)

2.2

Specification Compliance

The MB-COME6-4 supports Compact or Basic modules compliant to the PICMG®COM Express™ Module Base Specification

(COM.0 R3.0) with Type 6 pinout.

2.3

Carrier Board Standard Configurations

•

MB-COME6-4-AA

COM Express™ Type 6 pinout Carrier full-featured

Other configurations are available on request.

2.4

Accessories

•

DK-USB-TYPA-MOL5

Adapter cable from internal USB connector to A-Type receptacle, 150 mm long

•

DK-RS232-9POL-DSUB-PICOBLADE

Adapter cable from internal connector to 9-pin D-Sub male connector, 150 mm long

•

Battery CR2032 lithium coin cell

•

Meanwell 180W 12V Power Supply GST220A12-R7B

Please contact support@tq-group.com for details about Display Port cables and Display Port to DVI/HDMI adapters.

FUNCTION

3.1

Block Diagram

The following illustration shows the block diagram of the MB-COME6-4:

Figure 1: MB-COME6-4 Block Diagram

3.2

Electrical Specification

3.2.1 Supply Voltage Characteristics

The MB-COME6-4 requires an input voltage of 12 V DC ±5 %.

The input voltages shall rise from 10 % of nominal to 90 % of nominal within 0.1 ms to 20 ms (0.1 ms ≤ Rise Time ≤ 20 ms).

There must be a smooth and continuous increase of each DC output voltage from 10 % to 90 % of its final set point within

the regulation range.

3.2.2 Power Consumption Specification

The power consumption of the system significantly depends on the connected devices; e.g. COM Express™ module, mass storage

devices, USB devices, display backlight, etc.

The power consumption of the MB-COME6-4 itself is approximately 2 W (COM Express™ module supplied externally);

UEFI-shell active; no keyboard, no mouse, no mass storage device, no Ethernet cable etc. connected).

Note: Power requirement

The MB-COME6-4 input current is not fused. The user has to ensure that the input current does not exceed the

maximum current of 25 A (300 W)

Additionally the power supply must be configured with enough reserve. It should be calculated with the

maximum power consumption of all connected components.

3.3

Environmental Specification

•Operating temperature, extended: –20 °C to +85 °C

•Storage temperature: –40 °C to +85 °C

•Relative humidity (operating / storage): 10 % to 90 % (not condensing)

3.4

System Components

3.4.1 Gigabit Ethernet Controller

The MB-COME6-4 provides an Intel®i225IT Ethernet controller with 10/100/1000/2500 Mbps speed (802.3 specification) and

IEEE1588 support.

Please contact support@tq-group.com for further information about the IEEE1588 support.

3.4.2 HD-Audio Controller

The MB-COME6-4 provides a Cirrus Logic CS4207 High Definition Audio Codec with a headphone output a line in input a

microphone input.

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