TQ TQM E40S Series Bedienungsanleitung

TQMxE40S

User's Manual

TQMxE40S UM 0101

30.06.2022

TABLE OF CONTENTS

1. ABOUT THIS MANUAL................................................................................................................................................................................1

1.1 Copyright and Licence Expenses............................................................................................................................................................1

1.2 Registered Trademarks..............................................................................................................................................................................1

1.3 Disclaimer......................................................................................................................................................................................................1

1.4 Imprint............................................................................................................................................................................................................1

1.5 Service and Support...................................................................................................................................................................................1

1.6 Tips on Safety ...............................................................................................................................................................................................2

1.7 Symbols and Typographic Conventions..............................................................................................................................................2

1.8 Handling and ESD Tips ..............................................................................................................................................................................2

1.9 Naming of Signals .......................................................................................................................................................................................3

1.10 Further Applicable Documents / Presumed Knowledge................................................................................................................3

2. INTRODUCTION............................................................................................................................................................................................4

2.1 Functional Overview ..................................................................................................................................................................................4

2.2 SMARC Specification Compliance..........................................................................................................................................................5

2.3 TQMxE40S Variants.....................................................................................................................................................................................5

2.4 Accessories....................................................................................................................................................................................................5

3. FUNCTION......................................................................................................................................................................................................6

3.1 TQMxE40S Block Diagram ........................................................................................................................................................................6

3.2 Electrical Characteristics............................................................................................................................................................................6

3.2.1 Supply Voltage.............................................................................................................................................................................................6

3.2.2 Power Consumption ..................................................................................................................................................................................7

3.2.2.1 Real Time Clock Power Consumption...................................................................................................................................................8

3.3 Environmental conditions........................................................................................................................................................................8

3.4 System Components..................................................................................................................................................................................9

3.4.1 CPUs ................................................................................................................................................................................................................9

3.4.2 Graphics .........................................................................................................................................................................................................9

3.4.3 Memory....................................................................................................................................................................................................... 10

3.4.3.1 LPDDR4 SDRAM........................................................................................................................................................................................ 10

3.4.3.2 eMMC........................................................................................................................................................................................................... 10

3.4.3.3 SPI Boot Flash ............................................................................................................................................................................................ 10

3.4.3.4 EEPROM....................................................................................................................................................................................................... 10

3.4.4 Real Time Clock......................................................................................................................................................................................... 10

3.4.5 Trusted Platform Module....................................................................................................................................................................... 10

3.4.6 TQ flexible I/O configuration (TQ-flexiCFG) ..................................................................................................................................... 11

3.5 Interfaces .................................................................................................................................................................................................... 11

3.5.1 PCI Express ................................................................................................................................................................................................. 11

3.5.2 Gigabit Ethernet ....................................................................................................................................................................................... 11

3.5.3 Serial ATA.................................................................................................................................................................................................... 11

3.5.4 Digital Display Interface......................................................................................................................................................................... 11

3.5.5 LVDS Interface........................................................................................................................................................................................... 12

3.5.6 USB 2.0 Interfaces..................................................................................................................................................................................... 12

3.5.7 USB 3.0 Interfaces..................................................................................................................................................................................... 12

3.5.8 SD Card Interface...................................................................................................................................................................................... 12

3.5.9 General Purpose Input/Output............................................................................................................................................................ 12

3.5.10 Audio Interfaces........................................................................................................................................................................................ 12

3.5.11 CAN interfaces........................................................................................................................................................................................... 12

3.5.12 I2C Bus .......................................................................................................................................................................................................... 13

3.5.13 SMBus / Power Management I2C Bus................................................................................................................................................. 13

3.5.14 Serial Peripheral Interface...................................................................................................................................................................... 13

3.5.15 eSPI ............................................................................................................................................................................................................... 13

3.5.16 Serial Ports.................................................................................................................................................................................................. 13

3.5.17 Watchdog Timer....................................................................................................................................................................................... 13

3.6 Connectors & LEDs................................................................................................................................................................................... 13

3.6.1 SMARC Connector.................................................................................................................................................................................... 13

3.6.2 Debug LED.................................................................................................................................................................................................. 14

3.7 SMARC Connector Pinout...................................................................................................................................................................... 14

3.7.1 Signal Assignment Abbreviations....................................................................................................................................................... 14

3.7.2 SMARC Connector Pin Assignment .................................................................................................................................................... 15

4. MECHANICS................................................................................................................................................................................................ 21

4.1 TQMxE40S Dimensions........................................................................................................................................................................... 21

4.2 Heat Spreader Dimensions.................................................................................................................................................................... 22

4.3 Mechanical and Thermal Considerations ......................................................................................................................................... 23

4.4 Protection against external effects..................................................................................................................................................... 23

4.5 Label placement....................................................................................................................................................................................... 23

5. SOFTWARE.................................................................................................................................................................................................. 24

5.1 System Resources..................................................................................................................................................................................... 24

5.1.1 I2C Bus .......................................................................................................................................................................................................... 24

5.1.2 SMBus .......................................................................................................................................................................................................... 24

5.1.3 Memory Map.............................................................................................................................................................................................. 24

5.1.4 IRQ Map....................................................................................................................................................................................................... 24

5.2 Operating Systems................................................................................................................................................................................... 25

5.2.1 Supported Operating Systems............................................................................................................................................................. 25

5.2.2 Driver Download ...................................................................................................................................................................................... 25

5.3 TQ-Systems Embedded Application Programming Interface (EAPI)........................................................................................ 25

5.4 Software Tools........................................................................................................................................................................................... 25

6. BIOS .............................................................................................................................................................................................................. 26

6.1 Continue Boot Process ........................................................................................................................................................................... 26

6.2 Boot Manager............................................................................................................................................................................................ 26

6.3 Device Manager........................................................................................................................................................................................ 27

6.3.1 Driver Health Manager ........................................................................................................................................................................... 27

6.3.2 Network Device List................................................................................................................................................................................. 27

6.4 Boot From File ........................................................................................................................................................................................... 27

6.5 Administer Secure Boot.......................................................................................................................................................................... 27

6.6 Setup Utility ............................................................................................................................................................................................... 28

6.6.1 Main.............................................................................................................................................................................................................. 28

6.6.2 Advanced.................................................................................................................................................................................................... 28

6.6.2.1 Boot Configuration .................................................................................................................................................................................. 29

6.6.2.2 USB Configuration ................................................................................................................................................................................... 29

6.6.2.3 Chipset Configuration............................................................................................................................................................................. 29

6.6.2.4 ACPI Table/Features Control................................................................................................................................................................. 29

6.6.2.5 RC Advanced Menu ................................................................................................................................................................................. 30

6.6.2.6 SIO TQMx86................................................................................................................................................................................................ 42

6.6.2.7 Console Redirection ................................................................................................................................................................................ 43

6.6.2.8H2OUVE Configuration........................................................................................................................................................................... 44

6.6.2.9 SIO F81214E ............................................................................................................................................................................................... 44

6.6.2.10 NVM Express Information...................................................................................................................................................................... 44

6.6.3 Security........................................................................................................................................................................................................ 44

6.6.4 Power ........................................................................................................................................................................................................... 44

6.6.4.1 CPU Configuration................................................................................................................................................................................... 45

6.6.5 Boot .............................................................................................................................................................................................................. 46

6.6.6 Exit ................................................................................................................................................................................................................ 47

6.7 BIOS Update............................................................................................................................................................................................... 47

6.7.1 Step 1: Preparing USB Stick................................................................................................................................................................... 47

6.7.2 Step 2: Preparing Management Engine (ME) FW for update...................................................................................................... 48

6.7.3 Step 3a: Updating uEFI BIOS via EFI Shell......................................................................................................................................... 49

6.7.4 Step 2b: Updating uEFI BIOS via Windows Operating System................................................................................................... 50

6.7.5 Step 3: BIOS update check on the TQMxE40S Module ................................................................................................................. 51

7. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS......................................................................................................... 52

7.1 EMC............................................................................................................................................................................................................... 52

7.2 ESD................................................................................................................................................................................................................ 52

7.3 Shock & Vibration..................................................................................................................................................................................... 52

7.4 Operational Safety and Personal Security ........................................................................................................................................ 52

7.5 Reliability and Service Life..................................................................................................................................................................... 52

8. ENVIRONMENT PROTECTION................................................................................................................................................................ 53

8.1 RoHS ............................................................................................................................................................................................................. 53

8.2 WEEE®.......................................................................................................................................................................................................... 53

8.3 REACH®........................................................................................................................................................................................................ 53

8.4 EuP ................................................................................................................................................................................................................ 53

8.5 Battery.......................................................................................................................................................................................................... 53

8.6 Packaging ................................................................................................................................................................................................... 53

8.7 Other Entries.............................................................................................................................................................................................. 53

9. APPENDIX ................................................................................................................................................................................................... 54

9.1 Acronyms and Definitions..................................................................................................................................................................... 54

9.2 References.................................................................................................................................................................................................. 56

TABLE DIRECTORY

Table 1: Terms and Conventions ............................................................................................................................................................................2

Table 2: TQMxE40S Power Consumption ............................................................................................................................................................7

Table 3: RTC Current Consumption .......................................................................................................................................................................8

Table 4: Intel®X6000E Series: Comparison of the SKUs...................................................................................................................................9

Table 5: Maximum Resolution.............................................................................................................................................................................. 10

Table 6: PCI Express Configuration Options..................................................................................................................................................... 11

Table 7: LED Boot Messages.................................................................................................................................................................................. 14

Table 8: Abbreviations used.................................................................................................................................................................................. 14

Table 9: SMARC Connector Pin Assignment .................................................................................................................................................... 15

Table 10: I2C Address Mapping on GP I2C Port................................................................................................................................................... 24

Table 11: Acronyms.................................................................................................................................................................................................... 54

Table 12: Further Applicable Documents and Links........................................................................................................................................ 56

FIGURE DIRECTORY

Figure 1: Block Diagram TQMxE40S ........................................................................................................................................................................6

Figure 2: Three-sided drawing TQMxE40S (dimensions in mm) ................................................................................................................. 21

Figure 3: Bottom view drawing TQMxE40S........................................................................................................................................................ 21

Figure 4: Standard Heat Spreader TQMxE40S-HSP (dimensions in mm).................................................................................................. 22

Figure 5: InsydeH2O BIOS Front Page.................................................................................................................................................................. 26

Figure 6: RC Advanced Menu ................................................................................................................................................................................. 48

Figure 7: PCH-FW Configuration menu............................................................................................................................................................... 48

Figure 8: Firmware Update configuration menu.............................................................................................................................................. 48

Figure 9: ME FW Image Re-Flash option ............................................................................................................................................................. 49

Figure 10: EFI Shell ....................................................................................................................................................................................................... 49

Figure 11: EFI Shell uEFI BIOS Update .................................................................................................................................................................... 49

Figure 12: Screen during BIOS Update................................................................................................................................................................... 50

Figure 13: TQMxE40S Debug LED............................................................................................................................................................................ 51

Figure 14: EFI BIOS Main Menu................................................................................................................................................................................. 51

REVISION HISTORY

Rev. Date Name Pos. Modification

0100 29-10-2021 Kreuzer Initial release

0101 30-06-2022 Kreuzer Figure 1 Correction: Ethernet 1 PHY is connected to SGMII

ABOUT THIS MANUAL

1.1 Copyright and Licence Expenses

This User's Manual may not be copied, reproduced, translated, changed or distributed, completely or partially in electronic,

machine readable, or in any other form without the written consent of TQ-Systems GmbH.

The drivers and utilities for the components used as well as the BIOS are subject to the copyrights of the respective

manufacturers. The licence conditions of the respective manufacturer are to be adhered to.

BIOS-licence expenses are paid by TQ-Systems GmbH and are included in the price.

Licence expenses for the Operating System and applications are not taken into consideration and must be calculated / declared

separately.

1.2 Registered Trademarks

TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original

or license-free graphics and texts.

All brand names and trademarks mentioned in this User's Manual, including those protected by a third party, unless specified

otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the present

registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by a third

party.

1.3 Disclaimer

TQ-Systems GmbH does not guarantee that the information in this User's Manual is up-to-date, correct, complete or of good

quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQ-Systems

GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information given in this

User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven intentional

or negligent fault of TQ-Systems GmbH.

TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this User's Manual or parts of it without

special notification.

1.4 Imprint

TQ-Systems GmbH

Gut Delling, Mühlstraße 2

D-82229 Seefeld

Tel: +49 8153 9308–0

Fax: +49 8153 9308–4223

Email: info@tq-group.com

Web: www.tq-group.com/

1.5 Service and Support

Please visit our website www.tq-group.com for latest product documentation, drivers, utilities and technical support.

Through our website www.tq-group.com you could also get registered, to have access to restricted information and automatic

update services.

For direct technical support you could contact our FAE team by email: support@tq-group.com

Our FAE team can support you also with additional information like 3D-STEP files and confidential information which is not

provided on our public website.

For service / RMA, please contact our service team by email (service@tq-group.com) or your dedicated sales team at TQ.

1.6 Tips on Safety

Improper or incorrect handling of the product can substantially reduce its life span.

1.7 Symbols and Typographic Conventions

Table 1: Terms and Conventions

Symbol Meaning

This symbol represents the handling of electrostatic-sensitive modules and / or components. These

components are often damaged / destroyed by the transmission of a voltage higher than about 50 V.

A human body usually only experiences electrostatic discharges above approximately 3,000 V.

This symbol indicates the possible use of voltages higher than 24 V.

Please note the relevant statutory regulations in this regard.

Non-compliance with these regulations can lead to serious damage to your health and also cause

damage / destruction of the component.

This symbol indicates a possible source of danger. Acting against the procedure described can lead to

possible damage to your health and / or cause damage / destruction of the material used.

This symbol represents important details or aspects for working with TQ-products.

Command

A font with fixed-width is used to denote commands, contents, file names, or menu items.

1.8 Handling and ESD Tips

General handling of your TQ-products

The TQ-product may only be used and serviced by certified personnel who have taken note of the

information, the safety regulations in this document and all related rules and regulations.

A general rule is: do not touch the TQ-product during operation. This is especially important when

switching on, changing jumper settings or connecting other devices without ensuring beforehand

that the power supply of the system has been switched off.

Violation of this guideline may result in damage / destruction of the TQMxE40S and be dangerous to

your health.

Improper handling of your TQ-product would render the guarantee invalid.

Proper ESD handling

The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).

Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-

product in an ESD-safe environment. Especially when you switch modules on, change jumper settings,

or connect other devices.

1.9 Naming of Signals

A hash mark (#) at the end of the signal name indicates a low-active signal.

Example: RESET#

If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with

a hash mark and shown at the end.

Example: C / D#

If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring.

The identification of the individual functions follows the above conventions.

Example: WE2# / OE#

1.10 Further Applicable Documents / Presumed Knowledge

•

Specifications and manual of the modules used:

These documents describe the service, functionality and special characteristics of the module used.

•

Specifications of the components used:

The manufacturer's specifications of the components used, for example CompactFlash cards, are to be taken note of.

They contain, if applicable, additional information that must be taken note of for safe and reliable operation.

These documents are stored at TQ-Systems GmbH.

•

Chip errata:

It is the user's responsibility to make sure all errata published by the manufacturer of each component are taken note of.

The manufacturer’s advice should be followed.

•

Software behaviour:

No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.

•

General expertise:

Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.

Implementation information for the carrier board design is provided in the SMARC Design Guide (2) maintained by the SGET

(Standardization Group for Embedded Technologies). This Carrier Design Guide includes a very good guideline to design SMARC

carrier board.

It includes detailed information with schematics and detailed layout guidelines.

Please refer to the official SGET documentation for additional information (1).

INTRODUCTION

The TQ module TQMxE40S is based on the latest generation of Intel®Atom™, Pentium®and Celeron®CPUs (code name

“Elkhart Lake “). It achieves a new level of computing performance, security and media processing performance in a very

compact form factor to empower real-time computing, industrial automation, digital surveillance, aviation, medical, retail and

more.

The TQMxE40S corresponds to the internationally established SGET standard SMARC (V2.1). Six USB ports – including two USB

3.0 – and up to four PCIe lanes natively supported by the CPUs enable high bandwidth communication with peripherals and

additional interfaces on the carrier board. With the latest Intel®graphics processor integrated, the TQMxE40S delivers 4K high

resolution graphics output, immersive 3D processing and also greatly increased video encode and playback performance.

Time coordinated computing capabilities enable time synchronized processes within IoT networks and industrial control

applications. On-board eMMC and the option for LVDS or native eDP enable flexibility and reduce overall BOM cost.

The integrated TQMx86 board controller enables high flexibility through “flexiCFG“ and supports thermal management,

watchdog, 16550 compatible UARTs, I2C controllers, and GPIO handling. Combined with options like conformal coating and

optimized cooling solutions the TQMxE40S perfectly fits for mobile, low power, low profile and battery driven applications in

multiple vertical markets like industrial automation, medical devices, transportation and others.

2.1 Functional Overview

The following key functions are implemented on the TQMxE40S:

CPU:

•Intel®Atom®X6000E Series: „Elkhart Lake“ with different SKUs

•optimized for Embedded, Industrial Functional Safety or PC Client applications

Memory:

•LPDDR4/4x: 4 Gbyte, 8 Gbyte, 16 Gbyte with up to 4267MT/s and optional In Band ECC (IBECC)

•eMMC 5.1 on-board flash

•EEPROM: 32 kbit

Graphics:

•2 × Digital Display Interface (DDI) (DP 1.2/1.3/1.4, HDMI 1.4b/2.0b)

•1 × Embedded Digital Display Interface (eDDI) or LVDS interface (eDP 1.3 or LVDS)

Peripheral interfaces:

•2 × Gigabit Ethernet (Marvell 88E1512)

•1 × SATA 3.0 (up to 6 Gb/s), eSATA capable

•4 × PCIe Gen3 (up to 8 GT/s)

•2 × USB 3.2 (with up to 10Gb/s and USB 2.0 backward compatibility)

•6 × USB 2.0 (incl. USB 3.2 ports)

•1 × Intel®HD audio (HDA) and I2S or 2x I2S

•1 × I2C (General Purpose; master/slave capable)

•1 × SMBus

•1 × SPI (for external uEFI BIOS flash)

•1 x eSPI interface

•4 × Serial port (Rx/Tx, legacy compatible)

•2 × CAN interface

•1 × SD card interface

•14 GPIO signals (multiplexed with fan / camera control and HD audio Reset)

Security components:

•TPM (SLX9670 TPM 2.0)

Others:

•TQMx86 board controller with Watchdog and TQ-flexiCFG

Power supply:

•Voltage: 4.75 V to 5.25 V

3 V Battery for RTC

Environment:

•Standard Temperature: 0 °C to +60 °C

•Extended Temperature: –40 °C to +85 °C

Form factor / dimensions:

•SMARC short form factor; 82 mm × 50 mm

2.2 SMARC Specification Compliance

The TQMxE40S is compliant to the SMARC Hardware Specification (Version 2.1).

2.3 TQMxE40S Variants

The TQMxE40S is available in several standard configurations:

Please visit www.tq-group.com/TQMxE40S for a complete list of standard variants.

Other configurations are available on request.

Standard configuration features are:

•eDP or LVDS

•CPU version

•Memory configuration (RAM / eMMC)

•TPM

•Temperature range

Optional hardware and software configuration features:

•Conformal coating can be offered as custom specific add-on

•Custom specific GPIO configuration through TQ-flexiCFG

•Custom specific BIOS configuration

2.4 Accessories

TQMxE40S-HSP: Heat spreader for TQMxE40S according to the SMARC specification

Evaluation platform MB-SMARC-3:

•Mainboard for SMARC modules

•170 mm × 170 mm

•Interfaces: DP++, HDMI 2.0, eDP/LVDS, 2 × GbE, 1 × USB Type C, 1 x USB 3.0, 1 x USB 2.0, HDA and I²S Audio, Micro SD

card, 3 x M.2 socket (Key E, B, M), PCIe socket, up to 6 serial interfaces, 2 × CAN

FUNCTION

3.1 TQMxE40S Block Diagram

The following illustration shows the block diagram of the TQMxE40S:

Board Control

Power Mgmt

Watchdog

UART

I2C

GPIO

flexiCFG

SMARC 2.1 314-pin Card Edge Connection

eDP / DDI0LVDS/eDP

PCIe0

HSIO[5:2]

Ethernet 1

SPI

SATA 3.0

HSIO[10]

HDA & I2S

SATA

HDA & I2S

SDCard

SPI

PCIE (A:D)

DP++

USB 3.0

SD/SDIO

SDCard

SMB

SMBUS

DDI1

SGMII

USB 3.1

HSIO [1..0]

LPDDR4/4x

SMB

PCIe Gen 3 (4 x1 / 2 x2 / 1 x4)

USB 2.0 host

1x Device / Host; 1x USB 3.1 Host

eSPI

Power & System CTRL

PWM/FAN

Debug / JTAG

eMMC

8 - 256 GB

SATA Gen 3 (0)

USB 2.0 (3:0)

HDA/I2S and second I2S

DDI1

eDPeDP/LVDS

SGMII

MDI

DDI2DP++

eMMC 5.1

SPI

4267MT/s

GbE PHY

LVDS-Bridge

CSI 0

CSI 1

EEPROM

FAN Ctrl.

SER (1:0)

Sys/PWR Ctrl

I2C_GP

GPIO

JTAG

USB 2.0

[3:0]

Intel® Atom

Elkhart Lake

DDI0

HSUART

HSUARTSER (2:3)

Ethernet 0 RGMII 0

RGMIIMDI GbE PHY

Programmable

Service Engine

ARM7

Embedded

Controller

USB-C I2C

Power

4.75V – 5.25V

BIOS Flash

TPM 2.0

opt.

PCIe1 / UFS1

HSIO[9:8]

PCIe3 / UFS0

HSIO[7:6]

LPDDR4/4x

4x32 @ 4267 MT/s

up to 16 GB

with IBECC

LPDDR4/4x LPDDR4/4x

SATA 3.0

HSIO[11]

CAN

CAN[1:0]

I2C_CAM0/11)

USB-C I2C

CAN[1:0]

eSPI

Figure 1: Block Diagram TQMxE40S

3.2 Electrical Characteristics

3.2.1 Supply Voltage

The TQMxE40S supports an input voltage from 4.75 V to 5.25 V.

The following supply voltages are specified at the SMARC connector:

•Main Power Rail: 4.75 V to 5.25 V max input ripple: ±100 mV

•VCC_RTC: 2.0 V to 3.3 V max input ripple: ±20 mV

The input voltages shall rise from 10 % of nominal to 90 % of nominal within 0.1 to 20 ms (0.1 ms ≤ Rise Time ≤ 20 ms).

There must be a smooth and continuous ramp of each DC output voltage from 10 % to 90 % of its final set point within the

regulation band.

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