Celera Motion MicroE ChipEncoder Series Bedienungsanleitung
125 Middlesex Turnpike | Bedford, MA 01730-1409 USA
©2022 Celera Motion
IM-ChipEncoder-Series-Rev. 2 Tel: 781-266-5700 | celeramotion@gsig.com
ChipEncoder™
Series
Installation Manual and
Reference Guide
Introduction
IM-ChipEncoder-Series-Rev. 2 Page 1 ©2022 Celera Motion
ChipEncoder Series
Installation Manual and Reference Guide
Table of Contents
1.0 Introduction.......................................................................................................................................2
1.1 Overview .............................................................................................................................2
1.2 Precautions .........................................................................................................................2
1.3 Laser Safety Information.....................................................................................................2
1.4 Standards Compliance........................................................................................................3
1.5 Related Documentation.......................................................................................................3
1.6 Manual Revisions................................................................................................................3
1.7 Trademarks.........................................................................................................................3
1.8 Special Conventions Used..................................................................................................3
2.0 Before Installation.............................................................................................................................4
2.1 Power Recommendations...................................................................................................4
2.2 Installation Considerations..................................................................................................4
2.3 Handling Considerations.....................................................................................................4
2.4 Solder Paste Recommendation and Reflow Profile............................................................5
2.5 Application Notes ................................................................................................................6
2.6 Installation Flowchart...........................................................................................................7
3.0 System Overview .............................................................................................................................8
3.1 ChipEncoder Models...........................................................................................................8
3.2 Linear and Rotary Glass Scales..........................................................................................9
3.3 Evaluation PCB...................................................................................................................9
4.0 ChipEncoder Installation ................................................................................................................10
4.1 Mounting Orientation and Tolerances...............................................................................10
4.2 Mounting the ChipEncoder................................................................................................11
4.2.1 Linear Scale Installation.......................................................................................11
4.2.2 Rotary Scale Installation ......................................................................................12
4.3 Encoder Alignment............................................................................................................13
5.0 Linear Glass Scale Installation.......................................................................................................14
5.1 Before Installation..............................................................................................................14
5.1.1 Items Required for Linear Glass Scale Installation..............................................14
5.1.2 Flowchart for Linear Glass Scale Installation.......................................................14
5.2 Prepare Mounting Surface ................................................................................................15
5.3 Position the Scale..............................................................................................................15
5.4 Mounting the Scale............................................................................................................16
5.4.1 Epoxy Mounted Scale ..........................................................................................16
5.4.2 Adhesive Tape Mounted Scale ............................................................................17
6.0 Cleaning Scales .............................................................................................................................17
7.0 Appendix ........................................................................................................................................18
7.1 Specifications ....................................................................................................................18
7.2 Output Signals Descriptions..............................................................................................19
7.3 Linear and Glass Scales ...................................................................................................20
7.4 Electrical Schematics........................................................................................................22
7.5 Evaluation Board...............................................................................................................24
7.6 Recommended Signal Termination...................................................................................26
7.7 Customer Interface............................................................................................................26
7.8 RS-422 Compatibility.........................................................................................................26
7.9 Troubleshooting.................................................................................................................27
8.0 Order Guide....................................................................................................................................28
9.0 Contacting Celera Motion...............................................................................................................29
Introduction
IM-ChipEncoder-Series-Rev. 2 Page 2 ©2022 Celera Motion
ChipEncoder Series
Installation Manual and Reference Guide
1.0 Introduction
1.1 Overview
The ChipEncoder is an encoder system on a chip:
Small enough to mount directly on a printed circuit board
Designed for high-volume applications
Compatible with low-cost automated assembly processes
The instructions in this manual apply to the following ChipEncoders models:
Models CE300-4, CE300-40
Model CE40-GC
1.2 Precautions
1. Follow standard ESD precautions. Turn power to off before connecting the
sensor.
2. Do not touch electrical pins without static protection such as a grounded wrist
strap.
1.3 Laser Safety Information
This product is sold solely for use as a component (or replacement) in an electronic product; therefore, it
is not required to, and does not comply with U.S. FDA 21 CFR 1040.10 and 1040.11 which pertain to
complete laser products. The manufacturer of the complete system-level electronic product is
responsible for complying with 21 CFR 1040.10 and 1040.11.
MicroE Systems encoders contain an infrared laser diode or diodes. Emitted invisible laser radiation
levels have been measured to be within the CDRH Class 1 range, which is not considered hazardous;
however, to minimize exposure to the diverging beam, install the encoder sensor in its operational
configuration in close proximity to the encoder scale before applying power.
Invisible laser radiation: wavelength of 850 nm.
Maximum power of 2.4 mW CW.
Caution: The use of optical instruments with this product will increase eye hazard. Do not view
powered encoder directly with optical instruments (microscopes, eye loupes, or magnifiers).
All maintenance procedures such as cleaning must be performed with the MicroE encoder
turned off.
Do not insert any reflective surface into the beam path when the encoder is powered.
Do not attempt to service the MicroE encoder.
Introduction
IM-ChipEncoder-Series-Rev. 2 Page 3 ©2022 Celera Motion
ChipEncoder Series
Installation Manual and Reference Guide
1.4 Standards Compliance
ChipEncoders are RoHS and REACH compliant.
1.5 Related Documentation
ChipEncoders Series Data Sheet
ChipEncoders Series Interface Drawings
1.6 Manual Revisions
Version Date Notes
Rev. 2 04/21/2022 Changed stencil thickness. New values for Sin+. REACH
compliance.
1.7 Trademarks
ChipEncoder is a registered trademark of MicroE Systems®.
1.8 Special Conventions Used
The following symbols may be used in this document.
Symbol Description
Warning or caution: potential damage to parts.
Instructions show correct method.
Instructions show example of incorrect method.
See Section 2.2 Single click with the mouse on these highlighted
references to jump to specified places in instructions.
Before Installation
IM-ChipEncoder-Series-Rev. 2 Page 4 ©2022 Celera Motion
ChipEncoder Series
Installation Manual and Reference Guide
2.0 Before Installation
Review the items in this section prior to installing the ChipEncoder.
2.1 Power Recommendations
The ChipEncoder requires a 5.0 VDC power supply:
The ChipEncoders require a minimum of 4.5 VDC continuously.
When designing circuits and extension cables to use ChipEncoders, be sure to account for
voltage loss over distance and tolerances from the nominal supply voltage so that at least
4.5 VDC is available to the ChipEncoder under all operating conditions. The supply voltage can
be confirmed by measuring between the applicable 5 V and ground pads.
The input voltage should not exceed 5.5 VDC.
2.2 Installation Considerations
The ChipEncoder is a precision electronic instrument. It has been designed to function in a wide range
of applications and environments. To take full advantage of the encoder design, allow easy access to
the sensor for service and/or replacement.
For optimal performance and reliability:
DO follow standard ESD precautions while handling the sensor.
DO allow proper clearance for sensor head alignment.
DO follow setup and alignment instructions for the encoder system.
DO, where possible, install the scales in an inverted or vertical position to minimize
accumulation of dust.
DO NOT store sensors in an uncontrolled environment.
DO NOT electrically overstress the sensor (power supply ripple/noise).
DO NOT intentionally “hot swap” the sensor if the device is energized.
2.3 Handling Considerations
Note: Follow Electrostatic Discharge (ESD) precautions at all times. Prior to reflow soldering, pay
particular attention to preventing ESD damage as the damage threshold is 500 V.
When handling the ChipEncoder, do not allow the pickup device to touch anywhere in the “Keep Out
Zone.”Refer to the following illustrations. Scratches or 'digs' in the Keep Out Zone can affect
ChipEncoder performance.
Keep Out Zone
CE300
CE
Before Installation
IM-ChipEncoder-Series-Rev. 2 Page 5 ©2022 Celera Motion
ChipEncoder Series
Installation Manual and Reference Guide
2.4 Solder Paste Recommendation and Reflow Profile
The ChipEncoder can be soldered to a PCB using industry standard techniques. The diagram below
illustrates the recommended reflow temperature profile.
Lead-Free Solder Reflow
Use a temperature-controlled convection or IR reflow oven and SAC305 solder paste with no-clean flux
in either air or an inert atmosphere (N2). The temperature should be measured on the carrier board close
to the ChipEncoder parts and should not exceed 260°C.
The ChipEncoder has soldered devices under the cover. The rate of heating and cooling must be
controlled so that it does not exceed 5°C per second to avoid thermal stressing of the devices.
The ChipEncoder inputs and outputs are pre-tinned palladium silver pads with the typical spacing
between adjacent input/output pads of 0.2 mm (0.008 inches). The pads are pre-tinned with SAC305
solder alloy. Solder material with good slump characteristics should be chosen to ensure that solder
does not bridge or short during pre-heating in the reflow process.
Hand Soldering
Hand soldering can cause damage. Hand soldering guidelines:
CE300: Do not hand solder. Castellations are for electrical testing only.
CE: Hand solder only if necessary.
Reflow Solder
Temperature Profile
Before Installation
IM-ChipEncoder-Series-Rev. 2 Page 6 ©2022 Celera Motion
ChipEncoder Series
Installation Manual and Reference Guide
2.5 Application Notes
The printed circuit board (PCB) land pattern and assembly processes necessary to successfully
integrate the ChipEncoder are detailed as follows:
Use the publication IPC-7351 Generic Requirements for Surface Mount Design and Land
Pattern Standard (developed 2005 by IPC) as a guide for proper land pattern design for the
solder pads on the printed circuit board.
Due to the tight spacing between solder pads, it is recommended that solder mask be used
between the solder pads to prevent solder bridging and shorting to adjacent pads.
A 0.003 - 0.005inch thick stainless steel stencil is recommended for solder paste
application to the printed circuit board lands.
Machine placement and reflow soldering of the ChipEncoder is recommended.
Acetone is the recommended cleaner for the ChipEncoder.
PCB Requirements
The ChipEncoder electrical interface, land pattern, schematic of additional required passive components
and mechanical dimensions are found in the interface drawings, which are located on the following
webpage: http://www.microesystems.com/resource/product-documentation.
Before Installation
IM-ChipEncoder-Series-Rev. 2 Page 7 ©2022 Celera Motion
ChipEncoder Series
Installation Manual and Reference Guide
2.6 Installation Flowchart
The following flowchart lists the main steps in ChipEncoder installation.
Use Eval PCB
Design Interface
for Eval PCB
Perform Mechanical
Alignment
Perform PC Design
Section 4.3
Section 4.0
Confirm Alignment
(Optional)
Install
Complete
Install Encoder
Designing Own
PCB?
No
Yes
Install Scale
Section 5.0
System Overview
IM-ChipEncoder-Series-Rev. 2 Page 8 ©2022 Celera Motion
ChipEncoder Series
Installation Manual and Reference Guide
3.0 System Overview
This section identifies parts for the installation. Use the information in this section to design the
mounting scheme for the encoder.
3.1 ChipEncoder Models
Example of ChipEncoder Installed on a PCB
CE300-4, CE300-40 (7 mm x 11 mm) Top View
CE-40GC (6 mm x 6 mm) Top View
Ceramic
Substrate
Riser
Castellations (x24)
Beam Splitter
Date Code and
Serial Number
Beam Splitter
Ceramic
Substrate
Riser
ChipEncoder
System Overview
IM-ChipEncoder-Series-Rev. 2 Page 9 ©2022 Celera Motion
ChipEncoder Series
Installation Manual and Reference Guide
3.2 Linear and Rotary Glass Scales
The scales available for the ChipEncoder:
Linear Glass Scales
Rotary Glass Scales
Examples of scales (shown with ChipEncoder CE300)
3.3 Evaluation PCB
There are two alternatives for initially creating/designing a PCB to test with the ChipEncoder:
Design your own PCB and install the ChipEncoder to it
Purchase the Eval PCB and install the ChipEncoder to it (see Section 7.5 Evaluation Board
for more details). Once testing is successful, then a production PCB can be designed.
The ChipEncoder must be mechanically aligned to the scale. Alignment can be confirmed using an
Oscilloscope (see install procedure). See Section 8.0 Order Guide for details on ordering the Eval
PCB.
ChipEncoder Evaluation Board
U.S. Dime
Index
Linear Glass Scale
Rotary Glass Scale
Index
Evaluation PCB (CE300-4-PCB or CE300-40-PCB)
Evaluation PCB (CE-40GC-PCB)
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