Ebyte E32 Series Bedienungsanleitung

E32-900M20S

SX1276 868/915MHz SPI SMD Wireless Module

Contents

Disclaimer...............................................................................................................................................................................2

Features...........................................................................................................................................................................3

1 Introduction......................................................................................................................................................................... 4

1.1 Brief Introduction..................................................................................................................................................... 4

1.2 Application................................................................................................................................................................4

2 Specification and parameter................................................................................................................................................ 5

2.1 Limit parameter........................................................................................................................................................ 5

2.2 Operating parameter................................................................................................................................................. 5

3 Size and pin definition.........................................................................................................................................................6

4 Basic operation.................................................................................................................................................................... 7

4.1 Hardware design....................................................................................................................................................... 7

4.2 Programming............................................................................................................................................................ 8

5 Basic application..................................................................................................................................................................9

5.1 Hardware design and circuit schematic diagram...................................................................................................... 9

6FAQ..................................................................................................................................................................................... 9

6.1 Communication range is too short............................................................................................................................9

6.2 Module is easy to damage....................................................................................................................................... 9

6.3 BER(Bit Error Rate) is high................................................................................................................................... 10

7 Production guidance.......................................................................................................................................................... 11

7.1 Reflow soldering temperature................................................................................................................................ 11

7.2 Reflow soldering curve...........................................................................................................................................11

8 E32 series...........................................................................................................................................................................12

9 Antenna recommendation..................................................................................................................................................12

Revision history....................................................................................................................................................................13

About us................................................................................................................................................................................13

Chengdu Ebyte Electronic Technology Co.,Ltd. E32-900M20SA User Manual

Disclaimer

EBYTE reserves all rights to this document and the information contained herein.

Products, names, logos and designs described herein may in whole or in part be

subject to intellectual property rights. Reproduction, use, modification or disclosure to

third parties of this document or any part thereof without the express permission of

EBYTE is strictly prohibited.

The information contained herein is provided “as is” and EBYTE assumes no

liability for the use of the information. No warranty, either express or implied, is given,

including but not limited, with respect to the accuracy, correctness, reliability and

fitness for a particular purpose of the information. This document may be revised by

EBYTE at any time. For most recent documents, visit www.ebyte.com.

Chengdu Ebyte Electronic Technology Co.,Ltd. E32-900M20SA User Manual

Features

The measured communication distance can reach 10km;

Maximum transmission power of 1W, software multi-level adjustable;

Support 868/915 MHz band;

Support data transmission rate between 0.018K and 37.5Kbps in LoRaTM mode;

Support data transmission rate of up to 300kbps in FSK mode;

Support for multiple modulation mode, LoRaTM/FSK/GFSK/MSK/GMSK/OOK;

Large FIFO capacity, support 256Byte data cache;

Support 3.3V~5.5V power supply, power supply over 5 V can guarantee the best performance;

Industrial grade standard design, support -40 ~ 85 °C for working over a long time;

IPEX and stamp hole optional, good for secondary development and integration.

Chengdu Ebyte Electronic Technology Co.,Ltd. E32-900M20SA User Manual

1 Introduction

1.1 Brief Introduction

E32-900M20S is a self-developed, 868/915MHz LoRaTM SMD

wireless module with the maximum transmission power of 1W which

is based on the SX1276 produced by Semtech in the United States.

Due to adopt the original installation import SX1278 as the core

module,, Due to its advanced LoRaTM modulation technology, its

anti-interference performance and communication distance are far

superior to the current FSK and GFSK modulation products. This

module is mainly aimed at intelligent home, wireless meter reading,

scientific research and medical treatment, and medium and long

distance wireless communication equipment. As the RF performance

and component selection are in accordance with industrial standards, and the product has obtained FCC, CE, RoHS

and other international authoritative certification reports.

Since this module is a pure RF transceiver module, it needs to be programmed by using MCU drive or special

SPI debugging tools.

1.2 Application

Home security alarm and remote keyless entry;

Smart home and industrial sensors;

Wireless alarm security system;

Building automation solutions;

Wireless industrial-grade remote control;

Health care products;

Advanced Meter Reading Architecture(AMI);

Chengdu Ebyte Electronic Technology Co.,Ltd. E32-900M20SA User Manual

2 Specification and parameter

2.1 Limit parameter

Main parameter

Performance

Remark

Min

Max

Power supply（V）

5.5

Voltage over 5.5V will cause permanent

damage to module

Blocking power（dBm）

Chances of burn is slim when modules

are used in short distance

Operating temperature（℃）

-40

Industrial grade

2.2 Operating parameter

Main parameter

Performance

Remark

Min

Type

Max

Operating voltage（V）

3.3

5.5

≥5.5 V ensures output power

Communication level（V）

3.3

Operating temperature（℃）

-40

Industrial grade

Operating frequency（MHz）

850

868/915

931

Power

Consump-

tion

TX current（mA）

650

RX current（mA）

Sleep current （μA）

Max TX power（dBm）

Receiving sensitivity（dBm）

-123

-124

-125

Air data rate is 1.2 kbps

Main parameter

Description

Remark

Reference distance

5km

Test condition：clear and open area, antenna gain: 5dBi，

antenna height: 2m，air data rate: 2.4 kbps

FIFO

256Byte

Maximum length of single send

Crystal Oscillator

32MHz

Passive crystals

Protocol

LoRaTM

FSK/GFSK/MSK/GMSK/OOK

Package

SMD

Spacing of 2.54 mm

Interface

1.27mm

Sample hole

Communication interface

SPI

0~10Mbps

Size

14*20mm

Antenna

Sample hole / IPEX

50 ohm impedance

Chengdu Ebyte Electronic Technology Co.,Ltd. E32-900M20SA User Manual

3 Size and pin definition

Pin No.

Item

Direction

Description

GND

Ground

GND

Ground

GND

Ground

GND

Ground

GND

Ground

RXEN

Input

RF switch receiving control pin, connected to external MCU IO, high level effective

TXEN

Input

RF switch receiving control pin, connected to external MCU IO, high level effective

DIO2

Input/Output

General IO port (see SX1276 manual for details)

VCC

Power supply, range 3.3 ~ 5.5V (external ceramic filter capacitor is recommended)

GND

Ground

GND

Ground

GND

Ground

DIO3

Input/Output

General IO port (see SX1276 manual for details)

Chengdu Ebyte Electronic Technology Co.,Ltd. E32-900M20SA User Manual

DIO4

Input/Output

General IO port (see SX1276 manual for details)

DIO5

Input/Output

General IO port (see SX1276 manual for details)

GND

Ground

DIO1

Input/Output

General IO port (see SX1276 manual for details)

DIO0

Input/Output

General IO port (see SX1276 manual for details)

RST

Input

Chip reset trigger input pin

MISO

Output

SPI data output pin

MOSI

Input

SPI data output pin

SCK

Input

SPI data output pin

NSS

Input

the module chip selects the pin used to start an SPI communication

GND

Ground

ANT

Antenna interface, Sample hole (50Ωcharacteristic impedance)

GND

Ground

4 Basic operation

4.1 Hardware design

It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible and

the module needs to be reliably grounded;

Please pay attention to the correct connection of the positive and negative poles of the power supply,

reverse connection may cause permanent damage to the module;

Please check the power supply to ensure that between the recommended supply voltage, if exceeding the maximum,

the module will be permanently damaged;

Please check the stability of the power supply. Voltage can not fluctuate greatly and frequently;

When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the

margin, so the whole machine is beneficial for long-term stable operation;

The module should be as far away as possible from the power supply, transformers, high-frequency wiring and

other parts with large electromagnetic interference;

Bottom Layer High-frequency digital routing, high-frequency analog routing, and power routing must be avoided

under the module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer,

and the copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital

part of the module and routed in the Bottom Layer;

Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom

Layer or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees;

It is assumed that there are devices with large electromagnetic interference around the module that will greatly

affect the performance. It is recommended to keep them away from the module according to the strength of the

interference. If necessary, appropriate isolation and shielding can be done;

Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog,

power traces) around the module that will greatly affect the performance of the module. It is recommended to stay

Chengdu Ebyte Electronic Technology Co.,Ltd. E32-900M20SA User Manual

away from the module according to the strength of the interference.If necessary, appropriate isolation and shielding

can be done;

Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0;

The mounting structure of antenna has a great influence on the performance of the module. It is necessary to ensure

that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good

antenna extension cable to extend the antenna to the outside;

The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly

weakened.

4.2 Programming

The core of this module is SX1278/SX1276+PA+LNA, its driving method is completely equivalent to

SX1278/SX1276, the user can operate according to the SX1278/SX1276 chip manual

DIO0, DIO1, DIO2, DIO3, DIO4 and DIO5 are general I/O ports, which can be configured into a variety of

functions. See SX1278 manual for details. If not used can be suspended;

NRST, TXEN and RXEN pins must be connected, wherein NRST controls the reset of the chip, TXEN and RXEN

pins control the RF switch;

Pay attention to good grounding, large area of ground, small ripple of power supply, filter capacitor should be

added and close to module VCC and GND pins as far as possible;

SPI communication rate should not be set too high, usually 1Mbps is recommended;

When transmitting, set DIO_7 pin to high level and DIO_13, DIO_14 pins to low level;When receiving, set

DIO_7 pin to low level and DIO_13, DIO_14 pins to high level;Before turning off, set DIO_7, DIO_13,

DIO_14 pins to low;

The register configuration can be reinitialized when the chip is idle for greater stability.

Chengdu Ebyte Electronic Technology Co.,Ltd. E32-900M20SA User Manual

5 Basic application

5.1 Hardware design and circuit schematic diagram

6FAQ

6.1 Communication range is too short

The communication distance will be affected when obstacle exists;

Data lose rate will be affected by temperature, humidity and co-channel interference;

The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground;

Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea;

The signal will be affected when the antenna is near metal object or put in a metal case;

Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the

distance);

The power supply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower the

transmitting power;

Due to antenna quality or poor matching between antenna and module.

6.2 Module is easy to damage

Please check the power supply source, ensure it is 2.0V~3.6V, voltage higher than 3.6V will damage the module;

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