Fujitsu SOFTUNE F2 MC-16 Bedienungsanleitung

PREFACE

Thank you for purchasing the QFP-100P*2Probe Header (MB2147-582) for the F2MC*1-16 family

emulator.

The QFP-100P Probe Header is used by the probe header to connect the F2MC-16L/16LX emulator

(MB2147-01), referred to as " emulator ", to a user system.

This manual explains the handling of the QFP-100P Probe Header for the F2MC-16L/16LX emulator.

Read this manual carefully before using the MB2147-582.

Consult the Sales Department or the Support Department of Fujitsu Limited for mass-produced MCUs

and evaluation MCUs.

*1: F2MC is the abbreviation of FUJITSU Flexible Microcontroller.

*2: The lead pitch of PACKAGE (FPT-100P-M06) is 0.65 mm and the body size is 14 mm x 20 mm.

■ Handling and use

The handling and use of this product and notes regarding safety are included in the hardware manual of

the F2MC-16L/16LX emulator.

Follow the instructions in that manual " F2MC-16L/16LX emulator MB2147-01 HARDWARE

MANUAL " for the use of this product.

■ Caution of the products described in this document

Cautions in the following correspond to the products described in this document.

CAUTION The wrong use ofa device willgivean injury and may cause

malfunction oncustomerssystem.

Cuts This product haspartswithsharp points thatareexposed.

Donottouchedge of theproduct with your barehands.

Damage

When connect the header boardtothe user system, correctlyposition the indexmark (▲)

on theNQPACKmounted onthe usersystemwith theindex mark(▲) onthe header

board, otherwisetheemulator systemand usersystemaredamaged.

DamageWhen mounting a mass production MCU, correctly position pin 1, otherwise the mass

production MCU and user system are damaged.

• The contents of this document are subject to change without notice.

Customers are advised to consult with FUJITSU sales representatives before ordering.

• The information, such as descriptions of function and application circuit examples, in this document are presented solely for the

purpose of reference to show examples of operations and uses of Fujitsu semiconductor device; Fujitsu does not warrant proper

operation of the device with respect to use based on such information. When you develop equipment incorporating the device

based on such information, you must assume any responsibility arising out of such use of the information. Fujitsu assumes no

liability for any damages whatsoever arising out of the use of the information.

• Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license

of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right of Fujitsu or any third

party or does Fujitsu warrant non-infringement of any third-party' s intellectual property right or other right by using such

information. Fujitsu assumes no liability for any infringement of the intellectual property rights or other rights of third parties

which would result from the use of information contained herein.

• The products described in this document are designed, developed and manufactured as contemplated for general use, including

without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed

and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured,

could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss

(i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life

support system, missile launch control in weapon system), or (2) for use requiring extremely high reliability (i.e., submersible

repeater and artificial satellite).

Please note that Fujitsu will not be liable against you and/or any third party for any claims or damages arising in connection

with above-mentioned uses of the products.

• Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such

failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and

prevention of over-current levels and other abnormal operating conditions.

• If any products described in this document represent goods or technologies subject to certain restrictions on export under the

Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be required for export

of those products from Japan.

1. Checking the Delivered Product

Before using the QFP-100P Probe Header , confirm that the following components are included in

the box:

•

••

•

QFP-100P Probe Header*1 : 1

•

••

•

Screws for securing header board

(M2 ×10 mm, 0.4 mm pitch)

: 4

•

••

•

Washer : 4

•

••

•

NQPACK100RB*2 : 1

•

••

•

HQPACK100RB179*3 : 1

•

••

•

Operation manual (Japanese version) : 1

•

••

•

Operation manual (English version, this

manual)

: 1

*1: Referred to as "header board". Header board is mounted on YQPACK100RB (Tokyo Eletech

Corporation), referred to as " YQPACK ".

*2: IC socket manufactured by Tokyo Eletech Corporation, referred to as " NQPACK ", and supplied

with a special screwdriver and three guide pins. A socket offering higher reliability,

NQPACK100RB-SL (Tokyo Eletech Corporation) (sold separately), can be used by making an

IC socket mounting hole on the user system board. For more information, contact Tokyo Eletech

Corporation.

*3: IC Socket cover manufactured by Tokyo Eletech Corporation, referred to as " HQPACK ", with 4

screws for securing HQPACK (M2 x 6 mm , 0.4 mm pitch).

This product functions as an emulator system when it is combined with the emulator.

2. Handling Precautions

The header board is precision-manufactured to improve dimensional accuracy and to ensure reliable

contact. The header board is therefore sensitive to mechanical shock. To ensure correct use of the

header board in the proper environment, observe the following points regarding its insertion and

removal:

•

••

•

Avoid placing stress on the NQPACK mounted on the user system board while connecting the

header board.

3. Notes on Designing

■ Restrictions of PC board for the user system

Once the header board is connected to the user system, the heights of parts mounted in the space

around the header board are restricted.

The PC board of the user system must be designed with due consideration given to this restriction

(Figure 1).

80 mm

68 mm

2211

CN2

CN3

CN1

100

100 99

*: The height differs slightly depending on how the sockets are engaged.

Figure 1 Header board dimensions

■ MCU footprint design notes

Figure 2 shows the recommended dimensions of the NQPACK footprint mounted on the PC board of

the user system. The PC board of the user system must be designed with due consideration given to

this footprint as well as to the mass production MCU. For more information, contact Tokyo Eletech

Corporation.

Figure 2 Recommended dimensions of the footprint for mounting the NQPACK

4. Procedure for connecting the user system

■ Connection

Before using the QFP-100P Probe Header, mount the supplied NQPACK on the user system. To

connect the header board to the adapter unit, use the flat cable (2 lines) supplied by the adapter unit

sold separately.

Refer to the hardware manuals of each adapter unit about the way to connect.

1. To connect the header board to the user system, match the first pin of the index mark (▲) on

the NQPACK mounted on the user system with the index mark (▲) on the header board, and

then insert it (see Figure 3).

The pin of YQPACK is thin and easy to bend. Insert NQPACK after confirm that the pin of

YQPACK is not bent.

2. Insert each header board mounting screw for header board in each of the four tapped holes

on the header board through a washer, and then first tighten the screws in opposing corners

followed by the two remaining screws (see Figure 4).

To tighten the screws, use the special screwdriver supplied with the NQPACK to finally

tighten the four screws in sequence. Tightening the screws too tight might result in a

defective contact.

Figure 3 Index position

Figure 4 Header board connection

■ Disconnection

To disconnect the header board from the user system, remove all four screws, and then pull the

header unit straight out of the socket.

5. Mounting Mass-production MCUs

■ Mounting

After mounting a mass production MCU on the user system, use the supplied HQPACK, IC socket

cover.

1. To mount a mass production MCU on the user system, match the index mark (▲) on the

NQPACK mounted on the user system with the index mark (●) on the mass-produced MCU.

2. Confirm that the mass production MCU is correctly mounted on the NQPACK. Next, insert

the HQPACK into a NQPACK matching the notch of HQPACK to that of NQPACK (see

Figure 5).

The pin of HQPACK is thin and easy to bend. Insert NQPACK after confirm that the pin of

HQPACK is not bent

3. Insert each HQPACK screw for securing in each of four tapped holes on the socket cover, and

then first tighten the screws in opposing corners followed by the two remaining screws.

To tighten the screws, use the special screwdriver supplied with the NQPACK to finally

tighten the four screws in sequence. Tightening the screws too tight might result in a defective

contact.

HQPACK

NQPACK

Mass-produced MCU

Header board

screws for securing

User system

Figure 5 Mounting a mass-produced MCU

■ Disconnection

To remove the HQPACK, remove all four screws, and pull out the header vertically.

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