HBM QuantumX Bedienungsanleitung
A3609-1.0 en
Operating manual
Rugged DAQ
d
3
HBMQuantumX Rugged DAQ
Content
1 Safety instructions 5......................................................
2 Introduction 11............................................................
2.1 About the QuantumX documentation 11.................................................
2.2 The QuantumX Rugged DAQ series 12.................................................
2.3 Digitalization and signal path 14........................................................
2.4 QuantumX Rugged DAQ module synchronization 15......................................
3 Software 19................................................................
3.1 QuantumX Assistant 19...............................................................
3.2 catmanAP 20......................................................................
3.3 Programming interface (API) 21........................................................
3.4 Firmware update via Ethernet 21.......................................................
3.5 TEDS Editor 24......................................................................
4 Housing 25................................................................
5 Connecting individual QuantumX modules with Rugged DAQ design 26.......
5.1 Connecting the supply voltage 26......................................................
6 Modules and transducers 27................................................
6.1 General information 27...............................................................
6.1.1 Shielding design 27...........................................................
6.1.2 Active transducer connection 28...............................................
6.1.3 TEDS 29....................................................................
6.1.4 Autocalibration / Autoadjustment 32............................................
6.2 MX840A-P universal amplifier 33.......................................................
6.2.1 MX840A-P pin assignment 35.................................................
6.2.2 MX840A-P status display 36...................................................
6.3 MX411-P highly dynamic universal amplifier 37...........................................
6.3.1 MX411-P pin assignment 38...................................................
6.3.2 MX411-P status display 39....................................................
6.4 MX460-P frequency measuring amplifier 40.............................................
6.4.1 MX460-P pin assignment 41...................................................
6.4.2 MX460-P status display 42....................................................
6.5 MX1609-P thermocouple amplifier 43...................................................
6.5.1 Thermocouple with TEDS functionality (RFID) 44.................................
6.5.2 MX1609-P status display 45...................................................
6.6 MX1601-P amplifier 46...............................................................
6.6.1 MX1601-P pin assignment 47..................................................
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HBM QuantumX Rugged DAQ
6.7 Transducer connection 48.............................................................
6.7.1 Full bridge, SG 48............................................................
6.7.2 Full bridge, inductive 49.......................................................
6.7.3 Full bridge, piezoresistive 50...................................................
6.7.4 Half bridge, SG 51...........................................................
6.7.5 Half bridge, inductive 52......................................................
6.7.6 Potentiometric transducer 53..................................................
6.7.7 LVDT transducers 54.........................................................
6.7.8 Current-fed piezoelectric transducer 55.........................................
6.7.9 DC voltage sources 100 mV 58................................................
6.7.10 DC voltage sources 10 V or 60 V range 59......................................
6.7.11 DC current sources 20 mA 60..................................................
6.7.12 DC current sources 20 mA −current-fed 61......................................
6.7.13 Resistance 62...............................................................
6.7.14 Resistance thermometers Pt100, Pt1000 63.....................................
6.7.15 Frequency, differential, without directional signal 64...............................
6.7.16 Frequency, differential, with directional signal 65..................................
6.7.17 Frequency, single-pole, without directional signal 66..............................
6.7.18 Frequency, single-pole, with directional signal 67.................................
6.7.19 Encoder and pulse encoder, differential 68.......................................
6.7.20 Encoder and pulse encoder, single-pole 69......................................
6.7.21 SSI protocol 70..............................................................
6.7.22 Passive inductive encoder 71..................................................
6.7.23 PWM −Pulse width, pulse duration, period duration 72............................
6.7.24 PWM −Pulse width, pulse duration, period duration, single-pole 73.................
6.7.25 CANbus 74..................................................................
7FAQ 75....................................................................
8 Accessories 78............................................................
8.1 System accessories 80...............................................................
8.2 Voltage supply 80....................................................................
8.2.1 Power pack NTX002 80.......................................................
8.3 FireWire 81.........................................................................
8.3.1 FireWire cable (module to module; IP68) 81.....................................
8.3.2 Connection cable 82..........................................................
8.4 MX1609-P accessories 83............................................................
8.4.1 Thermo-connector with integrated RFID chip 83..................................
9 Support 84.................................................................
5Safety instructions
HBMQuantumX Rugged DAQ
1 Safety instructions
Appropriate use
A module with connected transducers is to be used exclusively for measurement tasks and
directly related control tasks. Use for any purpose other than the above is deemed to be
non-designated use.
In the interests of safety, the module should only be operated as described in the Operating
Manuals. It is also essential to comply with the legal and safety requirements for the
application concerned during use. The same applies to the use of accessories.
Before commissioning the module for the first time, you must first run a project planning and
risk analysis that takes into account all the safety aspects of automation technology. This
particularly concerns personal and machine protection.
Additional safety precautions must be taken in plants where malfunctions could cause major
damage, loss of data or even personal injury. In the event of a fault, these precautions
establish safe operating conditions.
This can be done, for example, by mechanical interlocking, error signaling, limit value
switches, etc.
Safety rules
The module must not be connected directly to the power supply system. Supply
voltage 10 V ... 30 V (DC).
The supply connection, as well as the signal and sensor leads, must be installed in such a
way that electromagnetic interference does not adversely affect device functionality (HBM
recommendation: “Greenline shielding design”, downloadable from the Internet at
http://www.hbm.com/Greenline).
Automation equipment and devices must be covered over in such a way that adequate
protection or locking against unintentional actuation is provided (e.g. access checks,
password protection, etc.).
When devices are working in a network, these networks must be designed in such a way that
malfunctions in individual nodes can be detected and shut down.
Safety precautions must be taken both in terms of hardware and software, so that a line
break or other interruptions to signal transmission, e.g. via the bus interfaces, do not cause
undefined states or loss of data in the automation device.
General dangers of failing to follow the safety instructions
The module is a state of the art device and as such is failsafe. The module may give rise to
dangers if it is inappropriately installed and operated by untrained personnel. Any person
instructed to carry out installation, commissioning, maintenance or repair of the modules
must have read and understood the Operating Manuals and in particular the technical safety
instructions.
6Safety instructions
HBM QuantumX Rugged DAQ
The scope of supply and performance of the modules only covers a small area of
measurement technology. In addition, equipment planners, installers and operators should
plan, implement and respond to the safety engineering considerations of measurement
technology in such a way as to minimize remaining dangers. On-site regulations must be
complied with at all times. There must be reference to the remaining dangers connected with
measurement technology. After making settings and carrying out activities that are
password-protected, you must make sure that any controls that may be connected remain in
safe condition until the switching performance of the module has been tested.
Working safely
Error messages should only be acknowledged once the cause of the error is removed and
no further danger exists.
Conversions and modifications
The module must not be modified from the design or safety engineering point of view except
with our express agreement. Any modification shall exclude all liability on our part for any
resultant damage.
In particular, any repair or soldering work on motherboards (replacement of components) is
prohibited. When exchanging complete modules, use only original parts from HBM.
The module is delivered from the factory with a fixed hardware and software configuration.
Changes can only be made within the possibilities documented in the manuals.
Outputs
Particular attention must be paid to safety when using the digital, analog or CANbus outputs
of a module. Ensure that status or control signals cannot initiate any actions that may pose a
danger to persons or the environment.
Qualified personnel
Qualified persons means persons entrusted with the installation, fitting, commissioning and
operation of the product who possess the appropriate qualifications for their function. This
module is only to be installed and used by qualified personnel, strictly in accordance with the
specifications and the safety rules and regulations.
This includes people who meet at least one of the three following requirements:
•Knowledge of the safety concepts of automation technology is a requirement and as
project personnel, you must be familiar with these concepts.
•As automation plant operating personnel, you have been instructed how to handle the
machinery and are familiar with the operation of the modules and technologies described
in this documentation.
7Safety instructions
HBMQuantumX Rugged DAQ
•As commissioning engineers or service engineers, you have successfully completed the
training to qualify you to repair the automation systems. You are also authorized to
activate, ground and label circuits and equipment in accordance with safety engineering
standards.
It is also essential to comply with the legal and safety requirements for the application
concerned during use. The same applies to the use of accessories.
NOTE
The safety instructions described here also apply to the power pack NTX002.
8Safety instructions
HBM QuantumX Rugged DAQ
The following symbols are used in this Operating Manual to point out remaining
dangers:
Symbol: DANGER
Meaning: Maximum danger level
Warns of an imminently dangerous situation in which failure to comply with safety
requirements will result in death or serious physical injury.
Symbol: WARNING
Meaning: Dangerous situation
Warns of a potentially dangerous situation in which failure to comply with safety
requirements can result in death or serious physical injury.
Symbol: CAUTION
Meaning: Possibly dangerous situation
Warns of a potentially dangerous situation in which failure to comply with safety
requirements could lead to damage to property, slight or moderate physical injury.
Symbol:
Meaning: Electrostatically sensitive components
Components marked with this symbol can be damaged beyond repair by electrostatic
discharge. Please observe the handling instructions for components exposed to the risk of
electrostatic discharge.
Symbol: On the device
Meaning: Take details in the operating manual into account
9Safety instructions
HBMQuantumX Rugged DAQ
Symbols for application and disposal instructions, as well as useful information:
Symbol: NOTE
Means that important information about the product or its handling is being provided.
Symbol:
Meaning: CE mark
The CE mark enables the manufacturer to guarantee that the product complies with the
requirements of the relevant EC directives (the Declaration of Conformity can be found at
http://www.hbm.com/hbmdoc).
Symbol:
Meaning: Statutory waste disposal mark
In accordance with national and local environmental protection and material recovery and
recycling regulations, old devices that can no longer be used must be disposed of separately
and not with normal household garbage.
If you need more information about waste disposal, please contact your local authorities or
the dealer from whom you purchased the product.
10 Safety instructions
HBM QuantumX Rugged DAQ
Conditions on site
The modules are suitable for applications in rough environments:
−Designed to degree of protection IP67 (dust, water)
−Extended temperature range from -35 to 80 °C
−Vibration / oscillation resistance up to 5 g
−Shock resistant up to 50 g
For all modules:
−Do not expose the modules to direct sunlight.
−Comply with the maximum permissible ambient temperatures stated in the specifications.
Maintenance and cleaning
The modules are maintenance-free. Please note the following points when cleaning the
housing:
−Before cleaning, disconnect the module from all connections.
−Clean the housing with a soft, slightly damp cloth. Never use solvent as this could
damage the labeling or the housing.
−Do not use high-pressure cleaners for cleaning.
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