Hitachi 53SDX01B Bedienungsanleitung

AUGUST 2000 HHEA-MANUFACTURING DIVISION

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NTSC DP06 Chassis

SERVICE MANUAL

CONTENTS

SAFETY PRECAUTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

SERVICING PRECAUTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

TECHNICAL CAUTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

CIRCUIT PROTECTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

CAUTIONS WHEN CONNECTING/DISCONNECTING THE HV CONNECTOR . . . . . .12

GENERAL INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

REMOTE CONTROL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

CUSTOMIZED PICTURE AND SOUND ADJUSTMENTS . . . . . . . . . . . . . . . . . . . . . .15

SERVICE ADJUSTMENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22

AUDIO LEVEL DIAGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56

PROTECTION CIRCUIT BLOCK DIAGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57

TROUBLESHOOTING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59

DC VOLTAGE TABLES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67

WAVEFORMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .79

BASIC CIRCUIT DIAGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .82

PRINTED CIRCUIT BOARDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .97

BLOCK DIAGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .103

WIRING DIAGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .104

CHASSIS WIRING DRAWING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .105

EXPLODED VIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .111

REPLACEMENT PARTS LIST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .112

QUICK REFERENCE PARTS LIST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .145

CAUTION: Before servicing this chassis, it is important that the service technician read the “Safety Precaution”

and “Product Safety Notices” in this service manual.

SAFETY NOTICE

USE ISOLATION TRANSFORMER WHEN SERVICING

Components having special safety characteristics are identified by a on the schematics and on the parts list in this

Service Data and its supplements and bulletins. Before servicing the chassis, it is important that the service technician

read and follow the “Safety Precautions” and “Product Safety Notices” in this Service Manual.

PROJECTION COLOR TELEVISION

SPECIFICATIONS AND PARTS ARE SUBJECT TO CHANGE FOR IMPROVEMENT

Components having special safety characteristics are identified by a on the schematics and on the parts list in this service

manual and its supplements and bulletins. Before servicing this chassis, it is important that the service technician read and

follow the “Safety Precautions” and the “Product Safety Notices” in this Service Manual.

For continued X-Radiation protection, replace picture tube with original type or Hitachi approved equivalent type.

This Service Manual is intended for qualified service technicians; it is not meant for the casual do-it-yourselfer. Qualified

technicians have the necessary test equipment and tools, and have been trained to properly and safely repair complex

products such as those covered by this manual.

Improperly performed repairs can adversely affect the safety and reliability of the product and may void warranty. If you

are not qualified to perform the repair of this product properly and safely, you should not risk trying to do so and refer the

repair to a qualified service technician.

9:.!8!;

Lead in solder used in this product is listed by the California Health and Welfare agency as a known reproductive toxicant which

may cause birth defects or other reproductive harm (California Health and Safety Code, Section 25249.5).

When servicing or handling circuit boards and other components which contain lead in solder, avoid unprotected skin contact

with solder. Also, when soldering do not inhale any smoke or fumes produced.

This television receiver provides display of television closed captioning in accordance with section 15.119 of the FCC rules.

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LEAKAGE

CURRENT

TESTER

(READING

SHOULD NOT

BE ABOVE 0.5mA)

EARTH

GROUND

TEST ALL

EXPOSED

METAL SURFACES

DEVICE

UNDER

TEST

2-WIRE CORD

ALSO TEST WITH PLUG

REVERSED

(USING AC ADAPTER

PLUS AS REQUIRED)

Chassis

ground

High Impedance

H.V. meter

Deflection P.W.B.

FBT

(TH01)

High voltage

connector

AC Leakage Test

g. X-radiation – TUBE: The primary source of X-

radiation in this receiver is the picture tube. The tube

utilized for the above mentioned function in this

chassis is specially constructed to limit X-radiation

emissions.

For continued X-radiation protection, the replacement

tube must be the same type as the original, Hitachi

approved type.

When troubleshooting and making test measure-

ments in a receiver with a problem of excessive high

voltage, avoid being unnecessarily close to the pic-

ture tube and the high voltage component.

Do not operate the chassis longer than is necessary

to locate the cause of excessive voltage.

h. X-radiation Shield –

1. This receiver is provided with X-ray shield plates

for protection against X-radiation. Do not remove

X-ray shield plates A, B, or C shown in Fig. 1

unnecessarily, when troubleshooting and/or

making test measurements.

2. To prevent X-radiation, after replacement of

picture tube and lens, confirm these components

to be fixed correctly to bracket and cabinet, and

not to be taken off easily.

Shield Plate A (1.6mm)

Glass Lens for Shielding

Shield Plate B (1.6mm)

Shield Plate C (1.6mm)

Detailing X-radiation shield, ( ) plate thickness

Shield Plate B (1.6mm)

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2. Read and comply with all caution and safety-related

notes on or inside the receiver cabinet, on the

receiver chassis, or on the picture tube.

3. Design Alteration Warning – Do not alter or add to

the mechanical or electrical design of this TV receiver.

Design alterations and additions including but not

limited to circuit modifications and the addition of

items such as auxiliary audio and/or video output

connectors, might alter the safety characteristics of

this receiver and create a hazard to the user. Any

design alterations or additions may void the

manufacturer’s warranty and may make you, the

servicer, responsible for personal injury or property

damage resulting therefrom.

4. Picture Tube Implosion Protection Warning – The

picture tube in this receiver employs integral

implosion protection. For continued implosion

protection, replace the picture tube only with one of

the same type number. Do not remove, install, or

otherwise handle the picture tube in any manner

without first putting on shatterproof goggles equipped

with side shields. People not so equipped must be

kept safely away while picture tubes are handled.

Keep the picture tube away from your body. Do not

handle the picture tube by its neck.

5. Hot Chassis Warning – a. Some TV receiver chassis

are electrically connected directly to one conductor of

the AC power cord and may be safely serviced

without an isolation transformer only if the AC power

plug is inserted so that the chassis is connected to the

ground side of the AC power source. Confirm that the

AC power plug is inserted correctly with an AC

voltmeter by measuring between the chassis and a

known earth ground. If a voltage reading in excess of

1.0V is obtained, remove and reinsert the AC power

plug in the opposite polarity and again measure the

voltage potential between the chassis and a known

earth ground. b. Some TV receiver chassis normally

have 85V AC (RMS) between chassis and earth

ground regardless of the AC plug polarity. These

chassis can be safely serviced only with an isolation

transformer inserted in the power line between the

receiver and the AC power source, for both personnel

and test equipment protection. c. Some TV receiver

chassis have a secondary ground system in addition

to the main chassis ground. This secondary ground

system is not isolated from theAC power line.The two

ground systems are electrically separated by

insulating material that must not be defeated or

altered.

6. Observe original lead dress. Take extra care to assure

correct lead dress in the following areas: a. near

sharp edges, b. near thermally hot parts – be sure

that leads and components do not touch thermally hot

parts, c. theAC supply, d. high voltage and e. antenna

wiring. Always inspect in all areas for pinched, out-of-

plate, or frayed wiring. Do not change spacing

between components and the printed circuit board.

Check AC power cord for damage.

7. Components, parts, and/or wiring that appear to have

overheated or are otherwise damaged should be

replaced with components, parts, or wiring that meet

original specifications. Additionally, determine the

cause of overheating and/or damage and, if

necessary, take corrective action to remove any

potential safety hazard.

8. PRODUCT SAFETY NOTICE – Many TV electrical

and mechanical parts have special safety-related

characteristics some of which are often not evident

from visual inspection, nor can the protection they

give necessarily be obtained by replacing them with

components rated for higher voltage, wattage, etc.

Parts that have special safety characteristics are

identified in Hitachi service data by shading on

schematics and by a in the parts list. Use of

substitute replacement that does not have the same

safety characteristics as the recommended replace-

ment part in Hitachi service data parts list might

create shock, fire, and/or other hazards. Product

safety is under review continuously and new

instructions are issued whenever appropriate. For the

latest information, always consult the appropriate

current Hitachi service literature. A subscription to, or

additional copies of service literature may be obtained

at a nominal charge from Hitachi.

CAUTION: Before servicing instruments covered by this

service data and its supplements and addenda, read and

follow the SAFETY PRECAUTIONS on page 3 of this

publication.

NOTE: If unforeseen circumstances create conflict between

the following servicing precautions and any of the safety

precautions on page 3 of this publication, always follow the

safety precautions. Remember: Safety First.

General Servicing Guidelines

1. Always unplug the instrumentAC power cord from theAC

power source before:

a. Removing or reinstalling any component, circuit

board, module, or any other instrument assembly.

b. Disconnecting or reconnecting any instrument

electrical plug or other electrical connection.

c. Connecting a test substitute in parallel with an

electrolytic capacitor in the instrument.

CAUTION: A wrong part substitution or incorrect

polarity installation of electrolytic

capacitors may result in an explosion

hazard.

d. Discharging the picture tube anode.

2. Test high voltage only by measuring it with an appropriate

high voltage meter or other voltage measuring device

(DVM, FETVOM, etc.) equipped with a suitable high

voltage probe. Do not test high voltage by “drawing an

arc.” The H.V. Distribution Box has an internal 400M!

resistor (bleeder resistor) connected from the high

voltage to ground. After power is removed from the

instrument the high voltage will discharge through the

high voltage bleeder resistor. If the tubes have high

voltage after power is removed, then the bleeder resistor

is defective or the bleeder ground is disconnected.

3. Discharge the picture tube’s anode at any of the R, G, or

B outputs on the H.V. Distribution Box only by (a) first

connecting one end of an insulated clip lead to the

degaussing or kine aquadag grounding system shield at

the point where the picture tube socket ground lead is

connected, and then (b) touch the other end of the

insulated clip lead to the picture tube high voltage

distribution box R, G, or B output, using an insulated

handle to avoid personal contact with high voltage.

4. Do not spray chemicals on or near this instrument or any

of its assemblies.

5. Unless specified otherwise in these service data, clean

electrical contracts by applying the following mixture to

the contacts with a pipe cleaner, cotton-tipped stick or

comparable nonabrasive applicator: 10% (by volume)

Acetone and 90% (by volume) isopropyl alcohol (90%-

99% strength).

CAUTION: This is a flammable mixture. Unless

specified otherwise in these service data,

lubrication of contacts is not required.

6. Do not defeat any plug/socket B+ voltage interlocks with

which instruments covered by this service data might be

equipped.

7. Do not apply AC power to this instrument and/or any of its

electrical assemblies unless all solid-state device heat-

sinks are correctly installed.

8. Always connect the test instrument ground lead to the

appropriate instrument chassis ground before connecting

the test instrument positive lead. Always remove the test

instrument ground lead last.

9. Use with this instrument only the test fixtures specified in

this service data.

CAUTION: Do not connect the test fixture ground strap

to any heatsink in this instrument.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged

easily by static electricity. Such components commonly are

called Electrostatically Sensitive (ES) Devices. Examples of

typical ES devices are integrated circuits and some field-

effect transistors and semiconductor “chip” components.The

following techniques should be used to help reduce the

incidence of component damage caused by static electricity.

1. Immediately before handling any semiconductor

component or semiconductor-equipped assembly, drain

off any electrostatic charge on your body by touching a

known earth ground. Alternatively, obtain and wear a

commercially available discharging wrist strap device,

which should be removed for potential shock reasons

prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES

devices, place the assembly on a conductive surface

such as aluminum foil, to prevent electrostatic charge

buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or

desolder ES devices.

4. Use only can anti-static type solder removal device.

Some solder removal devices not classified as “anti-

static” can generate electrical charges sufficient to

damage ES device.

5. Do not use freon-propelled chemicals. These can

generate electrical charges sufficient to damage ES

devices.

6. Do not remove a replacement ES device from its

protective package until immediately before you are

ready to install it. (Most replacement ES devices are

packaged with leads electrically shorted together by

conductive foam, aluminum foil or comparable conductive

material.)

7. Immediately before removing the protective material from

the leads of a replacement ES device, touch the

protective material to the chassis or circuit assembly into

which the device will be installed.

CAUTION: Be sure no power is applied to the chassis or

circuit, and observe all other safety

precautions.

8. Minimize bodily motions when handling unpackaged

replacement ES devices. (Otherwise harmless motion

such as the brushing together of your clothes fabric or the

lifting of your foot from a carpeted floor can generate

SERVICING PRECAUTIONS

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and

appropriate tip size and shape that will maintain tip

temperature within the range 500°F to 600°F.

2. Use an appropriate gauge of resin-core solder composed

of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well-tinned.

4. Thoroughly clean the surfaces to be soldered. Use a

small wire-bristle (0.5 inch or 1.25 cm) brush with a metal

handle. Do not use freon-propelled spray-on cleaners.

5. Use the following desoldering technique.

a. Allow the soldering iron tip to reach normal

temperature (500°F to 600°F).

b. Heat the component lead until the solder melts.

Quickly draw away the melted solder with an anti-

static, suction-type solder removal device or with

solder braid.

CAUTION: Work quickly to avoid overheating the

circuit board printed foil.

6. Use the following soldering technique.

a. Allow the soldering iron tip to reach normal

temperature (500°F to 600°F).

b. First, hold the soldering iron tip and solder strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of

the component lead and the printed circuit foil, and

hold it there only until the solder flows onto and

around both the component lead and the foil.

CAUTION: Work quickly to avoid overheating the

circuit board printed foil or components.

d. Closely inspect the solder area and remove any

excess or splashed solder with a small wire-bristle

brush.

Removal

1. Desolder and straighten each IC lead in one operation by

gently prying up on the lead with the soldering iron tip as

the solder melts.

2. Draw away the melted solder with an anti-static suction-

type solder removal device (or with solder braid) before

removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad

and solder it.

3. Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to areas.)

“Small-signal” Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as

close as possible to the component body.

2. Bend into a “U” shape the end of each of three leads

remaining on the circuit board.

3. Bend into a “U” shape the replacement transistor leads.

4. Connect to replacement transistor leads to the

corresponding leads extending from the circuit board and

crimp the “U” with long nose pliers to insure metal to

metal contact, then solder each connection.

Power Output Transistor Devices Removal/Replacements

1. Heat and remove all solder from around the transistor

leads.

2. Remove the heatsink mounting screw (if so equipped).

3. Carefully remove the transistor from the circuit board.

4. Insert new transistor in circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heatsink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as

possible to diode body.

2. Bend the two remaining leads perpendicularly to the

circuit board.

3. Observing diode polarity, wrap each lead of the new

diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints

of the two “original leads”. If they are not shiny, reheat

them and, if necessary, apply additional solder.

Use Solding Iron to Pry Leads

IC Removal/Replacement

Some Hitachi unitized chassis circuit boards have slotted

holes (oblong) through which the IC leads are inserted and

then bent flat against the circuit foil. When holes are the

slotted type, the following technique should be used to

remove and replace the IC. When working with boards using

the familiar round hole, use the standard technique as

outlined in paragraphs 5 and 6 above.

Fuses and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of circuit board

hollow stake.

2. Securely crimp leads of replacement component around

stake 1/8 inch from top.

3. Solder the connections.

CAUTION: Maintain original spacing between the

replaced component and adjacent

components and the circuit board, to

prevent excessive component

temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed

circuit board will weaken the adhesive that bonds the foil to

the circuit board, causing the foil to separate from, or “lift-

off,” the board. The following guidelines and procedures

should be followed whenever this condition is encountered.

In Critical Copper Pattern Areas

High component/copper pattern density and/or special

voltage/current characteristics make the spacing and

integrity of copper pattern in some circuit board areas more

critical than in others. The circuit foil in these areas is

designated as Critical Copper Pattern. Because Critical

Copper Pattern requires special soldering techniques to

ensure the maintenance of reliability and safety standards,

contact your Hitachi personnel.

At IC Connections

To repair defective copper pattern at IC connections, use the

following procedure to install a jumper wire on the copper

pattern side of the circuit board. (Use this technique only on

IC connections.)

1. Carefully remove the damaged copper pattern with a

sharp knife. (Remove only as much copper as absolutely

necessary.)

2. Carefully scratch away the solder resist and acrylic

coating (if used) from the end of the remaining copper

pattern.

3. Bend a small “U” in one end of a small-gauge jumper wire

and carefully crimp it around the IC pin. Solder the IC

connection.

4. Route the jumper wire along the path of the cut-away

copper pattern and let it overlap the previously scraped

end of the good copper pattern. Solder the overlapped

area, and clip off any excess jumper wire.

1. Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to ensure hazardous

condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both wire sides of

the pattern break and locate the nearest component

directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the

nearest component on one side of the pattern break to

the lead of the nearest component on the other side.

Carefully crimp and solder the connections.

CAUTION: Be sure the insulated jumper wire is

dressed so that it does not touch

components or sharp edges.

Frequency Synthesis (FS) Tuning Systems

1. Always unplug the instrument AC power cord before

disconnecting or reconnecting FS tuning system cables

and before removing or inserting FS tuning system

modules.

2. The FS tuner must never be disconnected from the FS

tuning control module while power is applied to the

instrument.

3. When troubleshooting intermittent problems that might be

caused by defective cable connection(s) to the FS tuning

system, remove the instrument AC power as soon as the

defective connector is found and finish confirming the

bad connection with a continuity test. This procedure will

reduce the probability of electrical overstress of the FS

system semi-conductor components.

CRIMP AND

SOLDER

BARE JUMPER

WIRE

Install Jumper Wire and Solder

DEFECTIVE

COPPER

REMOVED

Insulated Jumper Wire

At Other Connections

Use the following technique to repair defective copper

pattern at connections other than IC Pins. This technique

involves the installation of a jumper wire on the component

side of the circuit board.

Leadless Chip Components

(surface mount)

Chip components must be replaced with identical

chips due to critical foil track spacing. There are no

holes in the board to mount standard transistors or

diodes. Some chip capacitor or resistor board solder

pads may have holes through the board, however the

hole diameter limits standard resistor replacement to

1/8 watt. Standard capacitors may also be limited for

the same reason. It is recommended that identical

chip components be used. .

Chip resistors have a three digit numerical resistance

code -1st and 2nd significant digits and a multiplier.

Example: 162 = 1600 or 1.6KΩresistor, 0 = 0Ω

(jumper).

Chip capacitors generally do not have the value

indicated on the capacitor. The color of the component

indicates the general range of the capacitance.

Chip transistors are identified by a two letter code. The

first letter indicates the type and the second letter, the

grade of transistor.

Chip diodes have a two letter identification code as

per the code chart and are a dual diode pack with

either

common anode or common cathode. Check the parts

list for correct diode number.

Component Removal

1. Use solder wick to remove solder from component

end caps or terminals.

2. Without pulling up, carefully twist the component

with tweezers to break the adhesive.

3. Do not reuse removed leadless or chip

components since they are subject to stress

fracture during removal .

Chip Component Installation

1. Put a small amount of solder on the board

soldering pads.

2. Hold the chip component against the soldering

pads with tweezers or with a miniature alligator

clip and apply heat to the pad area with a 30 watt

iron until solder flows. Do not apply heat for more

than 3 seconds

How to Replace Flat-lC

—Required Tools—

• Soldering iron • iron wire or small awl

• De-solder braids • Magnifier

1. Remove the solder from all of the pins of a Flat-lC

by using a de-solder braid.

2. Put the iron wire under the pins of the Flat-lC and

pull it in the direction indicated while heating the

pins using a soldering iron. A small awl can be

used instead of the iron wire.

3. Remove the solder from all of the pads of the

Fiat-lC by using

a de-solder braid.

4. Position the new Flat-lC in place (apply the pins of

the Flat-lC to the soldering pads where the pins

need to be soldered). Properly

determine the positions of the

soldering pads and pins by

correctly aligning the polarity

symbol.

6. Check with a magnifier for solder bridge between

the pins or for dry joint between pins and soldering

pads. To remove a solder bridge, use a de-solder

braid as shown in the figure below.

NOTE:

These components are affixed with glue. Be careful not to break or damage any foil under the

component or at the pins of the ICs when removing. Usually applying heat to the component for a short

time while twisting with tweezers will break the component loose.

Chip Components

TYPE GRADE

SOLDER

CAPS

TRANSISTOR CAPACITOR

1ST DIGIT

2ND DIGIT

MULTIPLIER

= 1600 = 1.6K

ANODES

MH DIODE RESISTOR

SOLDER CAPS

COMMON CATHODE

De-Solder

Braid

Soldering

Iron

Soldering

Iron

Soldering

Iron

Soldering

Iron

Soldering

Iron

Soldering

Iron

De-Solder

Braid

Flat-IC

Bridge

Solder

De-Solder

Braid

Iron

Wire

Pull

Awl

Polarity Symbol

5. Solder all pins to the soldering pads using a fine

tipped soldering iron.

High Voltage limiter circuit operation check.

1. Turn off TV and connect jig as shown in Figure 2. Adjust

jig fully counter-clockwise for minimum resistance.

2. Set the AC input to 120V AC and turn on TV.

3. Confirm test pattern on CRT is a usable picture, then

slowly adjust jig until the picture disappears and TV shuts

down.

4. When the limiter circuit is operating properly, High

Voltage will be less than 31.5 kV at 1.7mAwhen TV shuts

down.

5. Turn off set immediately after checking circuit operation.

6. Unplug set for one minute to reset shutdown circuit.

Remove jig and voltmeter.

TECHNICAL CAUTIONS

TP91 CP16 IP04

Remove RH80 and connect 50KΩVR jig as shown.

?8!

@B^T

!<_=

<`Ma@GVa?Ya7!C`X%<M8 @BZZ

>TbcU@

Chassis ground

High impedance

H.V. meter

Deflection P.W.B.

FBT

(TH01)

High voltage

connector

Fig. 2. Deflection/Power P.W.B.

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