HopeRF CMT2310A Bedienungsanleitung

Features

Frequency range: 113 – 960 MHz

Modulation/demodulation: OOK, 2 (G)FSK, 4 (G)FSK

Data rate: 0.1 - 1000 kbps

Sensitivity: 2 FSK, -122 dBm DR=2.4 kbps, 433.92 MHz

4 FSK, -88 dBm DR=1 Mbps,433.92 MHz

OOK, -94 dBm DR= 300 kbps, 433.92 MHz

Adjacent channel rejection : 62 dBc, BW = 4.8 kHz,

Channel space = 12.5 kHz

Blocking: 76 dBc , ±1 MHz offset, BW = 4.8 kHz

Operating voltage range: 1.8 - 3.6 V

Tx current: 30 mA @ 13 dBm, 433.92 MHz, FSK

82 mA @ 20 dBm, 433.92 MHz, FSK

Rx current: 9.6 mA (DCDC) @433.92 MHz, FSK

No extra RF switching components required in single antenna mode

Multiple super-low power (SLP) Rx modes available

Sleep current

400 nA, Duty Cycle = OFF

800 nA, Duty Cycle = ON

Special features:

Quick and stable automatic frequency control (AFC)

3 varied clock data recovery systems (CDR)

Quick and accurate valid signal detection (PJD, RSSI)

Super-low power (SLP) and Duty Cycle receiving

Fast Tx or Rx frequency hopping

Carrier sense multiple access (CSMA)

Automatic ACK and re-sending

Antenna diversity

4-wire SPI interface

Supporting both direct and packet modes, with configurable

packet handler and 128-Byte FIFO

NRZ format, Manchester, whiten data coding, FEC

Application

Automatic meter reading

Home security and building automation

ISM-band data communication

Industrial monitoring and control

Remote control and security system

Remote key entry

Wireless sensor node

Tag reader and writer

Ordering Information

Product Model Frequency Package

Minimum

Order

CMT2310A-EQR 113 - 960 MHz QFN24 3,000 pcs

Refer to Table 22 for more ordering information.

Description

The CMT2310A is an ultra-low power, high-performance, OOK /

2(G)FSK / 4(G)FSK based RF transceiver, applicable to various

applications within the 113 - 960 MHz frequency band. The product

is part of the CMOSTEK NextGenRFTM product family which covers

a complete product line consisting of transmitters, receivers and

transceivers. The high-density integration of CMT2310A simplifies

the required BOM in system design. With Tx power reaching +20

dBm and sensitivity reaching -122 dBm, it can achieve optimized

performance of application RF links. Through providing multiple

data packet formats and code methods, this product ensures the

flexible supporting of various applications. Besides, the CMT2310A

provides functions such as 128-byte Tx/Rx FIFO, multiple GPIO

and interrupt configurations, Duty-Cycle mode, LBT (listen before

talk), high-precision RSSI, LBD, power on reset, low-frequency

clock output, quick frequency hopping, squelch, etc., which allows

more flexible application design and gains more product

differentiation capability.

High-performance Sub-1GHz RF Transceiver

CMT2310A Top View

QF24 (4X4)

CMT2310A

Table of Contents

1Electrical Specifications ........................................................................................................................................................................... 4

1.1 Recommended Operating Conditions .................................................................................................................................................. 4

1.2 Absolute Maximum Ratings ................................................................................................................................................................. 4

1.3 RF Power Consumption........................................................................................................................................................................ 4

1.4 Receiver ............................................................................................................................................................................................... 5

1.5 Transmitter .......................................................................................................................................................................................... 7

1.6 RF Frequency Synthesizer .................................................................................................................................................................... 8

1.7 Settling Time ........................................................................................................................................................................................ 8

1.8 Crystal Oscillator .................................................................................................................................................................................. 9

1.9 Low-frequency Oscillator ..................................................................................................................................................................... 9

1.10 Low Battery Detection ....................................................................................................................................................................... 10

1.11 Digital Interface.................................................................................................................................................................................. 10

1.12 Typical Parameter Chart..................................................................................................................................................................... 10

1.12.1 Rx Current Vs. Data rate ............................................................................................................................................................ 10

1.12.2 Rx Sensitivity Vs. Data rate ........................................................................................................................................................ 11

1.12.3 Tx Power Vs. Supply Power Voltage........................................................................................................................................... 11

1.12.4 Tx Phase Noise .......................................................................................................................................................................... 12

2Pin Descriptions..................................................................................................................................................................................... 13

3Typical Application Schematic................................................................................................................................................................ 14

3.1 Direct Tie Schematic Diagram ............................................................................................................................................................ 14

4Function Description ............................................................................................................................................................................. 17

4.1 Transmitter ........................................................................................................................................................................................ 18

4.2 Receiver ............................................................................................................................................................................................. 18

4.3 Additional Functions .......................................................................................................................................................................... 18

4.3.1 Power-On Reset (POR) .............................................................................................................................................................. 18

4.3.2 Crystal Oscillator ....................................................................................................................................................................... 19

4.3.3 Temperature Compensated Crystal Oscillator (TCXO)................................................................................................................... 19

4.3.4 Sleep Timer.................................................................................................................................................................................... 20

4.3.5 Low Battery Detection................................................................................................................................................................... 20

4.3.6 Received Signal Strength Indicator (RSSI) ...................................................................................................................................... 20

4.3.7 Phase Jump Detector (PJD)............................................................................................................................................................ 20

4.3.8 Automatic Frequency Control (AFC) .............................................................................................................................................. 21

4.3.9 Clock Data Recovery (CDR) ............................................................................................................................................................ 21

4.3.10 Fast Frequency Hopping ............................................................................................................................................................... 21

5Chip Operation ...................................................................................................................................................................................... 21

5.1 SPI Interface....................................................................................................................................................................................... 21

5.1.1 Read/Write Register.................................................................................................................................................................. 21

5.1.2 Read/Write Register in Batch Mode (BURST) ............................................................................................................................ 23

5.2 FIFO.................................................................................................................................................................................................... 24

5.2.1 FIFO Read Operation ..................................................................................................................................................................... 25

5.2.2 FIFO Associated Interrupt.............................................................................................................................................................. 25

5.3 Operation State, Timing and Power Consumption............................................................................................................................. 27

5.3.1 Startup Timing............................................................................................................................................................................... 27

5.3.2 Operation State ............................................................................................................................................................................. 27

5.4 GPIO and Interrupt ............................................................................................................................................................................ 30

6Data Packet and Packet Handler ............................................................................................................................................................ 33

6.1 Direct Rx Mode .................................................................................................................................................................................. 33

6.2 Packet Mode ...................................................................................................................................................................................... 33

6.2.1 Rx processing ............................................................................................................................................................................ 34

6.2.2 Tx processing............................................................................................................................................................................. 34

7Low Power Operating ............................................................................................................................................................................ 35

7.1 Duty Cycle Operating Mode............................................................................................................................................................... 35

7.2 Super-low Power (SLP) Rx Mode........................................................................................................................................................ 35

7.3 Rx Automatic Frequency Hopping (RX AUTO HOP) ............................................................................................................................ 37

7.4 TX Automatic Frequency Hopping (TX AUTO HOP) ............................................................................................................................ 38

7.5 Automatically Re-sending (TX AUTO RESEND) ................................................................................................................................... 39

7.6 Carrier Sensing Multi-path Accessing (CSMA).................................................................................................................................... 39

7.7 Antenna Diversity .............................................................................................................................................................................. 41

8User Register ......................................................................................................................................................................................... 43

9Ordering Information............................................................................................................................................................................. 44

10 Packaging Information...................................................................................................................................................................... 45

11 Top Marking ..................................................................................................................................................................................... 46

12 Revise History................................................................................................................................................................................... 47

13 Contacts ........................................................................................................................................................................................... 49

1 Electrical Specifications

The measurement conditions are: VDD= 3.3 V，TOP= 25 °C，FRF = 433.92 MHz, sensitivity is measured by receiving a PN9 sequence,

matching to 50 Ω impedance and 0.1% BER if nothing else stated. All measurement results are obtained using the evaluation board

CMT2310A-EM if nothing else stated.

1.1Recommended Operating Conditions

Table 1. Recommended Operating Conditions

Parameter Symbol Condition Min. Typ. Max. Unit

Operating supply voltage

VDD

1.8

3.6 V

Operating temperature

TOP

-40

85 ℃

Supply voltage slope

mV/us

1.2Absolute Maximum Ratings

Table 2. Absolute Maximum Ratings[1]

Parameter Symbol Condition Min. Typ. Max.

Supply voltage VDD

-0.3 3.6 V

Interface voltage VIN

-0.3 3.6 V

Junction temperature TJ

-40 125 ℃

Storage temperature TSTG

-50 150 ℃

Soldering temperature TSDR

Last for at least 30 seconds

Human body model (HBM)

255 ℃

ESD rating[2]

Human body model (HBM) -2 2 kV

Latch-up current

@ 85 ℃-100 100 mA

Notes:

[1]. Exceeding the Absolute Maximum Ratings may cause permanent damage to the equipment. This value is a pressure

rating and does not imply that the function of the equipment is affected under this pressure condition, but if it is exposed to

absolute maximum ratings for extended periods of time, it may affect equipment reliability.

[2]. The CMT2310A is a high performance RF integrated circuit. The operation and assembly of this chip should only be

performed on a workbench with good ESD protection.

1.3RF Power Consumption

Table 3. RF Power Consumption

Parameter Symbol Condition

Typ.

(Disable DCDC)

Typ.

(Enable DCDC)

Unit

Sleep current[1] ISLEEP

In sleep mode with sleep timer disabled 400 nA

In sleep mode with sleep timer enabled 800 nA

Ready current[1] IReady 2.1 1.9 mA

RFS current

[1]

IRFS

315 MHz

7.5

5.2

Caution! ESD sensitive device.Precaution should be used when handlingthe device in order to

prevent performance degradation or loss of functionality.

Parameter Symbol Condition

Typ.

(Disable DCDC)

Typ.

(Enable DCDC)

Unit

433 MHz

7.8

5.6

868 MHz

8.4

5.9

915 MHz

8.5

5.9

TFS current[1] ITFS

315 MHz

7.5

5.2

433 MHz

7.8

5.6

868 MHz

8.4

5.9

915 MHz

8.5

5.9

RX current [1] IRx DR = 10 kbps

Dev =10 kHz

315 MHz

13.5

8.8

433 MHz

13.6

9.4

868 MHz

14.3

9.9

915 MHz

14.3

9.9

TX current [1] ITx

20 dBm[2]

315 MHz

433 MHz

868 MHz

915 MHz

13 dBm [3]

315 MHz

26.7

433 MHz

868 MHz

915 MHz

10 dBm [3]

315 MHz

433 MHz

868 MHz

915 MHz

-10 dBm [3]

315 MHz

10.3

433 MHz

868 MHz

915 MHz

Notes:

[1]. 2FSK, DR = 10 kbps, FDEV = 5 kHz, Vbat = 3.3 V.

[2]. Apply 20 dBm matching network.

[3]. Apply 13 dBm matching network.

1.4Receiver

Table 4. Receiver Specifications

Parameter Symbol Condition Min. Typ. Max. Unit

Data rate DR

OOK 0.1 300 kbps

2 (G)FSK

0.1

500

kbps

4(GFSK 0.1 1000

kbps

Deviation (RX)

FDEV

(G)FSK, 4(G)FSK

[1]

0.5

350

kHz

Sensitivity

@ 433 MHz

(direct

tiematching

network)

S433

FSK[2]

DR = 2.4 kbps, FDEV = 1.2 kHz,BW= 4.8kHz -122

dBm

DR = 10 kbps,FDEV = 5 kHz -114

dBm

DR = 20 kbps, FDEV = 10 kHz -112

dBm

DR = 50 kbps, FDEV = 25 kHz

-109

dBm

DR =100 kbps, FDEV = 50 kHz -106

dBm

DR =200 kbps, FDEV = 100 kHz -104

dBm

DR =500 kbps, FDEV = 250 kHz

-98

dBm

OOK[2]

5 kbps -110

dBm

50 kbps -101 dBm

100 kbps

-97

dBm

200 kbps -95

dBm

Parameter

Symbol

Condition

Min.

Typ.

Max.

Unit

300 kbps -94

dBm

4FSK[2]

DR = 10 kbps, FDEV

[3]

= 10kHz

-109

dBm

DR = 100 kbps, FDEV[3] =100kHz -99

dBm

DR = 1 Mbps, FDEV[3] = 250 kHz -88 dBm

Sensitivity

@ 868 MHz

(direct tie

matching

network)

S868

FSK[2]

DR = 2.4 kbps, FDEV = 1.2 kHz, BW=4.8kHz

-120

dBm

DR = 10 kbps,FDEV = 5 kHz -111

dBm

DR = 20 kbps, FDEV = 10 kHz -110 dBm

DR = 50 kbps, FDEV = 25 kHz

-107

dBm

DR =100 kbps, FDEV = 50 kHz -104

dBm

DR =200 kbps, FDEV = 100 kHz -102 dBm

DR =500 kbps, FDEV = 250 kHz -96

dBm

OOK[2]

5 kbps -106

dBm

50 kbps

-98

dBm

100 kbps

-94

dBm

200 kbps -93

dBm

300 kbps

-92

dBm

4FSK[2]

DR = 10 kbps, FDEV[3] = 10kHz -106

dBm

DR = 100 kbps, FDEV[3] = 100kHz -96

dBm

DR = 1 Mbps, FDEV

[3]

= 250 kHz

-85

dBm

Notes:

[1]. BT = 0.5 by default for Gaussian modulation.

[2]. In case of unspecified BW value, a crystal of 10 ppm is used and the BW value is automatically calculated by RFPDK.

[3]. For 4 FSK, FDEV represents the frequency difference between the frequency points at the far ends (left and right) and the

centered frequency point.

Receiver

channel

bandwidth

BW Receiver channel bandwidth 1.3 1168 kHz

Saturation input

signal level PLVL 20 dBm

RSSI range RSSI By a step of 1 dB -127 20 dBm

Co-channel

rejection

@ 433 MHz，

868 MHz

CCR DR = 2.4 kbps; FDEV = 1.2 kHz;

BW=4.8 kHz

CW interference, BER<0.1% -7 dBc

Adjacent

channel

rejection

@ 433 MHz

ACR-

I433

DR = 2.4 kbps; FDEV = 1.2 kHz;

BW= 4.8 kHz, Channel Space = 12.5 kHz，

CW interference, BER<0.1% 62 dBc

Adjacent

channel

rejection

@ 868 MHz

ACR-

I868

DR = 2.4 kbps；FDEV = 1.2 kHz;

BW= 4.8 kHz, Channel Space = 12.5 kHz，

CW interference, BER<0.1% 56 dBc

Blocking

@ 433 MHz BI433 DR = 2.4 kbps; FDEV = 1.2 kHz;

BW=4.8 kHz,

CW interference, BER<0.1%

±1 MHz offset 76 dBc

±2 MHz offset 80 dBc

±10 MHz offset 84 dBc

Blocking

@ 868 MHz BI868 DR = 2.4 kbps; FDEV = 1.2 kHz;

BW=4.8 kHz,

CW interference, BER<0.1%

±1 MHz offset 66 dBc

±2 MHz offset 76 dBc

±10 MHz offset 83 dBc

Parameter

Symbol

Condition

Min.

Typ.

Max.

Unit

Image Rejection

@ 433 MHz IMR433 DR = 2.4 kbps; FDEV = 1.2 kHz;

BW=4.8 kHz

CW interference, BER<0.1%

Before calibration 30 dBc

After calibration 56 dBc

Image Rejection

@ 868 MHz IMR868 DR = 2.4 kbps; FDEV = 1.2 kHz;

BW=4.8 kHz

CW interference, BER<0.1%

Before calibration 26 dBc

After calibration 51 dBc

Input 3rd order

intercept point

@ 433 MHz

IIP3433 DR = 2.4 kbps; FDEV = 1.2 kHz;

two-tone test with 10 MHz and 20 MHz deviations. -13 dBm

Input 3rd order

intercept point

@ 868 MHz

IIP3868 DR = 2.4 kbps; FDEV = 1.2 kHz;

two-tone test with 10 MHz and 20 MHz deviations. -12 dBm

Receiver input

impedance Zin RXP and RXN

Differential input impedance

433MHz 150Ω// 0.8pF

868MHz 134Ω// 1.0pF

1.5Transmitter

Table 5. Transmitter Specifications

Parameter

Symbol

Condition

Min.

Typ.

Max.

Unit

Output power POUT Specific peripheral components are

required according to different frequency

bands.

-10 +20 dBm

Output power step PSTEP 1 dB

GFSK Gaussian filter

coefficient

BT 0.3 0.5 1.0 -

Output power change in

differenttemperature

POUT-TOP Temperature range: -40 to +85 °C 1 dB

Spurious emissions POUT = +13 dBm,433 MHz, FRF<1 GHz -54 dBm

1 GHz to 12.75 GHz, including Harmonic -36 dBm

Harmonic output[1]

for FRF= 315 MHz

H2315 2ndharmonic, +20 dBm POUT -57 dBm

H3315 3rd harmonic,+20 dBm POUT -75 dBm

Harmonic output[1]

for FRF= 433 MHz

H2433 2nd harmonic, +20 dBm POUT -56 dBm

H3433 3rd harmonic,+20 dBm POUT -71 dBm

Harmonic output[1]

for FRF= 868 MHz

H2868 2nd harmonic,+20 dBm POUT -47 dBm

H3868 3rd harmonic, +20 dBm POUT -72 dBm

Harmonic output[1]

for FRF= 915 MHz

H2915 2ndharmonic,+20 dBm POUT -47 dBm

H3915 3rd harmonic,+20 dBm POUT -73 dBm

Harmonic output[1]

for FRF= 315 MHz

H2315 2nd harmonic, +13 dBm POUT -51 dBm

H3315 3rd harmonic,+13 dBm POUT -72 dBm

Harmonic output[1]

for FRF= 433 MHz

H2433 2nd harmonic, +13 dBm POUT -44 dBm

H3433 3rd harmonic, +13 dBm POUT -58 dBm

Harmonic output[1]

for FRF= 868 MHz

H2868 2ndharmonic, +13 dBm POUT -50 dBm

H3868 3rd harmonic,+13 dBm POUT -71 dBm

Harmonic output[1]

for FRF= 915 MHz

H2915 2nd harmonic, +13 dBm POUT -54 dBm

H3915 3rd harmonic,+13 dBm POUT -73 dBm

Parameter Symbol Condition Min. Typ. Max. Unit

Notes:

[1]. The harmonic levelmainly depends on the quality of matching network. The parameters a

bove are measured based on

CMT2310A-EM.

1.6RF Frequency Synthesizer

Table 6. RF Frequency Synthesizer

Parameter Symbol Condition Min. Typ. Max. Unit

Frequency range FRF Require different matching networks.

675 960 MHz

338 640 MHz

113 320 MHz

Frequency deviation

range FDEV_RNG

[1]

675 ~ 960 MHz 600 kHz

450 ~ 640 MHz 400 kHz

338 ~ 450 MHz 300 kHz

225 ~ 320 MHz 200 kHz

169 ~ 225 MHz 150 kHz

135 ~ 169 MHz 120 kHz

113 ~ 135 MHz 100 kHz

Frequency resolution FRES 60 Hz

Frequency tuning time tTUNE 60 us

Phase noise

@ 433 MHz PN433

10 kHz Frequency Offset -101 dBc/Hz

100 kHz Frequency Offset -114 dBc/Hz

1MHz Frequency Offset -129 dBc/Hz

10 MHz Frequency Offset -134 dBc/Hz

Phase noise

@ 868 MHz PN868

10 kHz Frequency Offset -100 dBc/Hz

100 kHzFrequency Offset -109 dBc/Hz

1MHz Frequency Offset -126 dBc/Hz

10 MHz Frequency Offset -129 dBc/Hz

Notes:

[1]. For 2FSK and 4FSK, FDEV represents the frequency difference between the frequency points at the far ends (left and

right) and the centered frequency point.

1.7Settling Time

Table 7. Settling Time

Parameter

Symbol

Condition

Min.

Typ.

Max.

Unit

Settling time

TSLP-RX From Sleep to RX 660 us

TSLP-TX From Sleep to TX 660 us

TSTB-RX From Standby to RX 160

TSTB-TX From Standby to TX 160 us

TRFS-RX From RFS to RX 16 us

TTFS-RX From TFS to TX 16 us

TTX-RX From TX to RX

(Ramp down requires 2Tsymbol time)

2Tsymbol

+168

Parameter

Symbol

Condition

Min.

Typ.

Max.

Unit

TRX-TX From RX to TX 220 us

Notes:

[1]. TSLP-RX and TSLP-TX mainly depend on crystal oscillating, which is largely related to crystal itself.

1.8Crystal Oscillator

Table 8. Crystal Specification

Parameter Symbol Condition Min. Typ. Max. Unit

Crystal frequency

[1]

FXTAL

MHz

Crystal frequency precision

[2]

ppm_XTAL

100

ppm

Load resistance CLOAD_XTAL 15 pF

Crystal equivalent resistance

RmXTAL

Crystal startup time

[3]

tXTAL

200

Notes:

[1]. The CMT2310A can utilize external reference clock to directly drive XIN pin through the coupling capacitor. The peak-to-

peak value of external clock signal is required between 0.3 and 0.7 V.

[2]. It involves:(1) initial tolerance, (2) crystal loading, (3) aging, and (4) temperature changing. The acceptable crystal

frequency tolerance is subject to the bandwidth of the receiver and the RF tolerance between the receiver and its paired

transmitter.

[3]. This parameter is to a large degree crystal dependent.

1.9Low-frequency Oscillator

Table 9.Low-frequencyOscillatorSpecifications

Parameter

Symbol

Condition

Min.

Typ.

Max.

Unit

Calibration frequency

[1]

FLPOSC 32 kHz

Frequency accuracy

After calibration

±1

Temperature coefficient

[2]

-0.02 %/°C

Supply voltage coefficient

[3]

+0.5 %/V

Initial calibration time

tLPOSC-CAL

Notes:

[1].The low-frequency oscillator is automatically calibrated to the crystal oscillator frequency at the PUP stage.

[2].After calibration,the frequency will drift with temperature.

[3].After calibration,the frequency will drift with the change of the supply voltage.

1.10 Low Battery Detection

Table10. Low Battery Detection Specifications

Parameter

Symbol

Condition

Min.

Typ.

Max.

Unit

Detection accuracy

LBDRES

1.11 Digital Interface

Table 11. Digital Interface Specifications

Parameter

Symbol

Condition

Min.

Typ.

Max.

Unit

Digital input high level

Vdd-0.4

Digital input low level

VIL

0.2

VDD

Digital output high level

= -0.5 mA

Vdd-0.4

Digital output low level

= 0.5 mA

0.4

SCLK frequency

FSCL

MHz

SCLK high time

SCLK low time

SCLK rising edge time

TCR

SCLK falling edge time

1.12 Typical Parameter Chart

1.12.1 Rx Current Vs. Data rate

Test condition: Freq = 434 MHz, ppm = 10.

2.4 4.8 10 20 50 100 200 300 400 500

2 FSK : Current VS Data Rate

kbps

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