HP 7502 Montageanleitung

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Product End-of-Life Disassembly Instructions

Product Category: Networking Equipment

Marketing Name / Model

[List multiple models if applicable.]

HP 7502 Switch Chassis (JD242C)

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic

instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as

defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA) With a surface greater than 10 sq cm

Batteries All types including standard alkaline and lithium

coin or button style batteries 0

Mercury-containing components For example, mercury in lamps, display

backlights, scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm Includes background illuminated displays with

gas discharge lamps 0

Cathode Ray Tubes (CRT) 0

Capacitors / condensers (Containing PCB/PCT) 0

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height 0

External electrical cables and cords 0

Gas Discharge Lamps 0

Plastics containing Brominated Flame

Retardants weighing > 25 grams (not including

PCBs or PCAs already listed as a separate item

above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and

toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations. 0

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Components and waste containing asbestos 0

Components, parts and materials containing

refractory ceramic fibers 0

Components, parts and materials containing

radioactive substances 0

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where

components and materials requiring selective treatment can be removed.

Tool Description Tool Size (if

applicable)

Screw driver 2#

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective

treatment:

3.1.1 Guidance of treatments to the product:

Figure 1 Front of HP 7502

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Figure 2 Rear of HP 7502

1. Unscrew the screws on mounting angle 2, and then remove mounting angle 2;

2. Unscrew the screws on cabling rack 3, and then remove cabling rack 3 from mounting angle 2;

3. Unscrew the screws on front panel 4, and then remove front panel 4;

4. Unscrew the screws on front panel 5, and then remove front panel 5;

5. Unscrew the screws on blank panel 6, and then remove blank panel 6;

6. Unscrew the screws on power supply module 7, and then remove power supply module 7;

7. Unscrew the screws on blank panel 8, and then remove blank panel 8;

8. Unscrew the screws on blank panel 9, and then remove blank panel 9;

9. Unscrew the screws on fan module 10, and then remove fan module 10;

10. Remove film 11;

11. Unscrew the screws on rear cover plate 11, and then remove rear cover plate 11;

12. Unscrew the screws on protection cover 12, and then remove protection cover 12;

13. Unscrew the screws on protection box 13, and then remove protection box 13;

14. Unscrew the screws on rear cover plate 14, and then remove rear cover plate 14;

15. Unscrew the screws on PCB 15, and then remove PCB 15;

16. Remove all of the labels;

17. Remove all of shielding fingers.

3.1.2 Guidance of treatments to module 4:

Figure 3 Treatments to module 4

1. Unscrew the screws on PCB 4-2, and then remove PCB 4-2;

2. Remove shielding finger 4-3 from front panel 4-1;

3. Remove conductive foam 4-4 from front panel 4-1;

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4. Remove film 4-5 from front panel 4-1.

3.1.3 Guidance of treatments to module 5:

Figure 4 Treatments to module 5

1. Unscrew the screws on PCB 5-2, and then remove PCB 5-2;

2. Remove shielding finger 5-3 from front panel 5-1;

3. Remove film 5-4 from front panel 5-1.

3.1.4 Guidance of treatments to blank panel 6:

Figure 5 Treatments to blank panel 6

1. Remove shielding finger 6-2 from blank panel 6-1;

2. Remove film 6-3 from blank panel 6-1.

3.1.5 Guidance of treatments to blank panel 8

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Figure 6 Treatments to blank panel 8

1. Remove shielding finger 8-2 from blank panel 8-1.

3.1.6 Guidance of treatments to blank panel 9

Figure 7 Treatments to blank panel 9

1. Remove film 9-2 from blank panel 9-1;

2. Remove shielding finger 9-3 from blank panel 9-1.

3.1.7 Guidance of treatments to fan module 10

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Figure 8 Treatments to fan module 10

1. Remove the three fans 10-2 from fan frame 10-1;

2. Remove plug 10-3 from fan frame 10-1;

3. Remove the four wire mounts 10-4 from fan frame 10-1;

4. Unscrew the screws on PCB 10-5, and then remove PCB 10-5;

5. Remove shielding finger 10-6 from fan frame 10-1;

6. Unscrew the screws on handle 10-7, and then remove handle 10-7;

7. Remove film 10-8 from fan frame 10-1.

3.2 Material of the facility built

Facility Components Material Weight

(g) Weight

percentage Selective treatment for

materials and components Details

1 Fe 10411

50.46% Fe recycling

2 Fe 278

1.34% Fe recycling

3 ABS 22 0.10% Pla recycling

4-1 AL 767 3.71% Al recycling

4-2 Complex PWB 519 2.51% The surface of PCB is

greater than 10

square centimeters

5-1 Fe 1487 7.20% Fe recycling

5-2 Complex PWB 1000 4.84% The surface of PCB is

greater than 10

square centimeters

6-1 Fe 303 1.46% Fe recycling

7 Complex

PWB+Fe 2600 12.6% 1. Containing

brominated flame

retardants ;

2. The surface of

PCB is greater

than 10 square

centimeters;

3. Electrolyte

Fe recycling

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capacitor height

is more than 25

mm.

8-1 Fe 122 0.59% Fe recycling

9-1 Fe 156 0.75% Fe recycling

10-1 Fe 431 2.08% Fe recycling

10-2 Pla 98*3 1.42% Pla recycling

10-5 Complex PWB 35 0.16% The surface of PCB is

greater than 10

square centimeters

14 Fe 798 3.86% Fe recycling

15 Complex PWB 725 3.51% The surface of PCB is

greater than 10

square centimeters

cables 0404A068

04042967

0404A07J

04041104

Cu, Pla 682 3.30% 1. Containing

brominated

flame retardants

2. 04041104 is

external cables

Cu、Pla

recycling

4. Revised record

Date Version Author Modify content

2015.06.26 V0 Liao

Wenqing Initial version

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