HP MSR4060 Montageanleitung

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Product End-of-Life Disassembly Instructions

Product Category: Networking Equipment

Marketing Name / Model

[List multiple models if applicable.]

HP MSR4060 Router Chassis(JG403A)

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic

instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as

defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium

coin or button style batteries

Mercury-containing components

For example, mercury in lamps, display

backlights, scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or

PCAs already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and

toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

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radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where

components and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screw driver

tweezers

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective

treatment:

1. Unscrew the screws for mounting angle 1, and then remove the mounting angle 1 from the rack or cabinet.

2. Remove all of the labels.

3. Unscrew the screws on blank panel 2 and 3, and then remove the blank panel 2 and 3.

4. Remove shielding fingers 4.

5. Remove the part 5 and 6.

6. Remove shielding fingers 4.

7. Remove the part 7.

8. Unscrew the screws on part 8, then remove it.

9. Remove shielding fingers 4.

10. Unscrew the screws on panel 7.1, and then remove panel 7.1.

11. Unscrew the screws on panel 7.2, and then remove panel 7.2.

12. Remove shielding fingers 4.

13. Unscrew the screws on PCB 7.3, and then remove PCB 7.3.

14. Unscrew the screws on panel 7.4, and then remove panel 7.4.

15. Unscrew the screws 7.5, and then remove handle 7.5.

16. Remove shielding fingers 4.

17. Unscrew the screws on panel 7.4.1, and then remove fan 7.4.2.

18. Unscrew the screws on part 8.1, and then remove PCB 8.2.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations)

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Figure 1 Remove mounting angle Figure 2 Treatments to the blank panel

Figure 3 Treatments to the product Figure 4 Treatments to the product

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Figure 5 Treatments to fan-assembly Figure 6 Treatments to the fan-assembly

Figure 7 Treatments to fan-assembly Figure 8 Treatments to fan-assembly

Figure 9 Treatments to fan-assembly Figure 10 Treatments to PCB-assembly

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3.3 Material of the facility built

Facility

Components

Material

Weight(g)

Weight percentage

Selective treatment for materials

and components

Details

269

1.69%

Fe recycling

59.6*10

3.76%

Fe recycling

95.8*2

1.21%

Fe recycling

Be-Cu

8.9

0.06%

Cu recycling

176.1

1.11%

Fe recycling

341.2*2

4.30%

Fe recycling

7.1

45.5

0.29%

Fe recycling

7.2

204.5

1.29%

Fe recycling

7.3

Complex PCB

0.16%

The surface of PCB is greater

than 10 square centimeters;

7.4

7.4.1

45.5*4

1.14%

Fe recycling

7.4.2

PBT , Cu

190*4

4.79%

Containing brominated flame

retardants;

7.5

37.5

0.23%

Fe recycling

7.6

682.1

4.30%

Fe recycling

8.1

125

0.79%

Fe recycling

8.2

Complex PCB

800

5.04%

The surface of PCB is greater

than 10 square centimeters;

11085.3

69.84%

Fe recycling

3.4 List the basic steps that should typically be followed to remove components and materials requiring selective

treatment:

1. Clear the yellow adhesive, if had, by the tweezers.

2. Pry the button battery up from socket.

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3.5 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations)

Figure 11 Clear the yellow adhesives by the tweezers.

Figure 12 Pry up the button battery

4.0 Revised record

Date

Version

Author

Modify content

2012.12.10

Cheng Wei

Initial version

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