HP 82718A Bedienungsanleitung
HP
82718A
Expansion
Pod
Service
Manual
WKSl
HEWLETT
WmM
PACKARD
m
HEWLETT
PACKARD
HP
82718A
Expansion
Pod
Service
Manual
Reorder
Number
Printed
In U.S.A.
82718-90006
®/84
Contents
Section
Page
1
Product
Information
1-1
Introduction
1-1
1-2
Description
1-1
1-3
Specifications
1-2
1-4
Identification
1-2
2
Installation
2-1
Introduction
2-1
2-2
Preparation
2-1
2-3
Functional
Verification
2-3
3
Functional
Description
3-1
Introduction
3-1
3-2
The
Memory
Management
IC
(MEMIC,
1LH7)
3-1
3-3
ROM
ICs
:
3-2
3-4
Modem
Controller
Circuitry
3-2
3-5
Power
Supply
3-2
3-6
Jumpers
3-3
4
Removal
and
Replacement
4-1
Introduction
4-1
4-2
Required
Tools 4-1
4-3
Disassembly
Procedure
4-1
4-4
To
remove
the
power
PCA:
4-2
4-5
To
remove
the
modem
PCA:
4-4
4-6
To
remove
the
ROM
connector:
4-4
4-7
Reassembly
Procedure
4-4
4-8
To
reassemble
the
ROM
connector:
4-5
4-9 Td
reassemble
the
power
PCA:
4-6
5
Troubleshooting
and
Diagnostics
5-1
Introduction
5-1
5-2
Required
Tools 5-2
5-3
Initial
Preparation
5-2
5-4
Test
Procedures
5-2
6
Replaceable
Parts
6-1
Introduction
6-1
6-2
Ordering
Information
6-1
7
Diagrams
7-1
Introduction
7-1
A
Appendix
A
A-1
Introduction
A-1
B
Appendix
B
B-1
Introduction
B-1
HP82718A
„
Contents
iii
Illustrations
Figure
Title
2-1
2-2
2-3
3-1
End-Retainer
Screws
2-1
HP-75
Installation
2-2
Batteries Installed in the
Pod
2-2
HP
82718A
Block
Diagram
3.]^
4-1
Bottom-Case
and
End-Retainer
Screws
and
Battery
Compartment
4-2
4-2
"
4-3
4-4
4-5
Power-PCA
Mounting
Screws
4.2
Disconnecting
the
Modem
Flex
Cahle
4.3
ROM-Connector-Shield
Screws
4.3
Modem
PCA,
Modular
Jacks,
andI/O
Panel
4.4
4-6
ROM-Connector
Cable
Strain-Relief
Bar and
Connector
4-4
4-7
ROM-Connector
Test
Setup
4.5
4-8
Installing the
ROM-connector
Shield
Screws
4-6
4-9.
I/O-Panel Installation 4.3
4-10
Installingthe
PCAs
4.7
4-11
Securing
the
ROM-Connector
Shield
4.7
6"! HP
82718A
Expansion
Pod
Exploded
View
0.3
6-2
Component-Location
Diagram
3.5
7-1
Power
PCA,
Electronic-Disc
Schematic
7.3
"^"2
Power
PCA,
Modem-Interface
Schematic
7.5
7-3
Power
PCA,
Power-Supply
Schematic
7.7
Tables
Table
Title Page
1-1 Specifications
3^.2
4-1 Required
TdoIs
4.]^
5-1 Required
Tools
5.2
5-2 The HP-75 Does Not
Tirn
On 5.3
5-3 Power Supply
Voltages
5.4
5-4 The HP-75 Tbrns On 5.4
6-1 Replaceable Parts,
Assembly
Level 6-1
6-2 Replaceable Parts, Component-Level 6-4
A-1
Diagnostic
Tfest
Error
Messages
A-1
About
This
Manual—
This
manual
contains
the
information
you
will
need
to
service
the HP
82718A
Expansion
Pod.
You
should
read
this
manual
through
once
completely
before
attempting
any
repairs,
as
some
steps
assume
a
prior knowledge of other steps
and
cautions.
The manual contains the following seven sections:
•
Section
1-
Product
Information.
This
section
gives
a
general
overview
of
the
pod
as
well
asits
phys
ical
and
electrical specifications.
•
Section
2 -
Installation.
This
section
tells
how
to
prepare
the
pod
for
use
and
how
to
verify
its
func
tional
operation.
•
Section
3-
Functional
Description.
This
section
gives
a
brief
description
of
the
functions
ofthe
major
blocks in
the
pod.
•
Section
4 -
Removal
and
Replacement.
This
section
tells
how
to
remove
and
replace
pod
assemblies.
Section
5 -
Troubleshooting
and
Diagnostics.
This
section
tells
how
to
troubleshoot
and
repair
the
pod.
•
Section
6 -
Replaceable
Parts. This
section
lists the
replaceable
parts and
contains
an
exploded
view
and component location diagram of the pod.
Section 7 - Diagrams. This section contains the schematic drawings of the pod.
Appendix
Acontains
component-level
repair information, and
appendix
Bcontains listings of the
diagnostic
ROM
programs.
The tools and test equipment required to
service
the pod are listed in tables 4-1and
5-1
on
pages
4-1
and
5-2
respectively.
Section
1
Product
Information
1-1.
Introduction
This section provides an overview of the HP
82718A
Expansion Pod.
The podis a portable, battery-operated
accessory
forthe HP-75C/Dcomputer; it adds
two
enhancements
to the computerthat are valuable for RDDP (remotedata distributed processing) applications: an integral
direct-connect
modem
and
extended
memory.
1-2.
Description
The
300
baud
modem
has
the
following
features:
•Bell 103-compatible originate/answer.
• Two
RJllC
direct-connect
jacks.
•Automatic reporting of call failure, commimications estabished, and loss of communications.
•
Automatic
call
answering.
•
Automatic
disconnect
on
call
failure
or
loss
of
communications.
•
Automatic
dialer
(pulse,
tone).
The
modem
is controlled by its
own
MPU
(microprocessing
unit) and
associated
circuitry.
Low-level
modem
commands
are
included
in
4K
bytes
of
ROM.
Up
to
64K
bytes
of
extended
electronic
disc
memory
can
be
installed
inthe
pod
in
increments
of
8K
bytes.
Standard configurations are 24K-, 32K-, and 64K hytes.
High-level
modem
and
electronic-disc
commands
are
included
in
16K
bjrtes
of
ROM
that
are
identical
to
the
HP-75
plug-in ROMs.
The
pod
connects
directly
tothe
HP-75
bus
through
the
right-hand
front
ROM
port
and
is
controlled
by
a
memory-management IC (integrated circuit).
The
two
battery
packs
inthe
pod
provide
power
for
both
the
pod
and
the
HP-75.
They
can
be
recharged
by
plugging
an ac adapter into the
HP-75
while
it is installedin the
pod.
1-2
Product
Information
1-3.
Specifications
Equipment
specifications
are
shown
in
table
1-1.
Table
1-1.
Specifications
Physical
•
Dimensions
(HP-75
plus
pod): 29.2 cm by 16.5 cm by 6.4 cm (11.5" by 6.5" by 2.5")
•Weight
(HP-75
plus
pod): 1.60 kilograms (56.5 ounces)
Electrical
• 175
milliamps
(max)
at
5.2
to
5.5 Vdc.
Environmental
•
Operating
temperature:
0 to
+45°C
(32° to 113°F).
•
Storage
temperature:
-40° to -f-55°C (-40° to 131°F).
•
Recharging
temperature:
-1-10°
to
-}-40°C (50°
to
104°F).
HP
82718A
1-4.
Identification
The
serial
number
of
the
HP
82718A is
used
for
identification
and
the
determination
of
warranty
status.
It
is
located
on
the
bottom
overlay.
Its
format
is
described
below.
Y Y W W
n K
A
B
Q
S
X X X X X
Sequence
number.
Location
manufactured:
A=U.S.A.
Week
manufactured
-f
8.
Year
manufactured
(Years
since
1960)
Number
of
bytes
of RAM installed.
Section
2
Installation
2-1.
Introduction
This
section
tells
you
how
to prepare
your
HP
82718A
Expansion
Podforuseand
how
to
verify
its
func
tional
operation.
2-2.
Preparation
To prepare your pod for operation, do the following:
a. If the end retainersare in
place,
remove
them by
unscrewing
the six long
screws
in the bottom
case.
Figure
2-1.
End
Retainer
Screws
b.
Be
sure
the
HP-75
is
turned
off.
c. Remove
the
battery
pack
from
the
HP-75.
2-2
Installation
HP
82718A
d.
Install
the
HP-75
in
the
pod
by plugging in
the
ROM
connector, placing
the
HP-75
on
the
top
case,
and
installing
the
end
retainers.
ROM
Connector
Figure
2-2.
HP-75
Installation
e.
Install
charged
batteries
and
the
battery
door in
the
pod.
'
Figure
2-3.
Batteries
Installed
in
the
Pod
f. Remove a dummy ROM if present from either of
the
other two ports in
the
HP-75
and
install a pod
diagnostic
ROM.
Installation
2-3
2-3.
Functional
Verification
Tb
verify
the
functional
operation
of
the
pod,
do
the
following:
a.
Press
Iattn
I.
The
HP-75
should
turn
on.
If it
doesn't,
go
to
table
5-2.
b.
If
the
HP-75
turns
on,
go
into
the
edit
mode
(press
rEPirl).
type
in
RUN
"P"
and
press
fWrNl.
The
pod
test
program
runs.
(You
will
need
to
press
I
EDIT
I
twice
if
this
isa
cold
start.)
c.
If
the
unit
is
good,
various
messages
are
displayed,
and
then
"pod
OK
(nn)"
is
displayed,
where
nn
corresponds
to
the
number
ofK
bytes
of
installed
RAM
as
indicated
on
the
pod
label.
In
case
an
error
message
is displayed, refer to section 5 for analysis of the results.
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