HP 82718A Bedienungsanleitung

82718A

Expansion

Pod

Service

Manual

WKSl

HEWLETT

WmM

PACKARD

HEWLETT

PACKARD

82718A

Expansion

Pod

Service

Manual

Reorder

Number

Printed

In U.S.A.

82718-90006

®/84

Contents

Section

Page

Product

Information

1-1

Introduction

1-1

1-2

Description

1-1

1-3

Specifications

1-2

1-4

Identification

1-2

Installation

2-1

Introduction

2-1

2-2

Preparation

2-1

2-3

Functional

Verification

2-3

Functional

Description

3-1

Introduction

3-1

3-2

The

Memory

Management

(MEMIC,

1LH7)

3-1

3-3

ROM

ICs

3-2

3-4

Modem

Controller

Circuitry

3-2

3-5

Power

Supply

3-2

3-6

Jumpers

3-3

Removal

and

Replacement

4-1

Introduction

4-1

4-2

Required

Tools 4-1

4-3

Disassembly

Procedure

4-1

4-4

remove

the

power

PCA:

4-2

4-5

remove

the

modem

PCA:

4-4

4-6

remove

the

ROM

connector:

4-4

4-7

Reassembly

Procedure

4-4

4-8

reassemble

the

ROM

connector:

4-5

4-9 Td

reassemble

the

power

PCA:

4-6

Troubleshooting

and

Diagnostics

5-1

Introduction

5-1

5-2

Required

Tools 5-2

5-3

Initial

Preparation

5-2

5-4

Test

Procedures

5-2

Replaceable

Parts

6-1

Introduction

6-1

6-2

Ordering

Information

6-1

Diagrams

7-1

Introduction

7-1

Appendix

A-1

Introduction

A-1

Appendix

B-1

Introduction

B-1

HP82718A

„

Contents

iii

Illustrations

Figure

Title

2-1

2-2

2-3

3-1

End-Retainer

Screws

2-1

HP-75

Installation

2-2

Batteries Installed in the

Pod

2-2

82718A

Block

Diagram

3.]^

4-1

Bottom-Case

and

End-Retainer

Screws

and

Battery

Compartment

4-2

4-3

4-4

4-5

Power-PCA

Mounting

Screws

4.2

Disconnecting

the

Modem

Flex

Cahle

4.3

ROM-Connector-Shield

Screws

4.3

Modem

PCA,

Modular

Jacks,

andI/O

Panel

4.4

4-6

ROM-Connector

Cable

Strain-Relief

Bar and

Connector

4-4

4-7

ROM-Connector

Test

Setup

4.5

4-8

Installing the

ROM-connector

Shield

Screws

4-6

4-9.

I/O-Panel Installation 4.3

4-10

Installingthe

PCAs

4.7

4-11

Securing

the

ROM-Connector

Shield

4.7

6"! HP

82718A

Expansion

Pod

Exploded

View

0.3

6-2

Component-Location

Diagram

3.5

7-1

Power

PCA,

Electronic-Disc

Schematic

7.3

"^"2

Power

PCA,

Modem-Interface

Schematic

7.5

7-3

Power

PCA,

Power-Supply

Schematic

7.7

Tables

Table

Title Page

1-1 Specifications

3^.2

4-1 Required

TdoIs

4.]^

5-1 Required

Tools

5.2

5-2 The HP-75 Does Not

Tirn

On 5.3

5-3 Power Supply

Voltages

5.4

5-4 The HP-75 Tbrns On 5.4

6-1 Replaceable Parts,

Assembly

Level 6-1

6-2 Replaceable Parts, Component-Level 6-4

A-1

Diagnostic

Tfest

Error

Messages

A-1

About

This

Manual—

This

manual

contains

the

information

you

will

need

service

the HP

82718A

Expansion

Pod.

You

should

read

this

manual

through

once

completely

before

attempting

any

repairs,

some

steps

assume

prior knowledge of other steps

and

cautions.

The manual contains the following seven sections:

•

Section

Product

Information.

This

section

gives

general

overview

the

pod

well

asits

phys

ical

and

electrical specifications.

•

Section

2 -

Installation.

This

section

tells

how

prepare

the

pod

for

use

and

how

verify

its

func

tional

operation.

•

Section

Functional

Description.

This

section

gives

brief

description

the

functions

ofthe

major

blocks in

the

pod.

•

Section

4 -

Removal

and

Replacement.

This

section

tells

how

remove

and

replace

pod

assemblies.

Section

5 -

Troubleshooting

and

Diagnostics.

This

section

tells

how

troubleshoot

and

repair

the

pod.

•

Section

6 -

Replaceable

Parts. This

section

lists the

replaceable

parts and

contains

exploded

view

and component location diagram of the pod.

Section 7 - Diagrams. This section contains the schematic drawings of the pod.

Appendix

Acontains

component-level

repair information, and

appendix

Bcontains listings of the

diagnostic

ROM

programs.

The tools and test equipment required to

service

the pod are listed in tables 4-1and

5-1

pages

4-1

and

5-2

respectively.

Section

Product

Information

1-1.

Introduction

This section provides an overview of the HP

82718A

Expansion Pod.

The podis a portable, battery-operated

accessory

forthe HP-75C/Dcomputer; it adds

two

enhancements

to the computerthat are valuable for RDDP (remotedata distributed processing) applications: an integral

direct-connect

modem

and

extended

memory.

1-2.

Description

The

300

baud

modem

has

the

following

features:

•Bell 103-compatible originate/answer.

• Two

RJllC

direct-connect

jacks.

•Automatic reporting of call failure, commimications estabished, and loss of communications.

•

Automatic

call

answering.

•

Automatic

disconnect

call

failure

loss

communications.

•

Automatic

dialer

(pulse,

tone).

The

modem

is controlled by its

own

MPU

(microprocessing

unit) and

associated

circuitry.

Low-level

modem

commands

are

included

bytes

ROM.

64K

bytes

extended

electronic

disc

memory

can

installed

inthe

pod

increments

bytes.

Standard configurations are 24K-, 32K-, and 64K hytes.

High-level

modem

and

electronic-disc

commands

are

included

16K

bjrtes

ROM

that

are

identical

the

HP-75

plug-in ROMs.

The

pod

connects

directly

tothe

HP-75

bus

through

the

right-hand

front

ROM

port

and

controlled

memory-management IC (integrated circuit).

The

two

battery

packs

inthe

pod

provide

power

for

both

the

pod

and

the

HP-75.

They

can

recharged

plugging

an ac adapter into the

HP-75

while

it is installedin the

pod.

1-2

Product

Information

1-3.

Specifications

Equipment

specifications

are

shown

table

1-1.

Table

1-1.

Specifications

Physical

•

Dimensions

(HP-75

plus

pod): 29.2 cm by 16.5 cm by 6.4 cm (11.5" by 6.5" by 2.5")

•Weight

(HP-75

plus

pod): 1.60 kilograms (56.5 ounces)

Electrical

• 175

milliamps

(max)

5.2

5.5 Vdc.

Environmental

•

Operating

temperature:

0 to

+45°C

(32° to 113°F).

•

Storage

temperature:

-40° to -f-55°C (-40° to 131°F).

•

Recharging

temperature:

-1-10°

-}-40°C (50°

104°F).

82718A

1-4.

Identification

The

serial

number

the

82718A is

used

for

identification

and

the

determination

warranty

status.

located

the

bottom

overlay.

Its

format

described

below.

Y Y W W

n K

X X X X X

Sequence

number.

Location

manufactured:

A=U.S.A.

Week

manufactured

-f

Year

manufactured

(Years

since

1960)

Number

bytes

of RAM installed.

Section

Installation

2-1.

Introduction

This

section

tells

you

how

to prepare

your

82718A

Expansion

Podforuseand

how

verify

its

func

tional

operation.

2-2.

Preparation

To prepare your pod for operation, do the following:

a. If the end retainersare in

place,

remove

them by

unscrewing

the six long

screws

in the bottom

case.

Figure

2-1.

End

Retainer

Screws

sure

the

HP-75

turned

off.

c. Remove

the

battery

pack

from

the

HP-75.

2-2

Installation

82718A

Install

the

HP-75

the

pod

by plugging in

the

ROM

connector, placing

the

HP-75

the

top

case,

and

installing

the

end

retainers.

ROM

Connector

Figure

2-2.

HP-75

Installation

Install

charged

batteries

and

the

battery

door in

the

pod.

Figure

2-3.

Batteries

Installed

the

Pod

f. Remove a dummy ROM if present from either of

the

other two ports in

the

HP-75

and

install a pod

diagnostic

ROM.

Installation

2-3

2-3.

Functional

Verification

verify

the

functional

operation

the

pod,

the

following:

Press

Iattn

The

HP-75

should

turn

on.

If it

doesn't,

table

5-2.

the

HP-75

turns

on,

into

the

edit

mode

(press

rEPirl).

type

RUN

"P"

and

press

fWrNl.

The

pod

test

program

runs.

(You

will

need

press

EDIT

twice

this

isa

cold

start.)

the

unit

good,

various

messages

are

displayed,

and

then

"pod

(nn)"

displayed,

where

corresponds

the

number

ofK

bytes

installed

RAM

indicated

the

pod

label.

case

error

message

is displayed, refer to section 5 for analysis of the results.

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