HP A58 0AF Series Montageanleitung

Product End-of-Life Disassembly Instructions

Product Category : Networking Equipment

Marketing Name / Model

[List multiple models if applicable.]

HP A58x0AF 650W AC Power Supply(JC680A)

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA) With a surface greater than 10 sq cm

Batteries All types including standard alkaline and lithium coin

or button style batteries 0

Mercury-containing components For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries 0

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm Includes background illuminated displays with gas

discharge lamps 0

Cathode Ray Tubes (CRT) 0

Capacitors / condensers (Containing PCB/PCT) 0

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height 3

External electrical cables and cords 0

Gas Discharge Lamps 0

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent

chambers, and service stations. 0

Components and waste containing asbestos 0

Components, parts and materials containing

refractory ceramic fibers 0

Components, parts and materials containing

radioactive substances 0

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description Tool Size (if

applicable)

Cross screw driver 6*300mm

Soldering station Common

Pliers Medium

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove all external screws from power supply.(typically 13 screws).

2. Remove top case from power supply.

3. Remove two screws holding PCB to bottom case.(Remove bottom case).

4. Remove socket and mylar film from case and PCBs.

5. Remove four screws holding fan and two fan cases.(Top case and bottom case).

6. Remove fan and leave PCBs.

7. Use soldering station and pliers for remove wires.

8. Remove eleven screws holding semiconductors to heat sinks.(Remove heat sinks)

9. Remove seven inductances and two transformers for PCBs.

10. Use soldering station remove five electrolytic capacitors from PCBs.(height=30mm(3) and height=25mm(2)).

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 2

Template Revision B

PSG instructions for this template are available at EL-MF877-01

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