HP ProCurve MSM765zl Montageanleitung

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Product End-of-Life Disassembly Instructions

Product Category: Networking Equipment

Marketing Name / Model

[List multiple models if applicable.]

HP ProCurve MSM765zl Mobility Controller / J9370A

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

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Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Torx Screw Drivers

T-6, T-8, T-

10, Box type

Phillips Screw Driver

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Using the Phillips screw driver, removes the 4 Phillips screw attaching the hard drive to the PCA.

2. Remove the 4 screws that attached the brackets to the hard drive using a T-8 screwdriver.

3. Remove the solder-anchor heatsink (towards right of PCA when looking from front) by releasing the catch from the 2

anchors.

4. Remove the 5 screws that attached the Com-E module onto the PCA using the Boxtype Torx screwdriver. Refer to

pic.1

5. Remove another 1 screw,using the Boxtype Torx screwdriver, as shown in Pic 2 to completely remove the Com-E

module from the PCA.

6. Remove the 4 screws that attached the heatsink onto the PCA using the T-10 Torx screwdriver. Refer to pic. 3

7. Remove the guide pin by using a T-10 Torx screwdriver to remove the 1 screw that attached the guide pin to the PCA.

8. Remove the bulkhead by removing the 5 screws securing the bulkhead onto the PCA. Remove 3 screws using the T-6

screwdriver and another 2 screws (towards right of PCA, when looking from front) using the T-10 screwdriver.

9. Remove two screws and springs on the bulkhead

10. Remove the insert label in the front pocket of the bulkhead

11. Remove the CF card on the PCA.

12.

13.

14.

15.

16.

17.

18.

19.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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